中信建投证券股份有限公司 关于捷邦精密科技股份有限公司 变更部分募集资金用途并向控股子公司和控股孙公司 （一）募集资金基本情况 经中国证券监督管理委员会《关于同意捷邦精密科技股份有限公司首次公开 发行股票注册的批复》（证监许可[2022]1228 号）同意注册，公司首次公开发行 人民币普通股（A 股）股票 1,810.00 万股，每股面值人民币 1.00 元，发行价格 为人民币 51.72 元/股，募集资金总额 936,132,000.00 元，扣除相关发行费用后实 际募集资金净额为人民币 836,950,333.22 元。募集资金已于 2022 年 9 月 14 日划 至公司指定账户，由天职国际会计师事务所（特殊普通合伙）于 2022 年 9 月 14 日对公司首次公开发行股票的资金到位情况进行了审验，并出具了《捷邦精密科 技股份有限公司验资报告》（天职业字[2022]41117 号）。公司已对募集资金采 取了专户存储，并与专户银行、保荐机构签订了《募集资金三方监管协议》。 （二）募集资金使用情况 根据《首次公开发行股票并在创业板上市招股说明书》披露的募集资金投资 项目使用计划，截至 2025 年 6 月 ...

中信建投证券股份有限公司 关于捷邦精密科技股份有限公司部分募投项目 增加实施主体及实施地点并开立募集资金专户的核查意见 中信建投证券股份有限公司（以下简称"中信建投证券"或"保荐机构"） 作为捷邦精密科技股份有限公司（以下简称"捷邦科技"或"公司"）首次公开 发行股票并在创业板上市的保荐机构，根据《证券发行上市保荐业务管理办法》 《深圳证券交易所上市公司自律监管指引第 13 号——保荐业务》《深圳证券交 易所创业板股票上市规则》《深圳证券交易所上市公司自律监管指引第 2 号—创 业板上市公司规范运作》等相关规定，对捷邦科技部分募投项目增加实施主体及 实施地点并开立募集资金专户的事项进行了审慎核查，具体情况如下： 根据《首次公开发行股票并在创业板上市招股说明书》，公司的募投项目及 募集资金（不含超募资金）的使用计划具体如下： 单位：万元 | 序号 | 项目名称 | 总投资 | 拟使用募集资金 | | --- | --- | --- | --- | | 1 | 高精密电子功能结构件生产基地建设项目 | 37,200.00 | 35,200.00 | | 序号 | | 项目名称 | 总投资 | 拟使用募集资金 | ...

捷邦精密科技股份有限公司 2025 年半年度报告全文 捷邦精密科技股份有限公司 2025 年半年度报告 2025-061 2025 年 8 月 1 捷邦精密科技股份有限公司 2025 年半年度报告全文 第一节 重要提示、目录和释义 公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容 的真实、准确、完整，不存在虚假记载、误导性陈述或者重大遗漏，并承担 个别和连带的法律责任。 公司负责人辛云峰、主管会计工作负责人潘昕及会计机构负责人(会计主 管人员)易慧芳声明：保证本半年度报告中财务报告的真实、准确、完整。 所有董事均已出席了审议本次半年报的董事会会议。 本报告中所涉及的未来计划、发展战略等前瞻性陈述，不构成公司对投资 者的实质承诺，投资者及相关人士均应当对此保持足够的风险认识，并且应 当理解计划、预测与承诺之间的差异，敬请投资者注意投资风险。 公司在经营管理中可能面临的风险与对策举措已在本报告"第三节 管理 层讨论与分析"之"十、公司面临的风险和应对措施"部分予以描述。敬请 广大投资者关注，并注意投资风险。 公司计划不派发现金红利，不送红股，不以公积金转增股本。 2 | 第二节 | 公司简介和主要财 ...

