Core Viewpoint - The company held an earnings briefing on September 19, focusing on advancements in AI visual algorithms, semiconductor packaging and testing, technology iteration, humanoid robot layout, and export business growth [1][2]. Group 1: AI Visual Algorithms - The company has fully integrated AI algorithms into its machine vision products, such as AOI, SPI, AXI, and dispensing equipment, leading to significant improvements in product performance and market competitiveness [1]. - In semiconductor packaging, the accuracy of defect detection and false alarm control has notably improved, enhancing the precision of motion control for different PCB substrate states [2]. Group 2: Semiconductor Packaging Business - The company’s semiconductor packaging products focus on appearance defect detection for bonding and post-dicing processes, with small batch shipments already achieved [2]. - The 3D online X-ray inspection equipment (AXI) is currently undergoing validation testing with clients for internal defect detection in power devices, and the company has relevant technological reserves for advanced packaging [2]. Group 3: Technology Iteration - The company has fully adopted its self-developed AI algorithm models, which, combined with traditional algorithms, have enhanced the competitiveness of its machine vision products, leading to a continuous increase in product sales [2]. Group 4: Humanoid Robot Layout - The company possesses 3D structured light technology but has not yet industrialized its humanoid robot layout [2]. Group 5: Export Business Growth - In the first half of the year, the company’s export revenue reached 129 million, a significant increase from 77 million in the same period last year, driven by demand in consumer electronics and semiconductors [2]. - The growth in exports is attributed to market demand changes, global client expansion, and new overseas clients, as well as some domestic clients venturing abroad [2]. Group 6: Other Business Developments - The company’s cable assembly products are utilized in photolithography equipment, and its investment in the Suzhou Chip Dynamics Fund focuses on the semiconductor supply chain, yielding good project returns [2]. - The company’s detection equipment is applicable in the PCB industry, with major clients including well-known companies like Apple and Huawei, and the expansion of downstream client capacity is expected to boost demand for machine vision equipment [2].

Group 1: AI Algorithm Development - The company has fully integrated AI algorithms into its machine vision products, enhancing performance and market competitiveness [1][4] - New AI-based detection models have significantly improved accuracy and false positive control in defect detection [2] - The company is transitioning from traditional algorithms to a complete reliance on AI algorithms in the future [4] Group 2: Semiconductor Packaging Technology - The company’s semiconductor packaging products focus on appearance defect detection in bonding and post-dicing processes, with small batch shipments already realized [3][5] - The 3D online X-ray inspection equipment (AXI) is being tested with clients for internal defect detection in power devices [3] - The company has made technical preparations for advanced packaging solutions [3][5] Group 3: Export Growth and Market Expansion - The company reported an export revenue of 129 million in the first half of 2025, a significant increase from 77 million in the same period last year, driven by international expansion and new overseas clients [5] - Various products have been certified by leading semiconductor clients, indicating strong market acceptance [5][6] Group 4: Customer Demand and Industry Trends - The demand for machine vision equipment is expected to rise due to downstream customer capacity expansion [6] - The company’s products are recognized by major clients in the electronics manufacturing sector, including Apple, Huawei, and Xiaomi [6]

Core Viewpoint - The company has fully integrated AI algorithms into its products, enhancing various operational processes such as component positioning, defect detection, and automatic programming [1] Group 1: AI Integration - The company has implemented AI algorithms across multiple products including AOI, SPI, AXI, and dispensing systems [1] - The applications of these AI algorithms are extensive, covering areas like component positioning, defect detection, and automatic programming [1] Group 2: Motion Control - The company has developed an adaptive transmission system for the MCB control board, utilizing deep learning algorithms [1] - This system allows for precise control based on the stop state of different PCB substrates [1]