Group 1 - The core viewpoint of the article highlights the strong performance of stocks related to Moer Thread, with significant price increases observed in several companies following the news of Moer Thread's IPO approval [1] - Moer Thread's IPO application was approved by the Shanghai Stock Exchange's Science and Technology Innovation Board, with the review process taking only 88 days from acceptance to approval [1] - The company plans to raise 8 billion yuan through the IPO, which will be allocated to the development of new generation self-controlled AI training and inference integrated chips, graphics chips, and AI SoC chips [1] Group 2 - Moer Thread has already mass-produced five types of chips, establishing a product matrix that covers AI computing, high-performance computing, and graphics rendering [1] - The company has completed the layout of a full-stack AI product line, encompassing "cloud-edge-end" solutions [1]

Group 1 - As of September 28, 154 public fund institutions participated in A-share market research activities, covering 28 industries and involving 605 listed companies with a total of 4,275 research instances [1] - From September 1 to 28, 70 listed companies saw stock price increases exceeding 20%, with 19 companies experiencing gains over 40%. The mechanical equipment sector stood out, with World achieving a remarkable increase of 113.77%, attracting attention from 30 public fund institutions [3] - During the same period, 44 listed companies were researched by public fund institutions at least 20 times, with Crystal Machine Electric leading with 81 instances of research [3] Group 2 - The research activities of public fund institutions were primarily concentrated in 18 industries, with the mechanical equipment sector being the most focused, involving 90 listed companies. Key companies included Huichuan Technology, Zoomlion, and Jepter [4] - The electronics sector ranked second, with 83 listed companies and a total of 702 research instances, highlighting companies like Shenzhen South Circuit, Jingchen Co., and Juguang Technology as focal points [4] - Other industries with high research activity included electric power equipment, pharmaceuticals, and basic chemicals [4]

同时，SiC 材料的高硬度和热稳定性亦支持刻蚀工艺的引入，有效提升产能和良率。 晶盛积极扩产6&8 英寸衬底产能，已具备12 英寸能力。晶盛目前已经攻克12 英寸碳化硅晶体生长中的 温场不均、晶体开裂等核心难题，实现了12 英寸超大尺寸晶体生长的技术突破，成功长出12 英寸导电 型碳化硅晶体。 盈利预测与投资评级：我们维持公司2025-2027 年归母净利润预测为10/12/15 亿元，对应当前PE 为 58/47/38 倍，维持"买入"评级。 投资要点 半导体收入占比不断提升，订单快速增长。12 英寸碳化硅衬底加工中试线通线，可兼容导电&半绝缘 型。9 月26 日，首条12 英寸碳化硅衬底加工中试线在晶盛机电子公司浙江晶瑞SuperSiC 正式通线，至 此，浙江晶瑞SuperSiC 真正实现了从晶体生长、加工到检测环节的全线设备自主研发，100%国产化， 标志着晶盛在全球SiC衬底技术从并跑向领跑迈进，迈入高效智造新阶段。 SiC 凭借其高热导率和高工艺窗口，有望显著提升CoWoS 结构散热并降低封装尺寸。英伟达GPU 芯片 从H100 到B200 均采用CoWoS 封装（芯片-晶圆-基板）技术。CoWoS ...

Investment Rating - The investment rating for the company is "Buy" (maintained) [1] Core Views - The first 12-inch silicon carbide (SiC) substrate processing pilot line has officially commenced, opening up growth opportunities for the company [7] - The company has achieved a significant technological breakthrough in 12-inch SiC crystal growth, marking a transition from a follower to a leader in global SiC substrate technology [7] - SiC's high thermal conductivity and processing window are expected to enhance the cooling of CoWoS structures and reduce packaging dimensions, making it an ideal material for high-performance applications [7] - The company is actively expanding its production capacity for 6 and 8-inch substrates and has already developed the capability for 12-inch substrates [7] - The forecasted net profit for the company is projected to be 1 billion, 1.2 billion, and 1.5 billion yuan for 2025, 2026, and 2027 respectively, corresponding to a P/E ratio of 58, 47, and 38 times [7] Financial Summary - Total revenue for 2023 is projected at 17,983 million yuan, with a year-on-year growth of 69.04% [1] - The net profit attributable to the parent company for 2023 is expected to be 4,558 million yuan, reflecting a year-on-year increase of 55.85% [1] - The latest diluted EPS for 2023 is estimated at 3.48 yuan per share [1] - The company’s total assets are projected to reach 31,550 million yuan in 2024, with a total liability of 13,616 million yuan [8] - The company's cash flow from operating activities is expected to be 1,773 million yuan in 2024 [8]

