公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容 编译自 chosun 。 SEMECS、韩华半导体和韩美半导体三家公司在高带宽存储器（HBM）核心半导体设备TC键合机 （TC Bonder）的竞争中处于白热化阶段，目前正加速混合键合机的量产准备工作，预计该设备将从 第六代HBM（HBM4）生产开始部分采用。三星电子和SK海力士已进行HBM4的量产测试，目前的 关键在于设备价格（比现有TC键合机高出两倍以上）以及与美国和荷兰制造的设备相比，能否确保 技术竞争力和稳定性。 据业内人士12日透露，三星电子子公司SEMECS正在与三星电子半导体（DS）部门的下一代HBM （高密度存储器）专职人员合作，对混合键合机设备进行评估。尽管目前尚未达到目标性能，但双方 正共同努力攻克DRAM堆叠和热控制等多项技术难题。SEMECS的目标是在今年年底或明年向三星电 子提供能够量产的混合键合机。 混合键合机被称为下一代HBM市场的"游戏规则改变者"。目前用于HBM制造的TC键合机通过对凸块 （例如焊料的导电凸块）施加热量和压力来堆叠芯片。相比之下，混合键合机无需单独的凸块即可连 接芯片，使其成为制造20层或更高层数 ...

Core Viewpoint - The storage market is undergoing significant changes, with HBM technology becoming a strategic focal point for leading companies like SK Hynix, Samsung, and Micron, as they compete for future revenue growth [3][4][18]. Group 1: DRAM Market Dynamics - SK Hynix has maintained its position as the global leader in the DRAM market, increasing its market share from 36.9% in Q1 to 39.5% in Q2, while Samsung's share decreased from 34.4% to 33.3% [2]. - In terms of revenue, SK Hynix reported $12.226 billion in Q2, surpassing Samsung's $10.3 billion by over $1.9 billion, marking a significant shift in the competitive landscape [2]. - The ongoing transition in the DRAM market is characterized by a focus on HBM technology, which is expected to drive future growth [3][10]. Group 2: HBM Technology and Customization - HBM has evolved into a critical component for high-performance AI chips, with SK Hynix and Micron entering the final testing phase for the sixth generation of HBM (HBM4), set to supply NVIDIA [3][4]. - SK Hynix is positioned as the primary supplier for NVIDIA's HBM4, with expectations to finalize supply contracts by September [4]. - Customization of HBM products is becoming increasingly important, with SK Hynix already engaging with major clients like NVIDIA and Microsoft to develop tailored solutions [5][6]. Group 3: DDR4 Market Resurgence - The unexpected resurgence of DDR4 memory prices is attributed to supply shortages following announcements from major manufacturers to halt production by the end of 2025 [7][8]. - Current market prices for DDR4 have surged, with the average spot price for DDR4 16Gb reaching $16, significantly higher than DDR5 prices [7]. - Both Samsung and SK Hynix are reconsidering their plans to phase out DDR4, extending production timelines due to the profitability of older chips [8]. Group 4: Equipment and Technological Advancements - The introduction of High NA EUV equipment by SK Hynix is set to enhance DRAM production capabilities, allowing for finer circuit patterns and increased integration [13][14]. - The competition in the semiconductor equipment sector is intensifying, particularly with the development of hybrid bonding technology, which promises to improve performance and efficiency in HBM production [14][15]. - Companies like BESI and Applied Materials are leading the charge in hybrid bonding technology, which is expected to reshape the semiconductor equipment landscape [15][16]. Group 5: Future Outlook - The competition in the DRAM market is expected to escalate, particularly as companies adapt to the evolving demands of the AI era [18]. - The integration of various technologies and collaborative efforts among industry players will be crucial for success in the increasingly complex semiconductor ecosystem [18].

