| 证券代码：300429 | 证券简称：强力新材 | 公告编号：2026-006 | | --- | --- | --- | | 债券代码：123076 | 债券简称：强力转债 | | 常州强力电子新材料股份有限公司 关于2026年第一季度可转换公司债券转股情 况的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 特别提示： 1、"强力转债"（债券代码：123076）转股期为 2021 年 5 月 25 日至 2026 年 11 月 18 日；初始转股价格：18.98 元/股；调整后转股价格：12.70 元/股（生 效日期：2024 年 7 月 24 日）。 2、2026 年第一季度，共有 230,950 张"强力转债"完成转股（票面金额共 计 23,095,000.00 元人民币），合计转成 1,818,498 股"强力新材"股票（股票 代码：300429）。 3、截至 2026 年第一季度末，公司剩余可转债为 5,594,585 张，票面总金额 为 559,458,500.00 元人民币。 根据《深圳证券交易所创业板股票上市规则》和《深圳证券交易所可 ...

常州强力电子新材料股份有限公司 董事薪酬管理制度 第一章 总则 第一条 为强化常州强力电子新材料股份有限公司(以下简称"公司")董事 薪酬管理，构建合理、规范、高效的激励约束体系，提高董事履职效能，根据《中 华人民共和国公司法》《上市公司治理准则》以及《常州强力电子新材料股份有 限公司章程》(以下简称"《公司章程》")等相关规定，制定本制度。 第二条 本制度适用于公司所有董事（包括独立董事、非独立董事及职工代 表董事）。 第三条 公司董事薪酬应当遵循以下原则： 第二章 薪酬管理机构 第四条 董事的薪酬方案或计划由股东会审议批准。 （一）坚持按劳分配与责、权、利相结合的原则； （二）实际收入水平与公司效益及工作目标挂钩的原则； （三）薪酬与公司长远发展和利益相结合； （四）薪酬与市场价值规律相符； （五）公开、公正、透明的原则。 第三章 薪酬标准及发放 第七条 根据董事的身份和工作性质及所承担的责任、风险、压力等确定： (一)非独立董事及职工代表董事 非独立董事及职工代表董事的薪酬由基本薪酬和绩效薪酬等组成，其中绩效 薪酬占比原则上不低于基本薪酬与绩效薪酬总额的百分之五十。 基本薪酬按月发放；绩效薪酬根据经营情 ...

1、审议通过《关于公司 2026 年度日常关联交易预计额度的议案》 | | | 常州强力电子新材料股份有限公司 第五届董事会第二十次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 常州强力电子新材料股份有限公司（以下简称"公司"或"强力新材"）（证 券代码：300429，证券简称：强力新材）第五届董事会第二十次会议通知于 2026 年 3 月 6 日以直接送达、邮件及电话等方式向各位董事发出。会议于 2026 年 3 月 12 日在公司会议室以现场结合通讯表决的方式召开。会议应出席董事七名， 实际出席董事七名，其中以通讯表决方式出席会议的董事为吕芳诚、杨立、范琳、 谭文浩。会议由董事长钱晓春先生主持。公司高级管理人员列席了本次会议。本 次会议的召集和召开程序符合国家有关法律、法规及《常州强力电子新材料股份 有限公司章程》等有关规定，会议合法有效。 二、董事会会议审议情况 与会董事以投票表决的方式审议通过了以下议案： 董事会同意公司及全资子公司 2026 年度预计和关联方常州强力捷时雅新材 料有限公司（以下简称"强力捷时雅" ...

常州强力电子新材料股份有限公司 高级管理人员薪酬管理制度 第一章 总则 第一条 为进一步完善常州强力电子新材料股份有限公司(以下简称"公 司") 高级管理人员的薪酬管理，建立科学有效的激励与约束机制，有效调动高 级管理人员的工作积极性，提高公司的经营管理效益，根据《中华人民共和国公 司法》《上市公司治理准则》以及《常州强力电子新材料股份有限公司章程》(以 下简称"《公司章程》")等相关规定,制定本制度。 第二条 本制度所称高级管理人员是指公司的总经理、副总经理、董事会秘 书、财务负责人和《公司章程》中规定的其他人员。 第三条 公司高级管理人员薪酬应当与市场发展相适应，与公司经营业绩、 经营成果、个人业绩相匹配，与公司可持续发展相协调。薪酬分配遵循以下基本 原则: (一)按劳分配与责、权、利相匹配的原则； (二)薪酬水平与公司中长远发展目标相符的原则； (三)激励与约束并重的原则； (四)总体薪酬水平与公司实际经营情况相结合的原则。 第九条 高级管理人员的薪酬均为税前金额,公司将按照国家和公司的有关 规定，代扣代缴个人所得税、各类社会保险费用等由个人承担部分后，剩余部分 发放给个人。 第五条 董事会薪酬和考核委 ...

