证券代码：300316 证券简称：晶盛机电 编号：2025-022 浙江晶盛机电股份有限公司 关于终止部分募投项目并将剩余募集资金继续存放募 集资金专户管理以及部分募投项目延期的公告 本公司及董事会全体成员保证信息披露内容的真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 浙江晶盛机电股份有限公司（以下简称"公司"）第五届董事会第二十次会议 和第五届监事会第二十次会议审议通过了《关于终止部分募投项目并将剩余募集 资金继续存放募集资金专户管理的议案》及《关于部分募集资金投资项目延期的 议案》，董事会同意公司根据实际情况终止向特定对象发行股票募集资金投资项 目"年产 80 台套半导体材料抛光及减薄设备生产制造项目"，并将剩余募集资金 继续存放公司募集资金专用账户管理，将"12 英寸集成电路大硅片设备测试实验 线项目"达到预定可使用状态日期由 2025 年 6 月 30 日延期至 2027 年 6 月 30 日。 公司募投项目终止事项尚需提交公司股东大会审议。现将具体事项公告如下： 一、募集资金的基本情况 根据中国证券监督管理委员会《关于同意浙江晶盛机电股份有限公司向特定 对象发行股票注册的批复》(证监许可 ...

证券代码：300316 证券简称：晶盛机电 编号：2025-023 浙江晶盛机电股份有限公司 关于召开 2025 年第二次临时股东大会的通知 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、召开会议的基本情况 1、股东大会届次：公司 2025 年第二次临时股东大会。 2、股东大会的召集人：公司第五届董事会第二十次会议以 9 票同意，0 票反 对，0 票弃权，同意召开公司 2025 年第二次临时股东大会。 3、会议召开的合法、合规性：本次股东大会召集程序符合有关法律法规、深 圳证券交易所业务规则和《公司章程》等规定。 4、会议召开日期、时间： 现场会议召开时间：2025 年 7 月 15 日（星期二）下午 2：30。 网络投票时间：通过深圳证券交易所交易系统进行网络投票的时间为 2025 年 7 月 15 日 9:15—9:25，9:30—11:30 和 13:00—15:00；通过深圳证券交易所互联网 系统投票的具体时间为 2025 年 7 月 15 日 9:15—15:00 的任意时间。 5、会议召开方式：本次股东大会采用现场表决与网络投票相结合的方式召 ...

浙江晶盛机电股份有限公司 第五届监事会第二十次会议决议公告 浙江晶盛机电股份有限公司（以下简称"公司"）第五届监事会第二十次会议 通知于2025年6月23日以电子邮件或电话的方式送达各位监事，会议于2025年6 月27日以现场加通讯表决相结合的方式召开，会议由监事会主席李世伦先生主持， 会议应到监事3人，实到监事3人，会议的召集和召开符合《公司法》《公司章程》 的相关规定。经与会监事审议，通过如下决议： 一、以3票同意，0票弃权，0票反对，通过了《关于终止部分募投项目并将 剩余募集资金继续存放募集资金专户管理的议案》； 经审核，监事会认为：本次终止部分募投项目，是结合行业发展并综合考虑 公司业务的实际情况而做出的审慎决定，有利于提高募集资金使用效率，符合公 司未来发展战略及全体股东利益。本次募投项目终止事项不会对公司正常生产经 营造成重大影响，审议程序符合《深圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》等相关法律、法规及规范性文件的要求。监事 会同意本次募投项目终止事项。 公司《关于终止部分募投项目并将剩余募集资金继续存放募集资金专户管理 以及部分募投项目延期的公告 》详见 2025 ...

证券代码：300316 证券简称：晶盛机电 编号：2025-020 浙江晶盛机电股份有限公司 第五届董事会第二十次会议决议公告 浙江晶盛机电股份有限公司（以下简称"公司"）第五届董事会第二十次会议 通知于2025年6月23日以电子邮件或电话的方式送达各位董事，会议于2025年6 月27日以现场加通讯相结合的方式在浙江省杭州市临平区顺达路500号公司会议 室召开，会议由董事长曹建伟先生主持，会议应到董事9人，实到董事9人，会议 的召集和召开符合《公司法》《公司章程》的相关规定。经与会董事审议，通过 如下决议： 公司《关于终止部分募投项目并将剩余募集资金继续存放募集资金专户管理 以及部分募投项目延期的公告 》详见 2025 年 6 月 28 日巨潮资讯网 （http://www.cninfo.com.cn）。 一、以9票同意，0票弃权，0票反对，通过了《关于终止部分募投项目并将 剩余募集资金继续存放募集资金专户管理的议案》； 董事会同意公司根据实际情况终止向特定对象发行股票募集资金投资项目 "年产80台套半导体材料抛光及减薄设备生产制造项目"，并将剩余募集资金继续 存放公司募集资金专用账户管理。 公司《关于终止部 ...

