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RCC或FRCC材料
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方邦股份(688020.SH):自产的PI/TPI材料主要用于FCCL产品
Ge Long Hui· 2025-12-15 07:52
Core Viewpoint - The company has developed resin materials that are coated on ultra-thin copper foil to create RCC or FRCC materials for ultra-fine circuit production, currently in the customer testing phase [1] Group 1 - The company is utilizing its proprietary formulation technology to produce PI/TPI materials primarily for FCCL products, which are not yet being sold externally [1]