Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are identified as key growth areas, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article outlines various advanced packaging materials and their projected market sizes, indicating significant growth potential in areas like conductive adhesives, chip bonding materials, and epoxy encapsulants [8]. - For instance, the conductive adhesive market is expected to reach 3 billion yuan by 2026, while the epoxy encapsulant market is projected to grow to 99 million USD by 2027 [8]. Competitive Landscape - The article lists both domestic and international players in the advanced packaging materials market, emphasizing the competitive nature of the industry [8]. - Companies such as Fujifilm, Toray, and domestic firms like Dinglong Co. and Guofeng New Materials are highlighted as key competitors [8]. Investment Strategies - Different investment stages in the new materials industry are discussed, with a focus on the importance of team assessment, industry analysis, and market entry strategies [10]. - The article suggests that early-stage investments carry high risks but can yield significant returns if the right resources and teams are in place [10].

| | | 常州强力电子新材料股份有限公司 关于为全资子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、担保情况概述 常州强力电子新材料股份有限公司（以下简称"公司"）于 2025 年 4 月 28 日召开了第五届董事会第十六次会议及第五届监事会第八次会议，会议审议通过 了《关于公司及子公司、孙公司银行综合授信提供相互担保的议案》。为满足公 司及控股子公司、孙公司日常经营活动需要，公司及控股子公司、孙公司向银行 申请综合授信额度提供相互担保，担保总金额不超过 12 亿元人民币，担保期限 12 个月，自公司 2024 年年度股东大会审议通过之日起算。具体内容详见公司于 2025 年 4 月 29 日在巨潮资讯网（www.cninfo.com.cn）上披露的《关于公司及 子公司、孙公司银行综合授信提供担保的公告》（公告编号：2025-014）。2025 年 5 月 23 日，该议案已经公司召开的 2024 年年度股东大会审议通过。 二、担保的进展情况 公司全资子公司常州强力先端电子材料有限公司（以下简称"强力先端"）、 常州强力光电材料 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign suppliers in critical sectors [7][8]. Group 1: Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and conductive adhesives are identified as key growth areas, with PSPI's market size in China expected to increase from 7.12 billion yuan in 2021 to 9.67 billion yuan by 2025 [8]. Group 2: Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, indicating significant investment potential in sectors like semiconductor materials and new display materials [8]. - Companies such as 鼎龙股份, 国风新材, and 三月科 are highlighted as domestic players poised to benefit from the shift towards local sourcing of advanced materials [8]. Group 3: Future Projections - The market for conductive adhesives is expected to reach $3 billion by 2026, while the market for chip bonding materials is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The article emphasizes the importance of innovation and R&D in maintaining competitive advantages in the rapidly evolving materials landscape [8].

证券日报网讯1月29日，强力新材（300429）在互动平台回答投资者提问时表示，公司的光敏性聚酰亚 胺(PSPI)仍处于下游客户验证阶段，工作正常推进中。 ...

格隆汇1月29日丨强力新材(300429.SZ)在投资者互动平台表示，公司的光敏性聚酰亚胺（PSPI）仍处于 下游客户验证阶段，工作正常推进中。 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulation materials market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and Dow are currently dominant in various segments, but domestic firms are rapidly advancing [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to compete effectively against established international players [8].