Core Viewpoint - Suzhou Tianmai, a leading thermal management technology company, demonstrates strong revenue growth driven by the consumer electronics and new energy sectors, showcasing its robust R&D capabilities and market competitiveness [1] Financial Performance - In the first half of 2025, Suzhou Tianmai achieved operating revenue of 508 million yuan, a year-on-year increase of 11.20% [1] - The net profit attributable to shareholders was 94.454 million yuan, a slight decrease of 2.14% year-on-year [1] - The company reported a healthy cash flow, with a net cash flow from operating activities of 105 million yuan and cash received from sales and services amounting to 548 million yuan [2] - Total assets reached 1.74 billion yuan by the end of the reporting period [2] Technological Advantages - Suzhou Tianmai focuses on the research and application of thermal conductive and heat dissipation products, aiming to be a leading provider of comprehensive thermal management solutions [3] - The company holds 98 patents, including 17 invention patents, with several more pending [3] - R&D investment in the first half of 2025 reached 45.0065 million yuan, reflecting a year-on-year increase of 32.91%, with an R&D expense ratio of 8.86% [3] Customer Resources and Market Diversification - With over a decade of experience in the thermal management field, Suzhou Tianmai has established a strong customer base, supplying products to renowned brands such as Samsung, OPPO, vivo, Huawei, and NIO [4] - The company maintains good relationships with various domestic and international consumer electronics manufacturers, including BYD, Foxconn, and others [4][5] - This diversified customer structure reduces operational risks and provides more opportunities for sustained growth [5] Future Outlook - The company plans to closely monitor industry technologies, customer needs, market trends, and policy changes to optimize production processes [6] - With the rapid development of technologies such as 5G, artificial intelligence, and the Internet of Things, the demand for efficient heat dissipation solutions is expected to grow [6][7] - Suzhou Tianmai is well-positioned to seize market opportunities arising from this technological innovation wave [6][7]

Group 1 - The consumer electronics sector experienced a significant upward trend on August 26, with companies like Jingyan Technology and Dongni Electronics both rising by 8% [1] - Other companies such as Lingyi iTech and Jiebang Technology saw increases of over 5% [1] - Stocks like *ST Bowang and Kechuan Technology also followed the upward trend [1]

Core Viewpoint - Jebang Technology announced a total external guarantee amount of RMB 720.70 million for the year 2025, which accounts for 56.42% of the company's latest audited net assets attributable to shareholders [1] Summary by Relevant Sections - **External Guarantee Amount** The total external guarantee amount approved by the shareholders' meeting for 2025 is RMB 720.70 million [1] - **Proportion of Net Assets** This new guarantee represents 56.42% of the company's most recent audited net assets attributable to shareholders [1] - **Actual Guarantee Balance** After the new guarantee, the actual total balance of guarantees provided by the company is RMB 115.57 million, which is 9.05% of the latest audited net assets attributable to shareholders [1] - **No External Guarantees** The company and its subsidiaries have not provided guarantees to entities outside the consolidated financial statements [1] - **No Overdue Guarantees** There are no overdue guarantees, and there are no guarantees involved in litigation or resulting in losses due to adverse judgments [1]

证券代码：301326 证券简称：捷邦科技 公告编号：2025-058 捷邦精密科技股份有限公司 关于对外担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、担保情况概述 捷邦精密科技股份有限公司（以下简称"公司"）于2025年4月23日召开第 二届董事会第十八次会议和第二届监事会第十五次会议，于2025年5月16日召开 2024年年度股东大会，审议通过《关于2025年度对外担保额度预计的议案》，同 意公司为合并报表范围内下属公司提供担保，2025年度担保额度总计不超过人民 币72,070.00万元（或等值外币）。其中，公司为最近一期资产负债率70%以上的 下属公司提供担保的额度预计不超过人民币19,070万元；公司为最近一期资产负 债率70%以下的下属公司提供担保的额度预计不超过人民币53,000万元，额度在 授权期限内可循环使用。 上述担保额度可在被担保方之间按照实际情况调剂使用。担保额度的期限自 公司2024年年度股东大会审议通过之日起至2025年年度股东大会召开之日止，该 额度在授权期限内可循环使用。 具体内容详见公司于 2025 年 ...

