Lam Research (NasdaqGS:LRCX) Q2 2026 Earnings call January 28, 2026 05:00 PM ET Speaker9Good day, and welcome to the Lam Research Corporation December 2025 earnings conference call. All participants will be in listen-only mode. Should you need assistance, please signal a conference specialist by pressing the star key followed by zero. After today's presentation, there will be an opportunity to ask questions. To ask a question, you may press star, then one on a touch-tone phone. To withdraw your question, pl ...

Core Insights - United Microelectronics Corporation (UMC) reported a consolidated revenue of NT$61.81 billion (US$1.97 billion) for Q4 2025, marking a 4.5% increase from Q3 2025 and a 2.4% increase year-on-year [1] - The company's earnings per share (EPS) for Q4 2025 was NT$0.81 (US$0.129), with net income attributable to shareholders of NT$10.06 billion (US$320 million) [1] - UMC's 22/28nm technology revenue contributed 36% to wafer revenue, with a significant 31% quarter-on-quarter increase in 22nm revenue [1] Financial Performance - Q4 2025 operating revenues reached NT$61.81 billion, up from NT$59.13 billion in Q3 2025, and NT$60.39 billion in Q4 2024 [1] - Gross profit for Q4 2025 was NT$18.96 billion, representing a gross margin of 30.7% [1] - Operating income increased by 10.0% quarter-on-quarter to NT$12.23 billion [1] Capacity and Utilization - UMC's wafer shipments in Q4 2025 were 994K, a slight decrease of 0.6% from Q3 2025, with an overall capacity utilization rate of 78% [1] - Total capacity for Q4 2025 was 1,305K 12-inch equivalent wafers, expected to decrease to 1,283K in Q1 2026 due to annual maintenance [1] Strategic Initiatives - UMC is focusing on expanding its footprint in the U.S. through partnerships, including a collaboration with Intel on 12nm technology and a Memorandum of Understanding with Polar Semiconductor [1] - The company inaugurated a Circular Economy and Recycling Innovation Center aimed at reducing waste generated by its Taiwan fabs by up to one-third [2] Market Outlook - UMC anticipates firm wafer demand in Q1 2026, with expectations for continued growth in 2026 driven by advancements in 22nm platforms and new solutions [1] - The company aims to leverage advanced packaging and silicon photonics as new growth catalysts to meet the evolving needs of high-performance applications across various sectors [1]

Summary of ASMPT (0522.HK) Conference Call Company Overview - **Company**: ASMPT - **Industry**: Semiconductor and LED assembly and packaging equipment supplier - **Founded**: 1975 - **Market Cap**: HK$42,530 million (US$5,453 million) [7] Key Points Target Price and Valuation - **Target Price**: Raised to HK$125 based on a peak valuation of 35x P/E for 2026E, reflecting strong sector re-rating and potential from SMT business reassessment [1][5] - **Historical Valuation**: ASMPT shares have typically traded at 15x-25x forward P/E, but could break out of this range as it transitions to a pure SEMI play [5] Earnings Projections - **2026E Net Profit**: Estimated at HK$1.475 billion with a diluted EPS of HK$3.53, representing an 847.2% growth from 2025E [6][10] - **2027E Net Profit**: Expected to rise to HK$1.995 billion with a diluted EPS of HK$4.78, a 35.3% increase from 2026E [6][10] Strategic Business Moves - **SMT Divestiture**: ASMPT is exploring strategic options for its SMT business, including divestiture, which could enhance share valuation by focusing solely on SEMI and advanced packaging (AP) [3][10] - **SOTP Analysis**: Suggests a value per share exceeding HK$130, with SEMI/SMT net profit estimates of HK$1.0 billion/HK$475 million in 2026E and HK$1.2 billion/HK$753 million in 2027E [4][10] Industry Dynamics - **OSAT Capex Growth**: Increased capital expenditure in advanced packaging driven by robust demand in high-performance computing (HPC) is expected to benefit AP equipment vendors [2] - **AI-Driven Demand**: ASMPT is positioned to benefit from rising demand for AI-driven advanced packaging solutions, particularly in TCB (Through Silicon Via) applications [24][25] Risks - **Downside Risks**: Include potential slowdown in AI infrastructure investment, loss of TCB market share, reduced demand due to alternative technologies, intensifying competition, and export restrictions affecting back-end equipment [26] Financial Metrics - **2023A Net Profit**: HK$715 million with a diluted EPS of HK$1.73, reflecting a -72.7% decline [6] - **2024A Net Profit**: Expected to drop to HK$345 million with a diluted EPS of HK$0.83, a -51.9% decrease [6] - **2025E Net Profit**: Projected at HK$155 million with a diluted EPS of HK$0.37, a -55.2% decline [6] Market Performance - **Expected Share Price Return**: 22.8% with an expected total return of 24.9% [7] - **Dividend Yield**: Expected at 2.1% for 2026E [7] Conclusion - ASMPT is positioned for significant growth driven by strategic divestitures and increasing demand in the semiconductor industry, particularly in advanced packaging solutions. The company's focus on transforming into a pure SEMI play is expected to unlock additional shareholder value.

