Core Insights - The National Highway Traffic Safety Administration (NHTSA) has closed a probe into approximately 7.4 million Stellantis vehicles without initiating a recall, citing a lack of confirmed serious injuries [1] - Stellantis has agreed to provide a 10-year extended warranty for vehicles from the 2010 to 2020 model years as part of the resolution [1] - The investigation, which began in 2019, reported 750 injuries but could not confirm any serious injuries unrelated to pre-existing medical conditions [1] Company Summary - Stellantis is the parent company of Chrysler and is involved in the automotive industry, specifically in the production of vehicles that have been under scrutiny by the NHTSA [1] - The company has taken steps to address safety concerns by offering an extended warranty, which may enhance consumer confidence in their vehicles [1] Industry Context - The closure of the NHTSA investigation reflects the regulatory environment surrounding automotive safety and the importance of consumer protection in the industry [1] - The decision not to seek a recall indicates that the NHTSA found insufficient evidence to warrant such action, which may influence future regulatory approaches to similar issues [1]

AI/ML, HPC, Cloud, Storage, and 5G/Edge, today announced...][More Releases From This Source]## Explore[Computer & Electronics][Computer Hardware][Computer Hardware][Cloud Computing/Internet of Things][News Releases in Similar Topics]---- -- Supermicro Introduces Industry's Highest Density AMD EPYC™ 4005 Series MicroBlade® for Cloud, Edge, and SaaS Workloads [Accessibility Statement] Skip Navigation- Up to 40 server nodes in a 6U enclosure- Optimized for specialized compute including e-commerce and cybersecu ...

Core Insights - Broadcom anticipates selling at least 1 million 3D stacked chips by 2027, which could generate significant revenue, potentially worth billions of dollars [2][3] Product Development - The 1 million chip projection includes various designs beyond the initial Fujitsu chip, utilizing a stacking technology that enhances data flow speed and energy efficiency [3][4] - Broadcom's stacking technology allows customers to create chips with greater processing power while consuming less energy, addressing the increasing demands of AI applications [4] Market Position - Broadcom's AI chip revenue is expected to double year-over-year to $8.2 billion in its first fiscal quarter, positioning the company as a major competitor to Nvidia and AMD in the semiconductor market [6] - The company collaborates with tech giants like Google and OpenAI to develop custom AI chips, leveraging its engineering expertise to translate designs into manufacturable chips [5][6] Manufacturing Collaboration - Fujitsu is utilizing Broadcom's technology for a data center chip, with Taiwan Semiconductor Manufacturing Co (TSMC) fabricating the chip using advanced 2-nanometer and 5-nanometer processes [7] - Broadcom plans to release two additional products based on its stacking technology in the latter half of the year and aims to sample three more designs by 2027 [8]

Core Insights - Broadcom has begun shipping the industry's first 2nm custom compute SoC utilizing its 3.5D eXtreme Dimension System in Package (XDSiP) platform, which integrates advanced semiconductor technologies for enhanced performance and efficiency [1][3] Group 1: Technology and Innovation - The 3.5D XDSiP platform is foundational for next-generation XPUs, enabling high signal density, power efficiency, and low latency to meet the demands of large-scale AI clusters [2] - The integration of 2.5D techniques and Face-to-Face (F2F) technology in the 3.5D XDSiP allows for independent scaling of compute, memory, and network I/O in a compact form factor [2][3] - The launch of this technology represents a significant milestone in semiconductor integration, combining 2nm process innovation with advanced 3D integration to enhance compute density and energy efficiency [3] Group 2: Strategic Partnerships and Market Impact - Broadcom's collaboration with Fujitsu highlights the strategic importance of the 3.5D XDSiP technology in supporting Fujitsu's FUJITSU-MONAKA initiative for high-performance, low-power processors [3] - The advancements in Broadcom's 3.5D platform capabilities are set to support a broader customer base, with shipments expected to commence in the second half of 2026 [3]

Market Analysis by covering: JPMorgan Chase & Co, Eli Lilly and Company, Oracle Corporation, Broadcom Inc. Read 's Market Analysis on Investing.com ...

Group 1 - The article does not provide any relevant content regarding the company or industry [1]

Core Viewpoint - The individual investor adopts a contrarian investment style, focusing on stocks that have recently experienced sell-offs due to non-recurrent events, particularly when insiders are buying shares at lower prices [1] Investment Strategy - The investment portfolio is split approximately 50%-50% between shares and call options, indicating a balanced approach to risk and potential returns [1] - The investor's timeframe for holding positions typically ranges from 3 to 24 months, suggesting a medium-term investment horizon [1] - Fundamental analysis is employed to assess the health of companies, including their leverage and financial ratios compared to sector and industry averages [1] Stock Selection Criteria - The investor screens thousands of stocks, primarily in the US, looking for those that have undergone recent sell-offs [1] - Professional background checks are conducted on insiders who purchase shares after sell-offs, adding a layer of due diligence to the investment process [1] Technical Analysis - Technical analysis is utilized to optimize entry and exit points, with a focus on support and resistance levels on weekly charts [1] - Multicolor lines and trend lines are used in technical analysis to identify patterns and potential price movements [1]

Group 1 - UBS reaffirmed its Buy rating and $475 price forecast for Broadcom, citing that the premium semiconductor valuation is justified by durable growth despite broader software-sector multiple compression acting as a drag on the stock [1] - A cautionary note regarding the integration of VMware was raised, with UBS warning that customer churn could increase in 2026 and 2027 as three-year contracts renew, posing a potential medium-term challenge for the enterprise segment [2] Group 2 - Arya projects that AI systems will expand by 100% in 2026 due to new deployments, and anticipates that chip vendors will pass higher memory costs to customers to protect margins against rising component expenses [3] - Broadcom shares were reported to be up 1.17% at $329.30 at the time of publication [3]

AMD 12m Price Target: $240.00 Price: $196.60 Upside: 22.1% 24 February 2026 | 12:19PM EST Equity Research Advanced Micro Devices Inc. (AMD) Meta strategic partnership improves AMD's positioning and our confidence in execution to targets +1(212)357-1366 | anmol.makkar@gs.com Goldman Sachs & Co. LLC Lal Kablan Estimate changes What happened? We increase our non-GAAP EPS (ex SBC) estimates by ~16%/17% for CY27/28 respectively, as we factor in an incremental contribution from the Meta strategic partnership. NEU ...

In this article, we will look at the 10 Best Stocks to Buy and Hold For the Next 3 Years.On February 21, David Volpe, Chief Executive Officer of Emerald Asset Management, appeared on a Schwab Network interview to discuss the state of the markets amidst the volatility and positive news from the Supreme Court regarding tariffs. Volpe noted that the news from the Supreme Court is positive; but since the market was already expecting the ruling, the response has been muted. However, he believes that volatility s ...