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强力新材2026-2027年半导体及先进封装材料产线建设计划披露
Jing Ji Guan Cha Wang· 2026-02-14 01:46
Company Project Progression - Strongly New Materials (300429) plans to launch several production lines between 2026 and 2027, focusing on semiconductor materials and advanced packaging [1][2] - In 2026, the company will begin mass production of KrF photoresist materials and related components, with partners including SMIC and Yangtze Memory Technologies [1] - The first phase of the semiconductor mask production line (130-40nm) is set to be fully operational in 2026, while the second phase (40-28nm) will start construction in the same year [1] - The first phase of advanced packaging materials (PSPI) with an annual capacity of 259 tons is expected to be launched in 2026, having already passed validation by Shenghe Jingwei and integrated into Huawei's Ascend supply chain [1] - PCB photoresist and semiconductor-grade PAG from the Nantong base will reach full production in 2026, while environmentally friendly photoresists and UV-LED resin from the Changzhou base are also planned for 2026 [1] Future Developments - In 2027, the second phase of the semiconductor mask production line (40-28nm) is expected to be completed and operational [2] - The second phase of advanced packaging materials (PSPI) with an annual capacity of 136.2 tons is planned for 2027, increasing total capacity to 395.2 tons per year [3] - OLED materials, through a joint venture with Strongly Yulei, aim for mass production of HT/ET organic light-emitting materials in 2027, with a collaborative evaluation laboratory established with LG Chem [3] - The release of these capacities is highly dependent on customer validation results, particularly for PSPI, KrF photoresist, and mask products [3] - 2026 is characterized as a year of concentrated capacity release for semiconductor materials and advanced packaging, while 2027 will focus on advanced processes of 28nm and above, as well as the OLED sector [3]