Core Viewpoint - The A-share market showed positive momentum with the ChiNext 50 Index increasing by 4%, driven by strong performance in the storage chip sector and significant trading volume in the ChiNext 50 ETF [1] Group 1: Market Performance - The ChiNext 50 Index opened lower but turned positive, with a maximum increase of 4.29% for the ChiNext 50 ETF (588000) [1] - The trading volume for the ChiNext 50 ETF reached 4.643 billion yuan [1] Group 2: Sector Highlights - The storage chip sector was particularly active, with Longxin Zhongke hitting the daily limit, Haiguang Information rising by 16.05%, and other companies like Lanke Technology and Zhongkong Technology also showing significant gains [1] - The electronic industry constitutes 70.35% of the holdings in the ChiNext 50 Index, aligning well with the development of advanced sectors such as artificial intelligence and robotics [1] Group 3: Future Outlook - Open Source Securities anticipates that TSMC's increased capital expenditure will boost expectations for advanced process capacity expansion [1] - High-end advanced packaging, essential for AI chips, is expected to see significant demand growth as manufacturing capacity is released [1] - Investors optimistic about China's hard technology development are encouraged to continue monitoring the sector [1]

Summary of Key Points from Conference Call Records Industry Overview - The focus is on the advanced packaging sector, particularly in the semiconductor testing and packaging industry, which is experiencing heightened market attention due to capacity constraints and rising material costs [1][2]. Core Insights and Arguments 1. **CoWoS Capacity Shortage** TSMC's CoWoS (Chip on Wafer on Substrate) is undergoing continuous expansion, yet the capacity remains insufficient. This has led to demand overflow to other packaging and testing companies such as ASE and KYEC, resulting in tight capacity [1]. 2. **Rising Material Costs** The prices of precious metals like gold, silver, and copper are on the rise, with gold prices increasing over 70%, silver prices rising over 170%, and copper prices up approximately 36% from early to late 2025. This surge in material costs is expected to lead to price hikes in metal packaging materials [1]. 3. **Strong Demand for Storage** The demand for storage solutions, particularly from DRAM and NAND Flash manufacturers, is robust. Companies like Powertech, HwaCom, and Nanya are seeing a surge in orders, pushing capacity utilization rates to near full capacity. Recent price adjustments for testing and packaging services have reached increases of up to 30% [2]. 4. **Potential for Further Price Increases** Several packaging companies have indicated that due to overwhelming orders, there may be a second wave of price increases in the near future [3]. 5. **Increased Capital Expenditure (Capex) Projections** - TSMC's capital expenditure for 2026 is expected to exceed initial forecasts. - ASE has continuously raised its capex projections. - KYEC's capex for 2026 is projected to reach a historical high of 39.4 billion New Taiwan Dollars. - Changdian Technology is also increasing investments, with a capex of 8.5 billion for 2025. - Tongfu Microelectronics is planning a total investment of approximately 3.5 billion for storage and computing testing projects. - Yongxi Electronics intends to invest 2.1 billion for a factory in Malaysia. This indicates that 2026 will be a significant year for capital expenditures in both domestic and international packaging companies, benefiting upstream equipment and materials sectors [4]. Other Important Insights - The overall trend in the semiconductor packaging industry suggests a tightening of capacity and increasing costs, which could present both challenges and opportunities for investors in related sectors. The anticipated capital expenditures signal a strong commitment to growth and expansion within the industry [4].

