Group 1: Thermal Interface Materials (TIM) - TIM refers to Thermal Interface Material, which is used to fill gaps and conduct heat from one component to another [1] - TIM1 is located between the chip and the heat spreader, while TIM2 is between the heat spreader and the cold plate or heatsink [4] - The value of TIM2 is expected to be several times higher than TIM1 due to the materials used, with recent industry data indicating a price range of $70-90 per card [7] - The increasing power consumption of XPU chips suggests that future liquid cooling solutions will likely adopt liquid metal TIM2 layers [8] Group 2: Market Dynamics and Orders - The North American electricity shortage is a persistent industry logic that will continue throughout the year [9] - A recent order for DFDQ involving gas turbines and HRSG has raised questions about its impact on BYTH's market position; however, this order is only for Canada and does not affect the U.S. market [12] - The company has upgraded its daily reports to include a broader range of industry insights, covering sectors such as Memory, AI, and liquid cooling [13]