Core Viewpoint - LG Electronics is entering the semiconductor equipment market by developing hybrid bonding machines for high bandwidth memory (HBM), aligning with the company's focus on artificial intelligence (AI) and B2B business expansion [1][2]. Group 1: Development and Market Strategy - LG Electronics' Production Engineering Research Institute (PRI) has begun developing hybrid bonding machines, crucial for next-generation HBM manufacturing, with a goal to achieve mass production by 2028 [1][2]. - The company aims to compete with established players like Samsung Electronics, Hanwha Semiconductor, and Hynix in the HBM manufacturing equipment market [1][3]. - The successful development of hybrid bonding machines could significantly increase sales and establish LG Electronics as a leader in the semiconductor equipment market [2]. Group 2: Technology and Innovation - Hybrid bonding machines are seen as a revolutionary technology that allows for chip stacking without the need for bumps, offering advantages such as thinner combined chips and lower heat generation, which are critical for multi-layer DRAM in HBM [2]. - This technology is currently applied in NAND flash and system semiconductors but has not yet been commercialized for HBM [2]. Group 3: Competitive Landscape - Leading companies in the semiconductor hybrid bonding machine sector include BE Semiconductor Industries NV and Applied Materials, but LG Electronics has opportunities due to the strong interest from SK Hynix and Samsung in domestic equipment production [3]. - Samsung plans to start using hybrid bonding machines for its sixth-generation HBM (HBM4) this year, while SK Hynix may apply the technology to its seventh-generation product (HBM4E) [3].