Summary of JCET Group Co Ltd Conference Call Company Overview - **Company**: JCET Group Co Ltd (600584.SS) - **Industry**: Semiconductor, specifically Outsourced Semiconductor Assembly and Test (OSAT) - **Region**: Asia Pacific, Greater China Key Points and Arguments Market Outlook - **OSAT Market Growth**: The OSAT market is expected to benefit from strong semiconductor sales growth, projected to accelerate from 25% in 2025 to 45% in 2026, driven by AI demand [2][9] - **Revenue Projections**: JCET's revenue is expected to grow by 16% in 2026, up from 8% in 2025, reflecting the overall semiconductor cycle [2][9] Advanced Packaging - **2.5D Packaging**: JCET has launched its XDFOI™ platform, with 2.5D packaging entering volume production in Q3 2025. This segment is expected to contribute approximately US$714 million in revenue, accounting for 10% of total revenue by 2027 [3][11] - **Long-term Profitability**: While near-term profitability is uncertain due to high depreciation and R&D investments, the advanced packaging business is anticipated to be margin-accretive in the long run [3][11] Consumer Business Challenges - **Memory Price Hikes**: The consumer segment, which accounts for 60% of JCET's revenue, is expected to face challenges due to memory price hikes impacting unit growth in the PC and smartphone markets in 2026 [4][17] - **Outsourcing Opportunities**: Despite challenges, increased demand for memory is likely to boost back-end demand, with JCET benefiting from Chinese memory IDMs outsourcing their back-end packaging business [4][17] Financial Performance and Valuation - **Stock Rating Change**: The stock rating has been adjusted from Underweight to Equal-weight, with a price target raised from Rmb23.50 to Rmb48.50 [1][5] - **Current Stock Performance**: JCET's stock has increased by 26% year-to-date, outperforming the Shanghai Composite Index, which rose by 2% during the same period [5] - **Valuation Comparison**: JCET trades at a 2026 P/E of 32x, higher than ASE's 21x, indicating that current prices may reflect the positives of advanced packaging [5][19] Risks and Considerations - **Profitability Uncertainty**: There are concerns regarding the profitability of 2.5D/3D packaging due to high depreciation and R&D costs, which may weigh on near-term earnings [19] - **Policy Risks**: JCET has significant exposure to overseas markets (81% in 2024) and has been affected by US OSAT regulations, creating uncertainty regarding future operations [19] Earnings Estimates - **Revised Estimates**: The 2025 EPS estimate has been lowered by 12%, while 2026 and 2027 EPS estimates have been raised by 7% and 19%, respectively, reflecting expectations of improved margins and revenue from advanced packaging and memory outsourcing [23][24] Conclusion - **Investment Thesis**: The outlook for JCET is cautiously optimistic, with expected revenue growth driven by advanced packaging and AI demand, despite challenges in the consumer segment and potential risks from policy changes and profitability uncertainties [37][19]

Summary of SkyWater Technology Conference Call Company Overview - **SkyWater Technology** is the largest exclusively U.S.-based pure-play semiconductor foundry, serving both commercial and U.S. defense customers. The company operates facilities in Minnesota, Florida, and Texas, focusing on foundational nodes and advanced packaging to support critical infrastructure and supply chain resilience [1][9][10]. Core Business Model - SkyWater employs a **technology as a service** model, which emphasizes monetized R&D capabilities and partnerships with the U.S. government for domestic sourcing. The company has shifted focus from aerospace and defense to include quantum foundry technologies [9][10][14]. Facilities and Capabilities - **Minnesota**: Development center focusing on aerospace, defense, and quantum technologies. - **Florida**: Advanced packaging center with a $120 million program for wafer fan-out solutions, expected to produce prototypes in the second half of the year. - **Texas**: Volume manufacturing facility acquired to diversify into industrial and automotive sectors, enhancing scalability [10][12][14]. Market Trends and Positioning - There is a growing demand for U.S.-made semiconductors, driven by the need for critical infrastructure and supply chain resilience post-COVID. SkyWater aims to capture this demand by focusing on non-consumer markets [13][14]. - The company anticipates an upcycle in semiconductor demand and is positioned to benefit from emerging technologies, particularly in quantum computing and advanced packaging [13][14]. Federal Funding Environment - The federal funding landscape remains unpredictable, with potential government shutdowns impacting budgets. However, SkyWater has developed a strong A&D business and is prepared to navigate these challenges [19][20]. - Increased defense budgets are expected to positively impact SkyWater's ATS (Advanced Technology Services) business [21][22]. Fab 25 Insights - Fab 25 is the most advanced 200-millimeter fab in the U.S., currently producing 65-nanometer NOR Flash products and qualifying 45-nanometer products. The facility is expected to generate approximately **$80 million in quarterly revenue** [26][30]. - The acquisition of Fab 25 has increased SkyWater's wafer capacity from 100,000 to 500,000 wafers annually and added 180 engineers, enhancing ATS revenue potential [27][28]. Quantum Computing Business - SkyWater services various qubit modalities, including silicon, superconducting, and ion trap qubits. The company has established unique capabilities in cryo-electronics and advanced packaging, which are critical for quantum technologies [35][36]. - The quantum computing segment is projected to grow at a **30% rate**, with expectations for continued customer acquisition and product development [42][43]. Revenue Outlook - SkyWater anticipates total revenue of around **$600 million** for 2026, with significant contributions from Fab 25 and customer-funded tooling [44][46]. - The company is focused on converting ATS customers to wafer services, with timelines varying based on technology maturity [49][50]. Risks and Opportunities - Potential risks include delays in government funding and reliance on Infineon for revenue. However, there are numerous opportunities for growth, particularly if government budgets are released as expected [47][48]. - The company is exploring partnerships with Asian foundries to enhance domestic sourcing capabilities, which could provide additional revenue streams [55][56]. Strategic Goals - SkyWater's primary goals include executing A&D platforms, establishing the quantum foundry, and transitioning the Texas facility to a foundry model while backfilling it with new customers [59][60]. This summary encapsulates the key points discussed during the conference call, highlighting SkyWater Technology's strategic positioning, market trends, and future outlook.