Company Overview - Jebon Technology, established on June 28, 2007, is located in Dongguan, Guangdong Province, and specializes in the production of customized precision functional and structural components [1] - The company was listed on September 21, 2022, and operates within the electronic industry, specifically in consumer electronics and components [1] Stock Performance - As of August 22, Jebon Technology's stock price decreased by 2.06% to 95.88 CNY per share, with a total market capitalization of 6.947 billion CNY [1] - Year-to-date, the stock has increased by 31.16%, but has seen a decline of 5.83% over the last five trading days [1] - Over the past 20 days, the stock price has risen by 33.13%, and over the last 60 days, it has increased by 47.89% [1] Financial Metrics - For the period from January to March 2025, Jebon Technology reported a revenue of 166 million CNY, reflecting a year-on-year growth of 1.66% [2] - The company has distributed a total of 43.2365 million CNY in dividends since its A-share listing [2] Shareholder Information - As of March 31, 2025, the number of shareholders decreased by 7.86% to 6,915, while the average number of shares held per shareholder increased by 8.53% to 3,886 shares [2] - Among the top ten circulating shareholders, Invesco Great Wall Research Selected Stock A is the fourth largest, holding 1.4313 million shares, a decrease of 111,300 shares from the previous period [2]

Market Overview - On August 21, the consumer electronics sector declined by 1.77%, with Hongfu Han leading the drop [1] - The Shanghai Composite Index closed at 3771.1, up 0.13%, while the Shenzhen Component Index closed at 11919.76, down 0.06% [1] Stock Performance - Notable gainers in the consumer electronics sector included: - Zhuoman Technology (002369) with a closing price of 10.56, up 10.00% [1] - Kosen Technology (603626) at 13.87, up 9.99% [1] - Laimu Co., Ltd. (603633) at 10.81, up 9.97% [1] - Other significant performers included: - Lixun Precision (002475) at 42.19, up 5.34% with a trading volume of 200.68 million shares [1] - Lens Technology (300433) at 28.34, up 4.92% with a trading volume of 166.06 million shares [1] Capital Flow - The consumer electronics sector experienced a net outflow of 3.368 billion yuan from institutional investors, while retail investors saw a net inflow of 2.901 billion yuan [2] - The overall capital flow indicates a mixed sentiment, with institutional investors withdrawing funds while retail investors increased their positions [2] Individual Stock Capital Flow - Lixun Precision (002475) had a net inflow of 796 million yuan from institutional investors, but a net outflow of 339 million yuan from retail investors [3] - Zhuoman Technology (002369) saw a net inflow of 284 million yuan from institutional investors, with a net outflow of 126 million yuan from retail investors [3] - Kosen Technology (603626) had a net inflow of 181 million yuan from institutional investors, while retail investors experienced a net outflow of 683.57 million yuan [3]

Core Viewpoint - The article discusses the upcoming changes in Apple's iPhone series, particularly focusing on the heat dissipation technology and materials used in the iPhone 17 and future models, highlighting the shift towards advanced materials like graphene and aluminum alloys for improved performance and efficiency [2][3][4]. Group 1: iPhone 17 Heat Dissipation Technology - The iPhone 17 will utilize a dual-layer graphene heat dissipation system, with costs increasing by approximately 50% to 60%, bringing the total cost of the heat dissipation module to around $5.2 [4][5]. - The previous iPhone 16 model introduced graphene for the first time, significantly enhancing thermal conductivity by over five times compared to traditional metal materials [3][4]. - The heat dissipation module's cost is relatively low at about $2.5, but when including related components, the overall cost impact is substantial [4]. Group 2: Material Changes and Supplier Insights - The iPhone 17 will replace the titanium-aluminum alloy frame with an aluminum alloy frame, which is expected to improve thermal performance despite titanium's advantages in strength and aesthetics [7][8]. - Key suppliers for the heat dissipation components include Zhongshi Technology and Jieban Technology for graphene, while VC heat spreaders are supplied by companies like Risen Technology and Lingyi Technology [9][10]. - Future models, such as the iPhone 18, may explore new materials like carbon fiber for back panels and frames, with potential suppliers like Changzhou Carbon Technology showing promise in this area [16]. Group 3: Future Trends in Heat Dissipation Solutions - Apple is researching liquid cooling solutions for heat dissipation, although this technology is still in early stages and may not be implemented in smartphones for the next two years [11][12]. - Competitors like Huawei and Xiaomi primarily use traditional heat dissipation methods, while companies like Suzhou Tianmai and Siquan New Materials are key suppliers for these brands [13][14]. - The industry is witnessing a trend towards modular heat dissipation systems that combine various materials for optimized performance, indicating a shift in design philosophy across smartphone manufacturers [6][11].