Group 1 - Company Weili expects a full-year loss of 350 million to 250 million in 2025 [1] - Company Shanshi Network Technology anticipates a full-year loss of 220 million to 180 million in 2025 [1] - Company Qiangli New Materials projects a full-year loss of 142 million to 100 million in 2025 [1] - Company Nongda Technology has newly listed shares on the Beijing Stock Exchange [1] Group 2 - Convertible bond code 118057 (Jiaoxi Convertible Bond) is not subject to forced redemption [2] - Convertible bond code 127062 (Lezhi Convertible Bond) will not undergo adjustment [2] - Convertible bond code 110089 (Xingfa Convertible Bond) is subject to forced redemption [2] Group 3 - Convertible bond code 113045 (Huanxu Convertible Bond) has a current price of 163.745, with a redemption price of 101.632 and a remaining scale of 0.182 billion [4] - Convertible bond code 113672 (Furong Convertible Bond) has a current price of 136.554, with a redemption price of 100.534 and a remaining scale of 0.024 billion [4] - Convertible bond code 118009 (Huarui Convertible Bond) has a current price of 159.074, with a redemption price of 101.105 and a remaining scale of 0.534 billion [4] - Convertible bond code 123159 (Songsheng Convertible Bond) has a current price of 168.297, with a redemption price of 100.540 and a remaining scale of 0.863 billion [4] - Convertible bond code 118029 (Fumiao Convertible Bond) has a current price of 138.132, with a redemption price of 100.218 and a remaining scale of 1.024 billion [4] - Convertible bond code 127042 (Jiawei Convertible Bond) has a current price of 508.000, with a redemption price of 100.893 and a remaining scale of 1.011 billion [4] - Convertible bond code 118043 (Fuli Convertible Bond) has a current price of 160.044, with a redemption price of 100.397 and a remaining scale of 2.364 billion [4] - Convertible bond code 127039 (Beigang Convertible Bond) has a current price of 135.000, with a redemption price of 101.130 and a remaining scale of 6.203 billion [4] - Convertible bond code 123242 (Sailong Convertible Bond) has a current price of 133.250, with a redemption price of 100.330 and a remaining scale of 1.536 billion [4] - Convertible bond code 127071 (Tianjian Convertible Bond) has a current price of 134.900, with a redemption price of 100.810 and a remaining scale of 4.917 billion [4] - Convertible bond code 123182 (Guanglian Convertible Bond) has a current price of 156.595, with a redemption price of 100.960 and a remaining scale of 6.552 billion [4] - Convertible bond code 111016 (Shentong Convertible Bond) has a current price of 132.137, with a remaining scale of 4.154 billion [4] - Convertible bond code 113639 (Huazheng Convertible Bond) has a current price of 183.222, with a remaining scale of 4.878 billion [4] Group 4 - Convertible bond code 128097 (Aojia Convertible Bond) has a current price of 109.912, with a redemption price of 110.000 and a remaining scale of 4.580 billion [6] - Convertible bond code 128101 (Lianchuang Convertible Bond) has a current price of 122.888, with a redemption price of 110.000 and a remaining scale of 2.978 billion [6] Group 5 - Xingfa Convertible Bond is subject to forced redemption [7] - Yongxi Convertible Bond is not subject to forced redemption [7] - Lezhi Convertible Bond will not undergo adjustment [7] - Convertible bond code 127042 (Naipu Convertible Bond) is set to be listed on January 30 [7]

格隆汇1月27日丨强力新材(300429.SZ)公布，预计2025年亏损10,000万元–14,200万元，上年同期亏损 18,169.30万元；扣非亏损10,550万元–15,000万元。公司本报告期发生亏损，亏损较上年有所下降，主要 原因如下：1、报告期内，受市场需求和竞争环境影响，毛利有所恢复。本报告期研发费用增加。2、公 司对各类资产进行了减值测试，拟计提存货跌价损失2,730万元，拟计提非流动资产减值损失5,120万 元。3、本报告期内，预计非经常性损益对净利润的影响金额为550万元-800万元。 ...

（文章来源：每日经济新闻） 每经AI快讯，强力新材1月27日公告，预计2025年度归母净利润亏损1亿元~1.42亿元，上年同期亏损 1.82亿元。 ...

强力新材公告，预计2025年度净利润亏损1亿元–1.42亿元。公司本报告期发生亏损，亏损较上年有所下 降，主要原因如下：1、报告期内，受市场需求和竞争环境影响，毛利有所恢复。本报告期研发费用增 加。2、公司对各类资产进行了减值测试，拟计提存货跌价损失2730万元，拟计提非流动资产减值损失 5120万元。3、本报告期内，预计非经常性损益对净利润的影响金额为550万元-800万元。 ...