Core Insights - Advanced packaging is becoming a key driver for the growth of the back-end equipment market, with total revenue expected to reach approximately $6.9 billion in 2025 and grow to $9.2 billion by 2030, reflecting a compound annual growth rate (CAGR) of 5.8% [2] - The growth is primarily driven by technologies used for building HBM stacks, chiplet modules, and high I/O substrates, reshaping the supply chain and market dynamics for foundries, IDMs, and OSATs [2][3] - The demand for high bandwidth, proximity, and power efficiency in AI and high-performance computing is pushing the need for advanced packaging solutions [3] Back-End Equipment Market Overview - The back-end equipment market is experiencing strong growth due to advanced packaging, AI acceleration, and heterogeneous integration [2] - The market is expected to see significant contributions from high-precision bonding machines, thermal compression bonding (TCB), and hybrid bonding technologies [3][6] Thermal Compression Bonding (TCB) - TCB is currently the leading technology, with revenue projected to grow from approximately $542 million in 2025 to about $936 million by 2030, representing a CAGR of 11.6% [6] - Major players in TCB include Hanmi, ASMPT, and others, with significant orders tracking the ramp-up of HBM3E capacity [6][11] Hybrid Bonding - Hybrid bonding is identified as a strategic driver for future chiplet and HBM generations, with revenue expected to rise from about $152 million in 2025 to approximately $397 million by 2030, showing a CAGR of 21.1% [11] - The technology is gaining traction due to its potential in logic-to-memory stacking, although its application is still limited by material and process maturity [11][12] Flip Chip Bonding - The flip chip bonding market is projected to grow from approximately $492 million in 2025 to $622 million by 2030, driven by demand from AI accelerators and large network ASICs [17] - The technology is evolving towards no flux processes to enhance reliability and reduce residues [17] Wafer Thinning and Preparation - The wafer thinning market is expected to reach about $582 million in 2025 and grow to approximately $845 million by 2030, driven by the adoption of TSV and ultra-thin die in memory and logic stacking [19] - Key players in this segment include DISCO and ACCRETECH, with challenges related to precision and stress management [19] Structural Changes in Packaging - The packaging process is becoming integral to system performance, with bandwidth and energy consumption targets being addressed at the interposer and stack levels [21] - The integration of front-end process control into packaging production is creating a clear growth hierarchy, with traditional bonding machines experiencing low single-digit CAGR while TCB and hybrid bonding show steep growth curves [22]

Core Viewpoint - Hanmi Semiconductor reported a significant increase in revenue and operating profit for Q2, driven by the sales growth of its key equipment, the Thermal Compression (TC) Bonder, which is essential for high bandwidth memory (HBM) production [2]. Group 1: Financial Performance - In Q2, Hanmi Semiconductor achieved a consolidated revenue of 180 billion KRW, representing a year-on-year growth of 45.8% [2]. - The operating profit reached 86.3 billion KRW, marking a 55.7% increase, with an operating profit margin of 47.9% [2]. Group 2: Investment and Expansion Plans - The company plans to invest 100 billion KRW in hybrid bonding technology and aims to launch hybrid bonding equipment by the end of 2027 [2]. - Hanmi Semiconductor will construct a hybrid bonding machine factory in Incheon, with an investment of 100 billion KRW, expected to be completed by the second half of next year [2]. Group 3: Product Development - Hanmi Semiconductor has commenced production of the TC Bonder 4, designed for the sixth generation of HBM (HBM4), which offers a 60% performance improvement over HBM3E while consuming only 70% of its power [3]. - The new TC Bonder 4 can stack up to 16 layers of DRAM chips, increasing the capacity from 24 GB to 32 GB per chip [3]. - The company has established a mass production system for TC Bonder 4 to support global memory manufacturers in launching HBM4 [3]. Group 4: Team Formation - A specialized team named "Silver Phoenix" has been formed, consisting of over 50 experienced engineers to support the customization, maintenance, and optimization of the TC Bonder 4 system [4].

