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方邦股份:公司利用自有的配方技术自产的PI/TPI材料主要用于FCCL产品
Zheng Quan Ri Bao· 2025-12-15 12:45
Core Viewpoint - Fangbang Co., Ltd. is developing resin materials for ultra-thin copper foil, currently in the customer testing phase [2] Group 1: Product Development - The company has developed resin materials that are coated on ultra-thin copper foil to create RCC or FRCC materials for ultra-fine circuit production [2] - The company utilizes its proprietary formula technology to produce PI/TPI materials, primarily for FCCL products, which are not yet exported [2]
方邦股份(688020.SH):自产的PI/TPI材料主要用于FCCL产品
Ge Long Hui· 2025-12-15 07:52
Core Viewpoint - The company has developed resin materials that are coated on ultra-thin copper foil to create RCC or FRCC materials for ultra-fine circuit production, currently in the customer testing phase [1] Group 1 - The company is utilizing its proprietary formulation technology to produce PI/TPI materials primarily for FCCL products, which are not yet being sold externally [1]