Summary of Key Points from the Conference Call Company and Industry Overview - The conference call discusses **Jingsheng Electromechanical** and its advancements in the **silicon carbide (SiC) substrate** industry, particularly focusing on the **12-inch SiC substrate** technology and its applications in various sectors including **power devices** and **AR glasses** [2][3][5]. Core Insights and Arguments - **12-inch SiC Substrate Development**: Jingsheng has successfully completed the trial production line for 12-inch SiC substrates, achieving 100% domestic equipment development, which significantly reduces downstream application costs and enhances production efficiency by approximately **125 times** compared to 8-inch substrates [2][5]. - **Market Positioning**: The company is actively validating its SiC substrates with global customers and has secured bulk orders from international clients, indicating strong market demand and positioning [2][5]. - **Production Capacity**: The company has a domestic capacity of **900,000 pieces** for power devices, with plans to ramp up production of 8-inch substrates significantly by the end of **2026 to early 2027** [2][6]. - **Strategic Partnerships**: Jingsheng has signed strategic agreements with companies like **Xreal** to provide semi-insulating SiC substrates for AR glasses, with positive progress in product validation [2][6]. - **Pricing Dynamics**: Current prices for 6-inch SiC substrates are around **1,500 RMB**, while 8-inch substrates are priced at approximately **4,000 RMB**. The company plans to increase 8-inch production while maintaining the current scale for 6-inch substrates [2][13]. Additional Important Insights - **Technological Leadership**: Jingsheng's integration of **alkaline nitrogen technology** with existing large-size silicon wafer processes positions it competitively in the market, allowing rapid response to market demands [2][9]. - **Chinese Manufacturers' Dominance**: Chinese manufacturers, including Jingsheng, hold a dominant position in the SiC substrate market, surpassing foreign competitors in both technology and cost [10][21]. - **Future Capacity Expansion**: The company plans to achieve **300,000 pieces** of 8-inch capacity in **Shangyu** by the end of **2025**, and **240,000 pieces** in **Malaysia** by **2027** [15][6]. - **Market Trends in Photovoltaics**: Despite the current downturn in the photovoltaic equipment sector, Jingsheng anticipates potential growth as new technologies are introduced and market conditions improve [17][18]. - **Cost Efficiency and Profitability**: The company is focused on improving efficiency and reducing costs in its photovoltaic equipment, with significant advancements in technologies that enhance battery performance [18][29]. Conclusion - Jingsheng Electromechanical is positioned for significant growth in the SiC substrate market, with strong technological capabilities, strategic partnerships, and a clear plan for capacity expansion. The company is also navigating challenges in the photovoltaic sector while maintaining a focus on innovation and cost efficiency.

Core Viewpoint - The article emphasizes the critical importance of domestic semiconductor equipment manufacturing in China, particularly in the thin film deposition sector, as a response to U.S. export restrictions and the need for technological independence [2][40]. Group 1: Industry Overview - The thin film deposition equipment market in China reached approximately 47.9 billion yuan in 2023, with a domestic production rate of less than 25%, indicating significant potential for domestic substitution [6][41]. - The semiconductor manufacturing process requires a growing number of thin film layers, with the number of deposition steps increasing from about 40 for 90nm processes to over 100 for 3nm processes [3][63]. - The global semiconductor capital expenditure (Capex) is expected to enter a new growth phase, driven by advanced products and increasing production capacity [48]. Group 2: Technological Developments - The transition from 2D to 3D chip structures has fundamentally changed the technology focus and market structure for thin film deposition equipment [9]. - ALD (Atomic Layer Deposition) technology is becoming essential for advanced nodes and 3D structures due to its atomic-level thickness control and 100% step coverage [19][20]. - PECVD (Plasma-Enhanced Chemical Vapor Deposition) holds the largest market share (33%) among thin film deposition technologies, particularly suited for 28nm and below nodes [13][41]. Group 3: Domestic Manufacturers - Key domestic manufacturers in the thin film deposition equipment sector include North Huachuang, Tuo Jing Technology, and Micro Company, each focusing on different aspects of the market [7][41]. - Domestic manufacturers are adopting a multi-dimensional strategy to break through the monopolistic barriers set by international giants, focusing on specialized equipment like HDPCVD and SACVD [25][70]. Group 4: Investment Insights - Investment focus should be on companies that can achieve a closed loop in specific advanced process windows rather than merely replacing single machines [28]. - Companies with dual capabilities in PEALD and Thermal ALD, particularly those that have validated their technology in specific applications, are expected to hold the highest value [29]. - The importance of core components and subsystems, such as plasma sources and vacuum systems, is highlighted as critical for the success of semiconductor equipment [34][36]. Group 5: Conclusion - The U.S. technology blockade has catalyzed a more resilient and innovative semiconductor equipment industry in China, moving from mere substitution to defining next-generation processes [38]. - The journey of domestic equipment manufacturers reflects a broader trend of understanding and meeting the specific needs of Chinese manufacturing, paving the way for long-term value discovery in the semiconductor sector [38].

