晶盛机电(300316.SZ)接受机构调研时表示，受益于半导体行业持续发展及国产化进程加快，公司半导 体业务持续发展，截至2025年6月30日，公司未完成集成电路及化合物半导体装备合同超37亿元（含 税）。在半导体集成电路装备领域，公司实现半导体8-12英寸大硅片设备的国产化，并延伸拓展至芯片 制造和先进封装领域。在化合物半导体装备领域，公司聚焦第三代半导体碳化硅装备研发，在晶体生 长、加工、外延等环节成功突破多项核心技术。 ...

证券代码：300316 证券简称：晶盛机电 浙江晶盛机电股份有限公司投资者关系活动记录表 编号：2025-8 | 投资者关系活动 | √特定对象调研 □分析师会议 □媒体采访 □业绩说明会 | | --- | --- | | 类别 | □新闻发布会 □路演活动 □现场参观 □电话会议 □其他 | | 参与单位名称及 | 参见附件：参会投资者清单。 | | 人员姓名 | | | 时间 | 2025 年 9 月 23 日—24 日 | | 地点 | 杭州 | | 上市公司接待人 | 董事长 曹建伟 | | 员姓名 | 投资者关系 林婷婷 | | | 1、请问公司半导体装备订单情况？ | | | 答：受益于半导体行业持续发展及国产化进程加快，公司半导 | | | 体业务持续发展，截至 2025 年 6 月 30 日，公司未完成集成电路及 | | | 化合物半导体装备合同超 37 亿元（含税）。 | | | 2、公司在半导体设备板块的布局？ | | | 答：在半导体集成电路装备领域，公司实现半导体 8-12 英寸大 | | 投资者关系活动 | 硅片设备的国产化，并延伸拓展至芯片制造和先进封装领域。在化 | | 主要内 ...

格隆汇9月24日丨晶盛机电(300316.SZ)在互动平台表示，公司主营业务产品涉及半导体装备、半导体衬 底材料、半导体耗材及零部件领域。目前不涉及人形机器人领域。 ...

Investment Rating - The investment rating for the company is "Buy" and is maintained [1] Core Views - The company is focusing on the industrialization of silicon carbide (SiC substrate materials) to enhance its international supply capabilities. The company has made significant technological advancements in growing 12-inch conductive silicon carbide crystals and is actively expanding its production capacity [4][5] - The company is also promoting its silicon carbide equipment, which includes various processing devices, to strengthen its core competitiveness in the silicon carbide substrate field. The company has achieved a leading market share in 6-8 inch silicon carbide epitaxy equipment [5] - The financial projections indicate that the company is expected to achieve revenues of 120.31 billion yuan, 129.77 billion yuan, and 140 billion yuan for the years 2025, 2026, and 2027 respectively, with net profits of 10.41 billion yuan, 12.65 billion yuan, and 15.46 billion yuan for the same years [8] Company Overview - The latest closing price of the company's stock is 38.09 yuan, with a total market capitalization of 499 billion yuan and a circulating market value of 469 billion yuan. The company has a total share capital of 1.31 billion shares, with a debt-to-asset ratio of 43.2% and a price-to-earnings ratio of 19.84 [3]

Group 1 - Securities firms have conducted a total of 3,845 research activities involving 644 listed companies since September 21, with a focus on industries such as industrial machinery and electronic components [1][2] - The most frequently researched company is Lanke Technology, which has been surveyed by 54 securities firms, followed by Juguang Technology with 40 surveys [1] - Leading securities firms include CITIC Securities and Guotai Junan, each conducting 175 surveys, while Changjiang Securities has conducted 135 surveys [1] Group 2 - Among the 644 listed companies, 76 are in the industrial machinery sector, and 42 are in the electronic components sector, indicating a preference for these industries [2] - As of September 19, 288 of the surveyed stocks have seen price increases this month, with 24 stocks rising over 30%, led by World with a 76.94% increase [2] Group 3 - Key issues of interest in the surveys include companies' overseas expansion strategies, with Juguang Technology actively integrating its acquisitions in Switzerland and Singapore [3] - Companies like Kaiying Network reported a 59.57% year-on-year increase in overseas revenue in the first half of the year, focusing on enhancing their product matrix for international markets [3] - Analysts predict that a number of Chinese companies will emerge as influential players in international markets, potentially leading to greater valuation premiums for leading domestic firms [3]

Group 1: Core Views on Domestic Computing Power Chips - The domestic computing power chip market is expected to grow rapidly as Chinese tech companies halt purchases of NVIDIA AI chips and terminate existing orders, leading to an increase in market share for domestic chips [1] - Huawei announced a three-year roadmap for its Ascend AI chips, planning to launch four new products from 2026 to 2028, including self-developed HBM technology [1] Group 2: Expansion of Advanced Process Technology - Domestic advanced logic production is exceeding expectations, and a new iteration cycle in storage technology is anticipated next year, benefiting domestic equipment manufacturers [2] - The establishment of Changxin Storage and the initiation of its IPO process are positive indicators for the domestic advanced process sector [2] Group 3: High-End SoC Testing Machine Market - The complexity of SoC chips increases testing difficulty, creating a significant market for high-end testing machines, with domestic companies like Huafeng Measurement and Changchuan Technology actively developing solutions [3] Group 4: Advanced Packaging Requirements for Computing Chips - The shift from NVIDIA's dominance in training cards to domestic alternatives is expected, with domestic companies benefiting from advanced packaging supply chains [4] - Investment opportunities identified in various sectors, including front-end processing, back-end packaging, advanced packaging, and silicon photonics equipment [4]

