Core Viewpoint - The 9th China System-Level Packaging Conference (SiP China 2025) focuses on advanced packaging, Chiplet technology, and heterogeneous integration, emphasizing the innovation in the AI era [2][19]. Group 1: Conference Overview - The conference will take place from August 26 to 28, 2025, at the Shenzhen Convention Center [2]. - The main theme is "Intelligent Gathering of Chip Energy, Heterogeneous Interconnection - Advanced Packaging and Chiplet Ecological Innovation in the AI Era" [2]. Group 2: Key Topics and Sessions - The main forum on August 26 will cover macro trends and ecosystem building, featuring discussions on new trends in edge AI, optical packaging technology, and power management solutions [6][9]. - Technical forums will focus on design innovation, application landing, and advanced packaging solutions for AI-driven Chiplet architectures [8][10][12]. Group 3: Notable Speakers and Contributions - The conference will feature prominent figures from leading semiconductor companies and AI chip design experts, discussing high bandwidth memory (HBM), Chiplet heterogeneous integration, and system-level packaging [19]. - Keynote speakers include founders and executives from various tech companies, sharing insights on the latest practices and breakthroughs in AI computing demands [19].