Core Viewpoint - HUISEN Technology (7730.TW), a Taiwanese advanced plasma equipment manufacturer, was listed on the Taiwan Stock Exchange's Innovation Board on November 4, with an initial offering price of NT$72 per share, which surged by 34.03% to NT$96.5 at opening [1] Company Overview - Founded in 2002, HUISEN specializes in advanced plasma technology, offering products for plasma cleaning, etching, and surface modification, applicable in semiconductor, ABF substrates, PCB, and new energy environmental sectors [2] - The company has a comprehensive technology platform including vacuum plasma, atmospheric plasma, and plasma flame, used for cleaning, etching, adhesive removal, coating pre-treatment, and high-temperature cracking processes [2] - HUISEN is expanding its market presence beyond Taiwan and mainland China to Japan, the United States, Europe, and Southeast Asia [2] Technological Advancements - HUISEN is actively positioning itself in the advanced packaging market, investing in heterogeneous material etching and surface activation technologies, providing integrated solutions for Epoxy+SiO₂ and Glass+Cu packaging processes [2] - The company has achieved technical leadership in advanced packaging and heterogeneous integration processes, having passed wafer regeneration validation from leading manufacturers [2][3] Financial Performance - For 2024, HUISEN's consolidated revenue is projected to be NT$547 million (approximately RMB 126 million), a year-on-year decrease of 28.14%, with a net profit after tax of NT$86 million, down 34.75%, marking the lowest figures in three years [7] - In the first three quarters of 2025, the cumulative consolidated revenue was NT$356 million (approximately RMB 82.02 million), reflecting a year-on-year decline of 5.6% [7] - The sales manager expressed optimism for the upcoming year, anticipating that semiconductor performance will account for 30-40% of revenue, doubling from the current year, with expected growth in applications including glass substrates and wafer manufacturing [7]