9月26日，据晶盛机电（300316）（300316.SZ）官方微信号消息，首条12英寸碳化硅衬底加工中试线在 晶盛机电子公司浙江晶瑞SuperSiC正式通线，至此，浙江晶瑞SuperSiC真正实现了从晶体生长、加工到 检测环节的全线设备自主研发，100%国产化，标志着晶盛机电在全球SiC衬底技术从并跑向领跑迈进， 迈入高效智造新阶段。 SiC是第三代半导体材料的核心代表，因其耐高压、高频、高效等特性，广泛应用于新能源汽车、智能 电网、5G通信等重点行业。同时，在AR设备、CoWoS先进封装中间基板等新兴应用领域，SiC也正逐 步成为推动技术突破的关键材料。相较于8英寸产品，12英寸产品单片晶圆芯片产出量增加约2.5倍，能 够在大规模生产中显著减少长晶、加工、抛光等环节的单位成本，是大幅降低下游应用成本的关键路 径。 基于产业链核心设备的国产化突破，公司在检测、离子注入、激活、氧化、减薄、退火等工艺环节积极 布局产品体系，以高标准研发目标，逐步实现碳化硅设备产业化市场突破。公司6-8英寸碳化硅外延设 备实现国产替代并市占率领先。公司碳化硅设备客户包括瀚天天成、东莞天域、芯联集成、士兰微 （600460）等行业 ...

文/罗叶馨梅）9月26日，晶盛机电（300316）消息称，旗下浙江晶瑞SuperSiC首条12英寸碳化硅衬底加 工中试线正式通线，实现了从晶体生长、加工到检测环节的全线设备自主研发与100%国产化。此举标 志着公司在全球SiC衬底技术上已由"并跑"迈向"领跑"，进入高效智造新阶段。 据介绍，SiC作为第三代半导体材料的核心代表，具备耐高压、高频、高效等特性，广泛应用于新能源 汽车、智能电网和5G通信等领域，并逐渐在AR设备、先进封装等新兴应用场景中发挥关键作用。相较 8英寸产品，12英寸SiC衬底单片晶圆产出量提升约2.5倍，可显著降低长晶、加工和抛光等环节的单位 成本，被视为推动下游应用降本增效的重要路径。 晶盛机电方面表示，此次贯通的中试线覆盖晶体加工、切割、减薄、倒角、研磨、抛光、清洗及检测全 流程工艺，所有环节均采用国产设备与自主技术。其中，高精密减薄机、倒角机、双面精密研磨机等核 心设备均由公司多年研发攻关完成，性能指标达到行业领先水平。至此，晶盛机电已形成12英寸SiC衬 底从装备到材料的完整闭环，彻底解决了关键装备"卡脖子"风险，为下游产业提供了新的成本与效率基 准。（校对/秋贤） ...

Group 1: Copper Industry - The China Nonferrous Metals Industry Association's Copper Branch opposes "involution" competition in the copper smelting industry [4] - The Grasberg copper mine in Indonesia, the second-largest in the world, has declared "force majeure" due to a landslide, leading to production stoppage [4][5] - The Grasberg Block Cave copper mine is expected to account for 4% of global supply in 2024, and the incident may widen the global copper supply-demand gap to 725,000 tons by 2026, representing 2.6% of total supply [5] Group 2: Semiconductor Industry - CITIC Securities projects that domestic wafer fabs' global market share could increase from 10% to 30%, indicating a potential threefold expansion [9] - The domestic equipment localization rate could rise from 20% to between 60% and 100%, suggesting a growth potential of three to five times [9] - TSMC plans to raise prices for its 2nm process by at least 50%, which may benefit the domestic analog sector, with companies like Saiwei Microelectronics seeing a maximum increase of 14.19% as of September 26 [9] Group 3: Wind Power Industry - After nearly three years of decline, the Chinese wind power value chain has successfully achieved a turnaround through industry self-discipline, with a positive price and profitability environment expected to last through 2025 and beyond [17] - Companies such as Weili Transmission, Mingyang Smart Energy, and Riyue Shares are highlighted as beneficiaries of the wind power industry's recovery [17][18] - Weili Transmission's wind turbine bid average increased by 15.79%, while Mingyang Smart Energy saw a 17.21% increase compared to last year's low [18]

晶盛机电(300316)26日盘中大幅拉升，一度涨超15%，创近2年新高。 晶盛机电今日发布消息称，9月26日，首条12英寸碳化硅衬底加工中试线在晶盛机电子公司浙江晶瑞 SuperSiC正式通线，至此，浙江晶瑞SuperSiC真正实现了从晶体生长、加工到检测环节的全线设备自主 研发，100%国产化，标志着晶盛在全球SiC衬底技术从并跑向领跑迈进，迈入高效智造新阶段。 据悉，SiC是第三代半导体材料的核心代表，因其耐高压、高频、高效等特性，广泛应用于新能源汽 车、智能电网、5G通信等重点行业。同时，在AR设备、CoWoS先进封装中间基板等新兴应用领域， SiC也正逐步成为推动技术突破的关键材料。相较于8英寸产品，12英寸产品单片晶圆芯片产出量增加约 2.5倍，能够在大规模生产中显著减少长晶、加工、抛光等环节的单位成本，是大幅降低下游应用成本 的关键路径。 公司表示，浙江晶瑞SuperSiC此次贯通的中试线，覆盖了晶体加工，切割，减薄，倒角，研磨，抛光， 清洗，检测的全流程工艺，所有环节均采用国产设备与自主技术，高精密减薄机、倒角机、双面精密研 磨机等核心加工设备更是由公司历时多年自研攻关完成，性能指标达到行业领 ...