常州强力电子新材料股份有限公司 董事及高级管理人员离职管理制度 第一章 总 则 第一条 为规范常州强力电子新材料股份有限公司（以下简称"公司"）董 事及高级管理人员离职程序，确保公司治理结构的稳定性和连续性，维护公司及 股东的合法权益，公司根据《中华人民共和国公司法》（以下简称"《公司法》"） 、 《中华人民共和国证券法》（以下简称"《证券法》"）、《上市公司治理准 则》《深圳证券交易所创业板股票上市规则》《上市公司董事和高级管理人员所 持本公司股份及其变动管理规则》等法律法规、规范性文件、证券交易所业务规 则及《常州强力电子新材料股份有限公司章程》（以下简称"《公司章程》"） 的有关规定，结合公司实际情况，制定本制度。 第二条 本制度适用于公司董事（含独立董事）、高级管理人员因任期届满、 辞职、被解除职务或其他原因离职的情形。 第三条 公司董事及高级管理人员离职管理应遵循以下原则： （一）合法合规原则：严格遵守国家法律法规、监管规定及《公司章程》的 要求； （二）公开透明原则：及时、准确、完整地披露董事及高级管理人员离职相 关信息； （三）平稳过渡原则：确保董事及高级管理人员离职不影响公司正常经营和 治理结 ...

| 证券代码：300429 | 证券简称：强力新材 | 公告编号：2026-005 | | --- | --- | --- | | 债券代码：123076 | 债券简称：强力转债 | | 常州强力电子新材料股份有限公司 关于公司2026年度日常关联交易预计额度 的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、日常关联交易基本情况 （一）日常关联交易概述 常州强力电子新材料股份有限公司及全资子公司（以下简称"公司"）因日 常经营需要， 2026 年度预计和关联方常州强力捷时雅新材料有限公司（以下简 称"强力捷时雅"）发生关联交易，预计金额不超过人民币 7,500 万元。 2026 年 3 月 12 日，公司第五届董事会第二十次会议审议通过了《关于公司 2026 年度日常关联交易预计额度的议案》，关联董事钱晓春先生、管军女士、 倪寅森先生已回避表决。第五届董事会独立董事专门会议第七次会议，全体独立 董事发表了明确同意的意见。 根据《深圳证券交易所创业板股票上市规则》及相关规定，本次日常关联交 易无需提交股东会审议。 （二）2026 年度日常关联交易预计 ...

Core Viewpoint - The semiconductor electronic chemicals industry in China is experiencing significant growth in 2025, driven by the recovery of the semiconductor sector and accelerated domestic substitution processes. However, there is a notable disparity in performance among companies, which can be attributed to their capabilities in high-end product technology, product structure optimization, and cost control [2][18]. Group 1: Industry Overview - The seventh forum on semiconductor wet chemicals, electronic gases, and precursors will be held on March 12, 2026, in Suzhou, featuring experts from various leading companies [2]. - The domestic electronic chemicals market is projected to reach 29 billion yuan in 2025, with a significant increase in demand for high-purity wet electronic chemicals from domestic wafer and packaging factories [22]. - The market for wet electronic chemicals is expected to grow rapidly, with the global market size reaching $10.102 billion and the Chinese market size at 22.36 billion yuan in 2024 [22]. Group 2: First Tier Companies - Crystalwise Materials is the only company in the first tier, expecting a net profit of 120 to 160 million yuan in 2025, a significant turnaround from a loss of 180 million yuan the previous year [3][4]. - The company's success is attributed to the rapid growth of the semiconductor industry and its strong product layout, particularly in high-purity sulfuric acid and hydrogen peroxide, which saw substantial sales increases [5]. Group 3: Second Tier Companies - Shanghai Xinyang leads the second tier with a net profit growth of 50.82% to 82.12%, driven by successful technology R&D and market order conversion [6][7]. - Aisen Co. anticipates a revenue increase of 37.54% to 594 million yuan, with a net profit growth of 50.74%, supported by advanced packaging demand and high-end product mass production [7][9]. - Anji Technology, a leader in semiconductor polishing and cleaning liquids, expects a revenue of 2.505 billion yuan, reflecting a 36.51% increase, with a net profit of 795 million yuan, up 48.98% [9][10]. Group 4: Third Tier Companies - Dinglong Co. is projected to achieve a net profit of 700 to 730 million yuan, with a growth rate of 34.44% to 40.20%, supported by strong performance in semiconductor and display materials [11]. - Xingfu Electronics expects a revenue of 1.475 billion yuan, a 29.72% increase, with a net profit of 208 million yuan, benefiting from the growth of general-purpose wet electronic chemicals [12]. - Jiangfeng Electronics is anticipated to have the slowest growth in the third tier, with a net profit increase of 7.50% to 27.50%, reflecting challenges in scaling its precision components business [14]. Group 5: Fourth Tier Companies - Zhongjuxin and Qiangli New Materials are in the fourth tier, both expected to report losses in 2025 due to intensified industry competition and asset impairments [15][16]. - Zhongjuxin is projected to incur a loss of 14 to 20 million yuan, primarily due to goodwill impairment from its acquisition of Kaisheng Fluorine Chemicals [15]. - Qiangli New Materials anticipates a loss of 100 to 142 million yuan, with increased R&D expenses and asset impairments contributing to its ongoing financial difficulties [16]. Group 6: Conclusion - The differentiation in operating net profit among companies in the electronic chemicals industry reflects their varying core capabilities in high-end product technology and market adaptation [18][19]. - Companies achieving high growth are characterized by breakthroughs in high-end product technology and optimized product structures, while those under pressure often lack sufficient high-end product layouts [18][19].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market sizes and growth rates anticipated [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: expected to grow from approximately $485 million in 2023 to $684 million by 2029 [8]. - The investment landscape is characterized by a shift towards domestic production, with numerous Chinese companies emerging as competitors to established foreign firms [7][8]. Industry Trends - The article emphasizes the trend of domestic substitution in advanced materials, particularly in sectors heavily reliant on imports from countries like Japan [7][8]. - It highlights the importance of innovation and R&D in maintaining competitive advantages within the industry [7][8]. Strategic Insights - Investment strategies vary across different stages of company development, from seed rounds to pre-IPO phases, with a focus on team capabilities, market potential, and product maturity [10]. - The article suggests that the current market conditions present a favorable environment for investments in advanced materials, particularly for companies that can demonstrate strong growth potential and innovative capabilities [10].

