Core Viewpoint - The rise of eFuse technology represents a paradigm shift in circuit protection, transitioning from traditional fuses to intelligent, real-time monitoring and control systems, essential for modern electronic applications across various industries [2][40]. Group 1: eFuse Technology Overview - eFuse is an advanced circuit protection solution that integrates power MOSFETs, current detection circuits, control logic, and multiple protection functions, offering features like overcurrent, overvoltage, and thermal protection with microsecond response times [4][5]. - Compared to traditional fuses, eFuse provides significant advantages such as programmability, self-recovery, and enhanced reliability, making it a critical component in modern electronic systems [4][5]. Group 2: Market Drivers - The electric vehicle (EV) sector is a major driver for eFuse adoption, with global EV sales surging by approximately 3.6 million units from 2022 to 2023, necessitating advanced protection for high-voltage components [6][7]. - eFuse technology is crucial in the transition from 12V to 48V systems in vehicles, ensuring safe operation and preventing fault propagation between different voltage systems [11][8]. Group 3: Applications in Various Industries - In AI data centers, eFuse is essential for managing high power demands, with AI servers consuming up to 8.4 kW, necessitating reliable power paths and real-time monitoring to maximize uptime and reduce total cost of ownership [11][12]. - eFuse is increasingly used in high-density storage systems to optimize performance and prevent overheating, integrating into power transmission architectures [12]. - In consumer electronics, eFuse provides precise protection for critical components, supporting the growing demand for faster charging and more complex power architectures [14]. Group 4: Market Growth and Projections - The global eFuse IC market is projected to reach approximately $550 million by 2024 and is expected to grow to $950 million by 2037, driven by the digitalization and smartization of electronic products [15]. - The demand for eFuse is supported by the increasing complexity of electronic systems and the need for reliable protection mechanisms across various applications [15]. Group 5: Competitive Landscape - Major semiconductor companies are intensifying their investments in the eFuse market, leveraging technological innovation and product diversification to strengthen their market positions [17][18]. - Texas Instruments (TI) has developed a family of 48V hot-swappable eFuse devices tailored for data centers, significantly simplifying circuit design and enhancing reliability [18][19]. - Toshiba and STMicroelectronics are also expanding their eFuse product lines, focusing on integrated designs that meet diverse application needs in automotive and industrial sectors [20][22]. Group 6: Challenges and Future Directions - The eFuse market faces challenges related to technology, certification, and cost, particularly for domestic manufacturers aiming to compete with established international players [36][37]. - Future developments in eFuse technology will focus on enhancing integration, functionality, and adaptability to meet the evolving demands of smart power management in various industries [40][41].

Core Insights - Texas Instruments (TI) has launched new power-management chips to address the increasing power demands of modern data centers, particularly driven by high-performance computing and artificial intelligence (AI) [1][3] - The TPS1685 is introduced as the industry's first 48V integrated hot-swap eFuse with power-path protection, aimed at enhancing efficiency and scalability in data center designs [1][4] - TI also unveiled a new family of integrated GaN power stages, which are designed to improve power density and efficiency while simplifying the design process for data center hardware [1][5] Product Innovations - The TPS1685 hot-swap eFuse supports power levels beyond 6kW and is designed to simplify data center designs while reducing solution size by half compared to existing hot-swap controllers [4][7] - The new GaN power stages (LMG3650R035, LMG3650R070, LMG3650R025) achieve over 98% efficiency and high power density exceeding 100W/in³, integrating advanced protection features [6][7] - These innovations are showcased at the 2025 Applied Power Electronics Conference (APEC), highlighting TI's commitment to enhancing power management solutions [1][7] Industry Impact - The shift to 48V power architectures in data centers is becoming more prevalent as designers seek enhanced efficiency and scalability for components like CPUs and AI hardware accelerators [4][6] - TI's advancements in power-management technology are positioned to help data centers reduce their environmental footprint while meeting the growing energy demands of the digital world [3][4] - Collaborations with companies like Dell and Vertiv demonstrate the practical applications of TI's GaN technology in high-efficiency power supply units [8][9]