Core Viewpoint - The strategic cooperation among Jing Sheng Mechanical, Zhejiang University Integrated Circuit Institute, and Zhejiang Chuangxin Integrated Circuit Co., aims to enhance the development of the integrated circuit industry in China through deep integration of production, education, and research [1][2]. Group 1: Strategic Cooperation - A strategic cooperation framework agreement was signed on June 24, focusing on establishing a joint research center for advanced integrated circuit equipment and technology innovation [1]. - The collaboration will involve joint research on 12-inch silicon epitaxy equipment and process development, as well as the establishment of a high-level talent cultivation mechanism [1][2]. - The partnership aims to create an innovation closed loop from basic research to industrial application, enhancing the core competitiveness of China's integrated circuit industry [1][2]. Group 2: Institutional Background - Jing Sheng Mechanical, founded in 2006 and listed in 2012, is a leading domestic enterprise in the semiconductor materials equipment sector, focusing on silicon, silicon carbide, and sapphire materials [2]. - The Zhejiang University Integrated Circuit Institute was established in December 2023, emphasizing industry-education integration and aiming to cultivate leading talents and tackle key technologies [2]. - The Zhejiang Integrated Circuit Innovation Platform, co-built by the government and Zhejiang University, is the only public service platform in China for 12-inch integrated circuit technology innovation [2]. Group 3: Industry Collaboration - Jing Sheng Mechanical is actively collaborating with various parties in the integrated circuit field, recently forming a joint innovation entity for large silicon wafer polishing technology in the Yangtze River Delta region [3]. - The company aims to enhance the domestic production rate of equipment and core components in the integrated circuit sector, projecting a potential cost reduction of approximately 20% [3].

Investment Rating - The report maintains a "Positive" investment rating for the industry [5]. Core Insights - The overall scale of the industry remains stable, with a decrease in enthusiasm leading to differentiation among companies [12][19]. - Policy expectations are anticipated to strengthen further, driven by public statements from industry leaders [22][23]. - New technologies, particularly BC technology, are gaining attention, while other routes are progressing steadily [26][28]. - Auxiliary materials and equipment are advancing with BC and TOPCon modifications, contributing to efficiency improvements [46][62]. - Inverters are evolving, with a focus on commercial storage solutions and continued iterations in large-scale storage [67][82]. Summary by Sections Overall - The scale of the industry is stable with over 3,500 participating companies and more than 500,000 attendees, showing no significant change from 2024 [19]. - There is a noticeable decrease in overall enthusiasm, with some exhibition spaces left vacant, indicating a divergence in interest between leading and smaller companies [19]. Policy - Industry leaders are actively promoting policy implementation, with initial solutions proposed to address the "internal competition" in the silicon material sector [23]. - The asset-liability ratio in the photovoltaic main industry chain has shown a significant increase, indicating financial pressures [24]. New Technologies - The HIBC technology from Longi has achieved a standard module power of over 700W, while Aiko's ABC modules have a double-sided rate of 80% ± 5% [28]. - The TOPCon route focuses on efficiency improvements, with leading companies showcasing modules with power ratings up to 670W and conversion efficiencies of 24.8% [33]. - HJT technology is also advancing, with Tongwei's HJT module reaching a power output of 790.8W, marking a significant achievement in the sector [41]. Auxiliary Materials & Equipment - Leading manufacturers are launching BC-specific products, including low-weight encapsulation films and high-reflectivity black materials [46]. - The introduction of low-cost metal solutions is becoming a trend, with companies like Jingsilver and Shanghai Silver Paste showcasing their innovations [52]. - Equipment for TOPCon modifications is gaining traction, with edge passivation becoming a mainstream technology [62]. Inverters - The focus on commercial storage products is evident, with new high-power products being prominently displayed at the SNEC exhibition [67]. - The latest large-scale storage solutions, such as the PowerTitan3.0 from Sungrow, feature significant upgrades in capacity and efficiency [82].

