魏思琪微博认证信息 此次人事变动距离前任总经理王腾被辞退已过去一个多月。9月8日晚，小米公司通报对中国区员工王腾的违规违纪行为处理结果，查明王腾泄露公司机密 信息，且存在利益冲突等严重违规违纪行为。根据相关制度规定，公司决定给予王腾辞退的处分。王腾曾在小米体系内工作近十年，一度被视为雷军"重 点培养对象"。 王腾被辞退后，小米方面一直未对外公布新的中国区市场部总经理人选。直到10月17日，小米集团副总裁、CMO许斐发布小米10月市场体系全员会的现 场视频，她在会上称魏思琪为新任中国区市场部总经理。 公开资料显示，魏思琪出生于1988年，毕业于中央美术学院，是资深产品经理。2013年，她加入小米公司，最初负责小米官网产品页设计及发布会PPT。 2018年，魏思琪加入小米CC团队负责产品设计，期间为小米CC系列产品注入潮流、时尚元素。2021年12月，她开始接任小米数字系列产品线负责人。 图片来源：小米集团市场体系全员会视频截图 智通财经记者 | 宋佳楠 10月20日，智通财经注意到，微博账号名称为"Cici_老魏"的魏思琪，其认证信息更新为"小米中国区市场部总经理"。此前她的微博账号认证信息为 "小米 手机市场 ...

Core Viewpoint - Xiaomi has officially launched its self-developed flagship chip "XringO1," which integrates advanced technology and aims to compete with leading chip manufacturers like Qualcomm and MediaTek [1][5]. Group 1: Chip Development Journey - Xiaomi's chip development journey began in 2014 with the establishment of the "Panghu" project, leading to the release of the "Panghu S1" in 2017, which was positioned as a mid-range mobile chip [3][4]. - The initial phase, referred to as the "Songguo period," saw Xiaomi's first chip, the Panghu S1, which utilized a 28nm process and featured an 8-core architecture [3][4]. - After facing setbacks, Xiaomi paused the development of large SoCs and shifted focus to smaller chips, leading to the creation of several peripheral chips like the Panghu C, P, G, and T series [4][5]. Group 2: Resumption of Large Chip Development - In early 2021, Xiaomi made a significant decision to restart its large chip development, establishing the Shanghai Xuanjie Technology Co., Ltd. to focus on mobile SoCs [4][5]. - The company invested over 13.5 billion RMB in the development of the XringO1 chip over four years, with a projected investment of over 6 billion RMB for the current year [5]. Group 3: Technical Specifications of XringO1 - The XringO1 chip is built on TSMC's N3E process, featuring a "4-cluster 10-core" design with a total of 19 billion transistors [1][5]. - The CPU configuration includes 2 super-large Arm X925 cores, 4 performance cores A725, 2 efficiency cores A725, and 2 ultra-efficiency cores A520, while the GPU consists of a 16-core G925 [1][5]. - The chip also integrates Xiaomi's self-developed ISP, NPU, and PMIC, enhancing its overall performance and capabilities [1][11]. Group 4: Innovations and Performance Enhancements - The XringO1 chip employs advanced techniques such as AI optimization and a four-level low-power architecture to achieve high performance and low power consumption [7][8]. - The ISP integrated into the chip has undergone multiple iterations, with the latest version, C4, featuring advanced capabilities for image processing [10][11]. - The NPU in the XringO1 boasts a computing power of 44 TOPS, supporting various AI applications and enhancing overall device performance [10][11]. Group 5: Future Prospects and Challenges - Xiaomi is actively working on developing its own 5G modem, with previous efforts leading to the creation of a self-developed 4G modem for smartwatches [13]. - The company aims to balance the high costs associated with advanced chip manufacturing through sales of its diverse product range, including IoT devices and smartphones [13].