Core Viewpoint - The article discusses the advancements in interconnect technology, particularly focusing on Lightmatter's new 3D co-packaged optical interconnect (CPO) technology, which aims to significantly enhance I/O performance for AI workloads, especially in training large language models [1][4]. Group 1: Interconnect Technology Innovations - Faster data transfer speeds between processors enable more work to be completed, driving innovation in interconnect technology [1]. - Nvidia's NVLink technology provides up to 1PB/s of network bandwidth in high-end systems, showcasing the industry's focus on improving data transfer rates [3]. - Lightmatter's Passage M1000 photon superchip features 1024 serial data channels, each capable of 56 Gbps throughput, with a total bandwidth of 114 Tbps [4]. Group 2: Lightmatter's CPO Technology - Lightmatter's CPO technology allows for the integration of SerDes within the chip, improving data transmission efficiency by using laser beams instead of traditional electrical connections [6][7]. - The 3D stacking method of CPO technology enables chip manufacturers to achieve photon bandwidths of 32 to 64 Tbps, enhancing scalability for AI workloads [7]. - Lightmatter is collaborating with undisclosed GPU or XPU manufacturers to integrate CPO technology into their chips, with potential product releases expected by the end of 2027 [7]. Group 3: Market Context and Competition - The demand for computing accelerators is surging due to the growth of AI workloads, prompting various companies, including AMD, Intel, Google, AWS, and Microsoft, to innovate in this space [1]. - Lightmatter has raised $850 million and holds a valuation of $4.4 billion, indicating its significance in the optical interconnect market [8].