Core Viewpoint - The second batch of Yangtze River Delta Innovation Alliances has been officially announced, with three enterprises from Anhui leading the initiatives [1][4]. Group 1: Innovation Alliances - A total of 12 innovation alliances have been established, each led by a different company, focusing on various technological advancements [3]. - The leading companies and their respective innovation alliance names include: - Jiangsu Hengtong Optic-Electric Co., Ltd. leading the "Yangtze River Delta Marine Information Transmission Technology Innovation Alliance" - Jiangsu Aosaikang Pharmaceutical Co., Ltd. leading the "Yangtze River Delta Antimicrobial Infection Drug Research Innovation Alliance" - Nanjing Meichen Microelectronics Co., Ltd. leading the "Yangtze River Delta Low Earth Orbit Satellite Communication Integration Technology Innovation Alliance" - China Electronics Jinxin Digital Technology Group Co., Ltd. leading the "Yangtze River Delta Artificial Intelligence Source Network Collaborative Energy Management Innovation Alliance" - Shanghai Chemical Industry Research Institute Co., Ltd. leading the "Yangtze River Delta Isotope Technology Innovation Alliance" - Shanghai Yudu Semiconductor Technology Co., Ltd. leading the "Yangtze River Delta Electrical Measurement Equipment Innovation Alliance" - Zhejiang Jingsheng Mechanical and Electrical Co., Ltd. leading the "Yangtze River Delta Integrated Circuit Large Silicon Wafer Polishing Technology Innovation Alliance" - Hangzhou Shenhao Technology Co., Ltd. leading the "Yangtze River Delta Intelligent Robot Innovation Alliance" - Ningbo Geely Luoyou Engine Parts Co., Ltd. leading the "Yangtze River Delta Green Intelligent Powertrain Innovation Alliance" - Efort Intelligent Robot Co., Ltd. leading the "Yangtze River Delta Robot High-Speed High-Precision Technology Innovation Alliance" - Anhui Wanyi Technology Co., Ltd. leading the "Yangtze River Delta Wireless Minimally Invasive Surgery System Innovation Alliance" - Anhui Jianghuai Automobile Group Co., Ltd. leading the "Yangtze River Delta Automotive Low Carbon and Intelligent Technology Innovation Alliance" [3]. Group 2: Strategic Focus - The 12 innovation alliances are designed to address national strategic needs and align with local dominant industry directions, aiming to build an industrial chain around innovation [4]. - The goal is to promote the aggregation of various innovative elements towards the innovation alliances [4].

Group 1 - The establishment of 12 Yangtze River Delta Innovation Alliances is aimed at addressing national strategic needs and enhancing collaborative construction based on local leading industries [1][2] - The second batch of Yangtze River Delta Innovation Alliances was officially announced at the seventh Yangtze River Delta Integration Development Forum [1] - The leading units and names of the 12 innovation alliances include Jiangsu Hengtong Optic-Electric Co., Ltd. leading the "Yangtze River Delta Marine Information Transmission Technology Innovation Alliance" and others focusing on various technological innovations [1][2] Group 2 - The construction goal of these alliances is to layout the industrial chain around the innovation chain, promoting the aggregation of various innovative elements towards the innovation alliances [2] - Future steps involve improving organizational structures and operational mechanisms, leveraging the industry influence of leading units, and fostering collaborative research and technology breakthroughs [2] - The focus is on enhancing the independent innovation capabilities and core competitiveness of key industries in the Yangtze River Delta region [2]

Group 1 - The core point of the article is the launch of an economically efficient OHT crane system by the company Hangzhou Zhongwei Optoelectronics Technology Co., Ltd., a subsidiary of Jing Sheng Machinery [1] - The new OHT crane system is designed to provide cost-effective aerial logistics solutions for industries such as semiconductors, panels, and packaging testing, as well as other multi-point logistics scenarios [1]

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging utilizes high-density interconnects, heterogeneous integration, and 3D stacking technologies to meet the demands of high-performance computing, 5G, and AI [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with advanced packaging driving an increase in the share of packaging equipment sales [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing backend packaging equipment and new front-end equipment [9][27]. - The traditional backend packaging equipment must undergo technological upgrades to accommodate smaller sizes, higher integration, and more complex structures, focusing on precision, material compatibility, process control, and automation [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various semiconductor equipment types, including thinning machines, dicing machines, and bonding machines, to support advanced packaging processes [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies like Huahai Qingke and Jing Sheng Machinery are emerging players [40][44]. Traditional Backend Equipment Upgrades and Manufacturers - Traditional backend packaging equipment requires upgrades to meet the demands of advanced packaging, focusing on precision enhancement, material compatibility, process control, and automation [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group [32].