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瑞声科技(02018) - 翌日披露报表
2026-01-07 08:50
第 1 頁 共 6 頁 v 1.3.0 FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別: 股票 狀態: 新提交 公司名稱: 瑞聲科技控股有限公司(於開曼群島註冊成立之有限公司) 呈交日期: 2026年1月7日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司(「香港聯交所」)證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露,必須填妥第一章節 。 | 第一章節 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | 於香港聯交所上市 | 是 | | | 證券代號 (如上市) | 02018 | 說明 | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | | | 已發行股份(不包括庫存股份)變動 | | 庫存股份變動 | | | ...
瑞声科技(02018.HK)1月6日回购10.00万股,耗资400.12万港元
证券时报·数据宝统计,瑞声科技在港交所公告显示,1月6日以每股39.220港元至40.180港元的价格回购 10.00万股,回购金额达400.12万港元。该股当日收盘价39.940港元,下跌1.14%,全天成交额1.86亿港 元。(数据宝) 瑞声科技回购明细 (文章来源:证券时报网) | 日期 | 回购股数(万股) | 回购最高价(港元) | 回购最低价(港元) | 回购金额(万港元) | | --- | --- | --- | --- | --- | | 2026.01.06 | 10.00 | 40.180 | 39.220 | 400.12 | ...
瑞声科技(02018)1月6日斥资400.12万港元回购10万股
Zhi Tong Cai Jing· 2026-01-06 09:50
智通财经APP讯,瑞声科技(02018)发布公告,于2026年1月6日该公司斥资400.12万港元回购10万股,回 购价格为每股39.22-40.18港元。 ...
瑞声科技1月6日斥资400.12万港元回购10万股
Zhi Tong Cai Jing· 2026-01-06 09:46
瑞声科技(02018)发布公告,于2026年1月6日该公司斥资400.12万港元回购10万股,回购价格为每股 39.22-40.18港元。 ...
瑞声科技(02018.HK)1月6日耗资400.12万港元回购10万股
Ge Long Hui· 2026-01-06 09:43
格隆汇1月6日丨瑞声科技(02018.HK)发布公告,2026年1月6日耗资400.12万港元回购10万股,回购价格 每股39.22-40.18港元。 ...
瑞聲科技(02018)1月6日斥資400.12萬港元回購10萬股
智通财经网· 2026-01-06 09:40
智通財經APP訊,瑞聲科技(02018)發佈公告,於2026年1月6日該公司斥資400.12萬港元回購10萬股,回 購價格爲每股39.22-40.18港元。 ...
瑞声科技(02018) - 翌日披露报表
2026-01-06 09:36
FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別: 股票 狀態: 新提交 第 1 頁 共 6 頁 v 1.3.0 FF305 確認 不適用 第一章節註釋: 公司名稱: 瑞聲科技控股有限公司(於開曼群島註冊成立之有限公司) 呈交日期: 2026年1月6日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司(「香港聯交所」)證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露,必須填妥第一章節 。 | 第一章節 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | 於香港聯交所上市 | 是 | | | 證券代號 (如上市) | 02018 | 說明 | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | | 已發行股份(不包括庫存股份) ...
瑞声科技(02018) - 截至二零二五年十二月三十一日股份发行人的证券变动月报表
2026-01-06 09:34
截至月份: 2025年12月31日 狀態: 新提交 股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 致:香港交易及結算所有限公司 公司名稱: 瑞聲科技控股有限公司(於開曼群島註冊成立之有限公司) 呈交日期: 2026年1月6日 I. 法定/註冊股本變動 FF301 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | 於香港聯交所上市 (註1) | | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 02018 | 說明 | | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 5,000,000,000 | USD | | 0.01 | USD | | 50,000,000 | | 增加 / 減少 (-) | | | | | | | USD | | | | 本月底結存 | | | 5,000,000,000 | USD | | 0.01 | USD | | ...
【券商聚焦】国元国际予瑞声科技(02018)“买入”评级 指公司收购DispelixOy或在光学、精密制造方面形成强大协同效应
Xin Lang Cai Jing· 2026-01-05 10:38
Core Viewpoint - Company has signed a final agreement to acquire shares and other equity securities of Dispelix Oy, a leader in AR diffractive waveguide technology, with the transaction expected to be completed in the first half of 2026 [1][2] Group 1: Acquisition Details - The acquisition aims to combine Dispelix's expertise in waveguide design and manufacturing with the company's strengths in optics, precision manufacturing, and system-level integration, creating strong synergies [1] - The company's global presence and close partnerships with leading smart device companies will further enhance technology implementation and market expansion [1] Group 2: Industry Trends and Innovations - In the context of the accelerating evolution of "AI + terminal," AI functionalities are transitioning from software to integrated hardware-software experiences [2] - The company is deepening its core layout in the "AI + perception" field, leveraging years of expertise in acoustic, haptic, and optical multi-dimensional perception technologies to provide stronger performance and faster responses [2] Group 3: Financial Projections - Revenue projections for the company from 2025 to 2027 are estimated at 310.18 billion RMB (+13.5%), 351.8 billion RMB (+13.4%), and 399.72 billion RMB (+13.6%) respectively [2] - Projected net profits for the same period are 24.97 billion RMB (+38.9%), 29.68 billion RMB (+18.9%), and 35.67 billion RMB (+20.2%) [2] - The average net profit growth rate over the next three years is forecasted to be 26% [2] Group 4: Valuation and Rating - A 24x PE valuation for 2025 is considered reasonable, leading to a target price of 55.56 HKD per share, indicating a potential upside of 44.7% from the current price [2]
国元国际:维持瑞声科技“买入”评级 持续构建AI时代感知能力
Zhi Tong Cai Jing· 2026-01-05 03:51
Group 1 - The core viewpoint of the report is that the company maintains a "Buy" rating for AAC Technologies (02018) with a target price of HKD 55.56, following its acquisition of AR diffractive waveguide technology leader Dispelix to enhance its presence in the "AI + Perception" field [1] - The acquisition of Dispelix is expected to be completed in the first half of 2026, allowing the company to combine Dispelix's expertise in waveguide design and manufacturing with its own strengths in optics, precision manufacturing, and system-level integration, creating strong synergies [2] - The company aims to innovate products in smart terminals such as smartphones, wearable devices, and smart cars, leveraging its deep experience in multi-dimensional perception technologies like acoustics, haptics, and optics to provide enhanced performance and responsiveness [2] Group 2 - The company has achieved breakthroughs in optical products, with the WLG single-mold comprehensive output increasing by 6-7 times after process and major equipment upgrades, significantly surpassing traditional technologies in yield, precision, and optical performance [3] - The newly developed 1G6PWLG lens and super-light-passing prism have been adopted in the latest flagship models of clients, showcasing superior optical performance, including larger apertures, higher resolution, and thinner lens thickness compared to traditional optical lenses [3] - The super-light-passing prism, manufactured using the company's WLG integrated forming technology, increases light intake by 30%, enhancing the shooting effect of periscope telephoto lenses in complex lighting conditions while reducing module size by 10%, thus compressing smartphone thickness [3]