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X @Binance Wallet
Binance Wallet· 2025-07-24 03:10
Listing Announcement - Binance Alpha 将于 7 月 26 日上线 DePHY Network (PHY) [1] - 符合条件的用户可以在交易开放后使用 Binance Alpha Points 在 Alpha Events 页面上领取空投 [1] User Engagement - 更多详细信息将很快公布 [1] - 请关注 Binance 官方渠道以获取最新更新 [1]
X @Binance
Binance· 2025-07-24 03:06
Listing Announcement - Binance Alpha 将于 7 月 26 日上线 DePHY Network (PHY) [1] - 符合条件的用户可以在交易开放后使用 Binance Alpha Points 在 Alpha Events 页面上领取空投 [1] User Engagement - 更多细节将很快公布 [1] - 请关注 Binance 官方渠道以获取最新更新 [1]
重要芯片技术,常被忽视
半导体行业观察· 2025-07-19 03:21
Core Viewpoint - The article emphasizes the critical role of the physical layer (PHY) in data communication, particularly in the context of emerging technologies such as artificial intelligence and high-performance computing, highlighting its importance in meeting the increasing demands for bandwidth, low latency, and energy efficiency [3][6][11]. Summary by Sections Importance of PHY - The physical layer has evolved from supporting traditional industries to becoming foundational for AI factories and large-scale data centers, acting as a key driver for data transmission and communication [3]. - As data centers handle massive amounts of data, the significance of PHY increases, especially for AI and HPC workloads that require unprecedented system performance [3][6]. Standards and Applications - Understanding the physical layer is crucial for maintaining competitiveness in various applications, with different standards developed to address specific issues [4]. - Standards like HDMI and DisplayPort illustrate the need for compatibility and efficiency in system design, balancing cost and functionality [5]. Design Challenges - Designing PHY for speeds exceeding 100G presents numerous challenges, including process technology dependence, signal integrity, system design constraints, and packaging integration [8]. - The transition from NRZ to PAM signaling represents a significant shift in technology, necessitating advanced design techniques to meet increasing bandwidth demands [7][8]. Chip-to-Chip Communication - The development of chip-to-chip communication standards, such as UCIe, aims to achieve high bandwidth with low power consumption, which is essential for modern 3D systems [9]. - The integration of multiple dies in a system-on-chip (SoC) architecture requires careful consideration of physical layer protocols to optimize performance [9][10]. Collaboration Between Disciplines - Effective collaboration between analog and digital engineers is necessary to bridge the gap between different domains, ensuring that physical effects are adequately addressed in system design [10][11]. - A comprehensive understanding of how physical effects impact system performance is vital for optimizing designs and achieving desired outcomes [11]. Future Outlook - As the industry progresses towards higher standards like 448G, the challenges will intensify, particularly with the emergence of chip decomposition and optical I/O [11]. - The PHY layer is increasingly viewed as a strategic enabler, necessitating continuous innovation and commitment to pushing technological boundaries [11].