Core Viewpoint - Adeia has filed two patent infringement lawsuits against AMD, claiming that AMD's chips utilize its patented hybrid bonding technology, which is central to AMD's 3D V-Cache design, enhancing gaming performance and cache density [2][3]. Group 1: Patent Infringement Lawsuit - The lawsuits involve ten patents, including seven related to hybrid bonding technology and three concerning advanced logic and memory manufacturing processes [2]. - Adeia's claims arise after failed licensing negotiations over several years, with the lawsuits announced on November 3 [2]. - AMD has not commented on the lawsuits as of now [2]. Group 2: Hybrid Bonding Technology - Hybrid bonding technology is crucial for AMD's Ryzen X3D processors, allowing for a near-monolithic connection between chips, which enables stacking of 64MB SRAM without exceeding thermal or electrical limits [2]. - This technology utilizes TSMC's SoIC process series, which facilitates ultra-high-density 3D integration [2]. Group 3: Implications of the Lawsuit - The outcome of the lawsuit could redefine the boundaries between proprietary bonding methods and specific implementations by foundries, impacting the ownership of connection aspects in 3D chip designs [4]. - If Adeia's claims withstand early procedural challenges, the case may influence the valuation of all hybrid bonding processors in future licensing transactions [4]. - Historically, injunctions in such patent cases are rarely granted, leading to expectations that AMD's products will not be immediately affected [3].