Core Viewpoint - Silicon carbide (SiC) is emerging as a new solution for chip heat dissipation, with Huawei recently announcing two patents related to SiC thermal management [2][6]. Group 1: Huawei's Patents - Huawei has filed two patents involving SiC for thermal management, aimed at enhancing the thermal conductivity of electronic devices [2]. - The first patent focuses on a thermal composition and its applications in electronic component cooling and chip packaging [2]. - The second patent pertains to a thermal absorbing composition for electronic components and circuit boards [2]. Group 2: Industry Trends - NVIDIA is reportedly switching the intermediate substrate material in its next-generation Rubin processors from silicon to SiC to improve heat dissipation, with large-scale adoption expected by 2027 [6]. - SiC has superior thermal conductivity, with a thermal conductivity of 500 W/mK, compared to silicon's 150 W/mK and ceramic substrates' 200-230 W/mK [7]. - The increasing power of AI chips, such as NVIDIA's GPUs, necessitates improved heat dissipation solutions, as the power of the H200 chip has risen from 700W to 1400W [7]. Group 3: Market Potential - The use of SiC intermediate layers can reduce GPU chip junction temperatures by 20-30°C and lower cooling costs by 30%, preventing performance throttling due to overheating [8]. - The market for SiC applications is expanding from power electronics to packaging and cooling solutions, creating new growth opportunities [9]. - A projection indicates that if NVIDIA's H100 chips were to switch to SiC intermediate layers, it would require approximately 76,190 substrates based on current production metrics [9]. Group 4: Stock Market Response - Following NVIDIA's entry into the SiC cooling sector, related stocks in the A-share market have seen significant increases, with companies like Lushou Technology and Tianyue Advanced rising over 30% since September [11]. - Companies such as Tianyue Advanced and Sanan Optoelectronics are actively pursuing innovations in SiC products for various applications, including power devices and thermal management [11][12]. - Financing data shows that several SiC-related stocks have received substantial investments, with Tongfu Microelectronics leading with an increase of 7.01 billion yuan in financing [14].

Investment Rating - The report maintains an "Overweight" rating for the semiconductor equipment industry, indicating a positive outlook for the sector [1]. Core Insights - The development of domestic computing power chips is gaining attention, with significant benefits expected for domestic equipment manufacturers. Huawei announced a three-year roadmap for its Ascend AI chips, aiming to release four new products between 2026 and 2028, which is expected to enhance the market share of domestic computing power chips [4]. - Domestic advanced process expansion is exceeding expectations, which is favorable for local equipment manufacturers. The report highlights the establishment of Changxin Storage and the anticipated new iteration cycle in memory technology [4]. - The high-end SoC testing machine market presents significant opportunities, with domestic companies like Huafeng Measurement and Changchuan Technology actively working on SoC testing machines to meet the high demands of testing [4]. - The demand for advanced packaging in computing power chips is expected to benefit equipment manufacturers, as domestic supply chains are anticipated to shift towards local advanced packaging suppliers [4]. - Investment recommendations include companies involved in front-end processes such as North Huachuang and Zhongke Feimeng, as well as back-end packaging firms like Huafeng Measurement and Changchuan Technology [4].

Group 1: Industry Insights - The overall attention on the computer, media, and non-ferrous metal industries has increased on a week-on-week basis [3][12][17] - In the last week, the total number of research engagements across all A-shares was 833, which is lower than the 1,412 engagements in the same period of 2024 [13] - The monthly total for August was 1,828 engagements, still below the 2,050 engagements recorded in August 2024 [19][22] Group 2: Individual Company Insights - Companies such as Jingsheng Electromechanical and Nandu Energy have received significant market attention, with both being researched twice in the last week [28][4] - Jingsheng Electromechanical has made progress in semiconductor substrate materials and has secured orders from international clients, indicating a strong market position [28] - Nandu Energy focuses on new energy storage applications and data centers, with a significant portion of its products aimed at the North American market, highlighting its international reach [4][28] Group 3: Research Engagement Trends - The computer, media, and non-ferrous metal sectors saw a week-on-week increase in research attention, with specific numbers indicating a rise in engagements [3][17] - In the last month, companies like Yunnan Copper and Ice Wheel Environment were among those with high research engagement, reflecting their growing market interest [30][25] - The report emphasizes the importance of institutional research as a timely and multidimensional source of information for investors, supplementing traditional financial data [10][11]

Group 1 - In the past five trading days, a total of 267 companies were investigated by institutions, with significant interest in companies like Huichuan Technology, Juhe Materials, and Jingsheng Mechanical & Electrical [1] - Among the companies investigated, 56 received attention from more than 20 institutions, with Huichuan Technology being the most popular, attracting 393 institutions [1][2] - The types of institutions involved in the investigations included 224 securities companies, 178 fund companies, and 91 private equity firms, indicating a strong interest from the securities sector [1] Group 2 - In terms of capital inflow, 21 stocks among those investigated saw net inflows, with Shengyi Electronics receiving the highest net inflow of 493 million yuan [1] - The performance of investigated stocks showed that 41 stocks increased in value, with Su Da Weige, Shuanghuan Transmission, and Suning Universal leading with gains of 28.49%, 25.98%, and 18.61% respectively [2] - Conversely, 14 stocks experienced declines, with Huanrui Century, Nuo Si Ge, and Qilu Bank showing the largest drops of 8.10%, 4.38%, and 3.63% respectively [2] Group 3 - The data indicates that seven companies were investigated three times, including Yuntu Holdings, Linggang Co., and Xingrong Environment, highlighting a concentrated interest in these firms [1] - The investigation results also revealed that companies in the machinery and equipment sector, such as Huichuan Technology and Jingsheng Mechanical & Electrical, received notable attention from institutions [2][3] - The overall trend suggests a growing interest in sectors like electronics, machinery, and power equipment, as evidenced by the number of institutions involved in the investigations [1][2]