Core Viewpoint - Hanmi Semiconductor's chairman refuted the notion of shifting to hybrid bonding systems for HBM4 and HBM5 production, emphasizing the high costs and inefficiency of such equipment compared to traditional TC bonders [1][2]. Group 1: Market Position and Strategy - Hanmi Semiconductor holds the number one market share in the global HBM TC Bonder market, with a 90% share of the NVIDIA HBM3E market as of 2024, aiming for a 95% share in the HBM4 and HBM5 markets by the end of 2027 [1]. - The company plans to develop hybrid bonding machines for HBM6, with a target launch by the end of 2027, and is also set to introduce non-adhesive bonding machines within the year [2]. Group 2: Technological Advancements - Hanmi Semiconductor boasts advanced thermal compression bonding technologies, including NCF and MR-MUF types, positioning itself as a leader in HBM production technology [2]. - The company emphasizes its in-house production system, managing the entire process from design to assembly, which enhances its competitive edge in technology innovation and cost management [2]. Group 3: Market Demand and Future Outlook - The chairman expressed confidence in the growing demand for high-spec bonding machines due to the expansion of the global AI market and the increasing need for HBM [2]. - Hanmi Semiconductor is actively investing in technology development and capacity expansion to meet the anticipated growth in HBM demand [2].

Core Viewpoint - LG Electronics is entering the semiconductor equipment market by developing hybrid bonding machines for high bandwidth memory (HBM), aligning with the company's focus on artificial intelligence (AI) and B2B business expansion [1][2]. Group 1: Development and Market Strategy - LG Electronics' Production Engineering Research Institute (PRI) has begun developing hybrid bonding machines, crucial for next-generation HBM manufacturing, with a goal to achieve mass production by 2028 [1][2]. - The company aims to compete with established players like Samsung Electronics, Hanwha Semiconductor, and Hynix in the HBM manufacturing equipment market [1][3]. - The successful development of hybrid bonding machines could significantly increase sales and establish LG Electronics as a leader in the semiconductor equipment market [2]. Group 2: Technology and Innovation - Hybrid bonding machines are seen as a revolutionary technology that allows for chip stacking without the need for bumps, offering advantages such as thinner combined chips and lower heat generation, which are critical for multi-layer DRAM in HBM [2]. - This technology is currently applied in NAND flash and system semiconductors but has not yet been commercialized for HBM [2]. Group 3: Competitive Landscape - Leading companies in the semiconductor hybrid bonding machine sector include BE Semiconductor Industries NV and Applied Materials, but LG Electronics has opportunities due to the strong interest from SK Hynix and Samsung in domestic equipment production [3]. - Samsung plans to start using hybrid bonding machines for its sixth-generation HBM (HBM4) this year, while SK Hynix may apply the technology to its seventh-generation product (HBM4E) [3].

Group 1 - LG Electronics' stock rose in the Seoul market following reports of its development of advanced tools for manufacturing storage chips that work with AI processors designed by Nvidia and others [1] - The company plans to achieve mass production of HBM chip hybrid bonding machines by 2028, although the specific timeline for mass production has not been confirmed [1] - Hybrid bonding is crucial for HBM manufacturing, allowing for thinner chip stacking by directly bonding the electrodes of adjacent layers [1] Group 2 - Other Korean companies producing hybrid packaging equipment include Hanmi Semiconductor, Samsung Electronics' Semes, and Hanwha Vision's semiconductor technology division [4] - Hanmi Semiconductor's stock fell by 6.5%, Hanwha Vision's stock dropped by 4.7%, and Samsung Electronics' stock decreased by 1.3% [4] - Analysts note that the hybrid bonding market has high entry barriers, and established companies with years of expertise hold significant advantages [4] Group 3 - LG Electronics may face competition from foreign companies such as ASMPT listed in Hong Kong and BE Semiconductor Industries NV based in the Netherlands [4] - Increased R&D and capital expenditures may lead to profit pressure for LG Electronics, with sales contributions potentially limited before 2030 [4]