Group 1 - The company is currently in a loss state regarding the LCD photoresist nano-pigment project, which has recently commenced mass production [2] - Investors have shown interest in understanding the impact of this project on the company's future performance [2] - The project is part of the company's broader strategy to enhance its product offerings in the semiconductor materials sector [2] Group 2 - The company has been actively engaging with investors through platforms to provide updates on its projects and financial status [2] - The ongoing losses indicate potential challenges in achieving profitability in the near term for this specific project [2] - The company's response reflects its commitment to transparency and investor relations [2]

Core Viewpoint - The A-share HBM (High Bandwidth Memory) industry chain is experiencing a collective surge due to the explosive demand for AI computing power and accelerated iteration of HBM technology, with increased capital attention across various segments from upstream materials and equipment to packaging and testing. Company Summaries - **拓荆科技 (Tuojing Technology)**: Latest stock price is 360.00 CNY with a daily increase of +9.98%. The company plans to reduce holdings and is a major supplier of ALD equipment, essential for HBM manufacturing processes [1]. - **宏昌电子 (Hongchang Electronics)**: Latest stock price is 11.54 CNY with a daily increase of +8.97%. It is a leading domestic supplier of electronic-grade epoxy resin, a key material for HBM packaging [2]. - **精智达 (Jingzhida)**: Latest stock price is 313.00 CNY with a daily increase of +7.28%. The company develops testing technologies and equipment for new generation semiconductor memory, including HBM [3]. - **联瑞新材 (Lianrui New Materials)**: Latest stock price is 68.50 CNY with a daily increase of +6.83%. It supplies core materials for HBM packaging, including ball silicon and Low α ball aluminum [4]. - **芯碁微装 (Xinqi Microelectronics)**: Latest stock price is 186.37 CNY with a daily increase of +5.82%. The company plans to reduce holdings and provides advanced packaging equipment that supports HBM applications [5]. - **兴森科技 (Xingsen Technology)**: Latest stock price is 26.30 CNY with a daily increase of +5.41%. The company produces FCBGA packaging substrates, crucial for HBM storage packaging [6][7]. - **飞凯材料 (Feikai Materials)**: Latest stock price is 31.98 CNY with a daily increase of +5.02%. It produces EMC epoxy resin, a core material for HBM storage chip manufacturing [8]. - **芯源微 (Xinyuan Micro)**: Latest stock price is 212.20 CNY with a daily increase of +4.88%. The company has gained recognition in HBM and 2.5D/3D packaging fields, with increasing sales of multiple products [9]. - **圣泉集团 (Shengquan Group)**: Latest stock price is 34.21 CNY with a daily increase of +4.65%. The company provides various materials, including special phenolic resin and epoxy resin, for the HBM industry [10]. - **壹石通 (Yishitong)**: Latest stock price is 31.40 CNY with a daily increase of +4.32%. The company supplies chip packaging materials for HBM and is an important part of the HBM packaging supply chain [11]. - **华海诚科 (Huahai Chengke)**: Latest stock price is 132.54 CNY with a daily increase of +4.21%. The company plans to reduce holdings and has materials for HBM packaging that have passed customer certification [12]. - **赛腾股份 (Saiteng Co., Ltd.)**: Latest stock price is 50.53 CNY with a daily increase of +4.21%. The company has entered the wafer inspection and measurement equipment field and is expanding applications in HBM [13][14]. - **ST华鹏 (ST Huapeng)**: Latest stock price is 7.00 CNY with a daily increase of +3.86%. It is an upstream supplier of epoxy resin for HBM construction materials [15]. - **强力新材 (Qiangli New Materials)**: Latest stock price is 16.21 CNY with a daily increase of +3.71%. The company is in the customer certification phase for advanced packaging materials and aims to enter the HBM advanced packaging market [16]. - **国芯科技 (Guoxin Technology)**: Latest stock price is 41.38 CNY with a daily increase of +3.71%. The company is involved in HBM interface technology development and validation [17].