Group 1 - The company announced a change in registered capital and amendments to its Articles of Association, approved by the board of directors on February 24, 2026 [1] - The registered capital increased from 421,101,263 shares to 421,165,613 shares following the vesting of restricted stock under the 2021 incentive plan [1] - The amendments to the Articles of Association will be disclosed on the Shanghai Stock Exchange website, with the final content subject to approval by the industrial and commercial registration authority [2]

Core Viewpoint - The company, Amlogic, reported strong financial performance for the year 2025, achieving record highs in revenue, net profit, and chip sales, driven by the successful launch of new products and improved operational efficiency [3][4]. Financial Performance - In 2025, the company achieved a total revenue of 6.793 billion RMB, an increase of 867 million RMB year-on-year [3]. - The net profit attributable to the parent company was 871 million RMB, up by 49 million RMB compared to the previous year [3]. - Chip sales exceeded 174 million units, marking an increase of over 31 million units year-on-year [3]. Operational Efficiency - The company’s overall gross margin for 2025 was 37.97%, an increase of 1.42 percentage points from 2024 [4]. - The company implemented ongoing operational efficiency initiatives, which contributed to the improvement in gross margin throughout the year [4]. Product Development and Market Expansion - The company launched over 20 new chip products that incorporate self-developed edge AI computing units, with shipments exceeding 20 million units, a year-on-year growth of nearly 160% [4]. - The company’s 1.6nm chips achieved sales of nearly 9 million units in 2025, with expectations to exceed 30 million units in 2026 [5]. - Wi-Fi 6 chip sales surpassed 7 million units, representing over 37% of the W series, compared to nearly 11% in the previous year [6]. Strategic Partnerships and Market Position - The company has established partnerships with nearly 270 operators globally and launched multiple new products with renowned consumer electronics clients [6]. - The company’s diverse product lines and global market expansion strategies are beginning to yield significant results [6]. Research and Development - The company maintained a high level of R&D investment, with total R&D expenses of approximately 1.552 billion RMB in 2025, an increase of 199 million RMB from 2024 [7]. - The company is focusing on developing next-generation high-performance chips for various applications, including smart vehicles and edge AI [8]. Future Outlook - The company anticipates a revenue growth of 10% to 20% year-on-year in Q1 2026, and a full-year growth of 25% to 45% [8].

The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement. Amlogic (Shanghai) Co., Ltd. 晶晨半導體(上海)股份有限公司 (A joint stock company incorporated in the People's Republic of China with limited liability) WARNING ...

香港聯合交易所有限公司及證券及期貨事務監察委員會對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並表明概不就因本公告全部或任何部分內容而產生或依賴該等內 容而引致的任何損失承擔任何責任。 Amlogic (Shanghai) Co., Ltd. 晶晨半導體（上海）股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 警告 本公告乃根據香港聯合交易所有限公司（「聯交所」）及證券及期貨事務監察委員會 （「證監會」）的要求而刊發，僅用作向香港公眾人士提供資料。 閣下閱覽本公告，即表示 閣下知悉、接納並向晶晨半導體（上海）股份有限公司 （「本公司」）、其聯席保薦人、整體協調人、顧問或包銷團成員表示同意： Amlogic (Shanghai) Co., Ltd. 1 (a) 在聯交所網站登載本公告，並不會引致本公司、其聯席保薦人、整體協調 人、顧問或包銷團成員須於香港或任何其他司法權區進行發售或配售活動的 責任。本公司最終會否進行發售或配售仍屬未知之數； (b) 本公告所涉及的上市申請並未獲批准，聯交所及證監會或會接納、發回或拒 絕有關的公開發售及╱或上市申請； (c) 本公告不應被視為勸誘認購或購買 ...

香港聯合交易所有限公司與證券及期貨事務監察委員會對本申請版本的內容概不負責，對其準確性或完整 性亦不發表任何意見，並明確表示概不就因本申請版本全部或任何部分內容而產生或因倚賴該等內容而引 致的任何損失承擔任何責任。 Amlogic (Shanghai) Co., Ltd. 晶晨半導體（上海）股份有限公司 （「本公司」） （於中華人民共和國註冊成立的股份有限公司） 的申請版本 警告 本申請版本乃根據香港聯合交易所有限公司（「聯交所」）及證券及期貨事務監察委員會（「證監 會」）的要求而刊發，僅用作提供資訊予香港公眾人士。 本申請版本為草擬本，其內所載資料並不完整，亦可能會作出重大變動。 閣下閱覽本文件，即 代表 閣下知悉、接納並向本公司、其聯席保薦人、整體協調人、顧問或包銷團成員表示同意： 於本公司招股章程根據香港法例第32章公司（清盤及雜項條文）條例送呈香港公司註冊處處長登 記前，不會向香港公眾人士提出要約或邀請。倘在適當時候向香港公眾人士提出要約或邀請， 有意投資者務請僅依據於香港公司註冊處處長註冊的本公司招股章程作出投資決定。該招股章 程的文本將於發售期內向公眾人士刊發。 香港交易及結算所有限公司、香港聯合 ...

The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Application Proof, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Application Proof. Application Proof of Amlogic (Shanghai) Co., Ltd. 晶晨半導體（上海）股份有限公司 (the "Company") (A joint stock limited company incorporated in the Peo ...