Summary of Nova (NasdaqGS:NVMI) FY Conference Call - January 14, 2026 Company Overview - **Company**: Nova (NasdaqGS:NVMI) - **Event**: 28th Annual Needham Growth Conference - **Key Speaker**: Guy Kizner, CFO Industry Insights - **Semiconductor Industry Growth**: The semiconductor industry is expected to reach $1 trillion in revenues by 2026, driven by demand from AI, data centers, automotive, and industrial sectors [4][5] - **Investment Trends**: Customers are making long-term capacity investments, particularly in advanced nodes and memory, with a focus on DRAM and advanced packaging [3][5] Financial Performance and Projections - **2026 Outlook**: Nova anticipates a growth year in 2026, with a second-half weighting due to project timing rather than demand [3][5] - **Revenue Target**: The company is on track to meet its $500 million cumulative revenue target from Gate-All-Around technology by 2026 [8] - **Advanced Packaging Growth**: Advanced packaging revenue is projected to grow from 10% in 2023 to around 20% in 2026, driven by both inorganic acquisitions and organic product adjustments [12][14] Market Segments - **Leading Edge Logic**: The transition from FinFET to Gate-All-Around is enhancing Nova's position in metrology, with significant growth expected from major players like TSMC, Intel, Samsung, and Rapidus [7][9] - **Memory Market**: DRAM is a key growth driver, with Nova well-positioned among top spenders. However, the NAND market is currently focused on upgrades rather than capacity expansions [15][16][17] - **China Market**: Nova's exposure to China is expected to decrease percentage-wise but increase in dollar terms. The company does not view China as a growth market for 2026 [18][19] Competitive Landscape - **Market Position**: Nova holds over 70% market share in integrated metrology and is growing in the optical CD standalone segment, competing with Onto and KLA [22][24] - **Chemical Metrology**: Nova has a strong presence in the backend of the process, while KLA dominates the front end [25] - **Chinese Competitors**: Local Chinese players are emerging, but Nova maintains a technological edge [26][27] M&A Strategy - **Capital Allocation**: Nova raised $750 million through convertible notes to fund M&A opportunities, focusing on companies that align with their financial model and offer clear synergies [29][30][31] - **Target Criteria**: The company seeks acquisitions that are accretive to EPS within 12 months and fit their operational and financial criteria [30][31] Long-term Goals - **Revenue Target for 2027**: Nova aims to achieve $1 billion in revenue by 2027, with a commitment to organic growth supplemented by potential acquisitions [32][33] - **Growth Trajectory**: The company plans to double revenues every five years, with a focus on maintaining long-term targets rather than adjusting based on short-term performance [35][36] Conclusion - Nova is positioned for significant growth in the semiconductor industry, with a strong focus on advanced technologies and strategic investments. The company is committed to achieving its long-term revenue targets while navigating competitive and market dynamics effectively.

Q3 2025 Financial Performance - SkyWater achieved record Q3 2025 revenues of $150.7 million, exceeding the high end of the guidance range by over $9 million[7] - GAAP gross profit reached $36.2 million with a gross margin of 240%[125] - Adjusted EBITDA was $25.8 million, significantly surpassing forecasts[128] - Net income was $144 million, representing 95.5% of total revenue[128] Q4 2025 Guidance - The company expects Q4 2025 total revenues to be in the range of $155 million to $165 million[55] - SkyWater Texas revenue is projected to be between $84 million and $88 million[55] - Tools revenue is expected to be $17 million to $18 million, with a revised full-year expectation of $23 million to $24 million[55] - Adjusted EBITDA is guided to be in the range of $16 million to $22 million, with an adjusted EBITDA margin between 12.2% and 16.8%[146] Business Highlights and Growth Drivers - SkyWater anticipates strong growth in quantum computing customer revenues, expecting to exceed 30% in 2025[12] - The acquisition of Fab 25 in Texas has led to higher-than-expected revenue and profitability, with SkyWater now operating as two distinct reportable segments[12] - Advanced Packaging revenues are starting to ramp in Florida, with tool installations scheduled for completion in early 2026[12] - The company's acquisition added approximately 400,000 wafer/year capacity to the 200mm U S foundry supply base[29]

January 2026 Investor Presentation Forward-Looking Statements; Non-GAAP Financial Measures This presentation contains forward-looking statements within the meaning of the U.S. Securities Exchange Act of 1934 and the Securities Act of 1933. The forward-looking statements include statements concerning, among other things, our future business model and strategies, our financial model and structure, market and market share growth, industry trends, customer demand and growth opportunities. In some instances, you ...