Investment Rating - The report maintains an "Outperform" rating for the communication industry [1] Core Insights - The communication industry is experiencing sustained high demand, driven by advancements in AI and the development of intelligent computing centers [2][3] - Major cloud service providers (CSPs) are significantly increasing their capital expenditures (Capex) to enhance AI capabilities, with projections indicating a combined Capex of $361 billion from major overseas players by 2025, and over 360 billion yuan from domestic firms [2] - The emergence of silicon photonic modules is set to revolutionize optical communication, offering lower costs, reduced power consumption, and higher integration [4][67] Summary by Sections AI Data Center Interconnection Development Trends - The AI arms race has entered a new phase, with rapid iterations in intelligent computing center interconnection technologies [2][16] - The demand for AI capabilities is driving CSPs to invest heavily in their infrastructure, leading to increased Capex and a focus on self-developed ASIC chips [32] Development of Optical Modules/Silicon Photonic Modules - Silicon photonic modules are expected to capture a larger market share, growing from 34% in 2023 to 52% by 2029, driven by their advantages in cost and performance [55][67] - The market for silicon photonic modules is projected to reach $10.3 billion by 2029, with a CAGR of 45% over the past five years [4] Cutting-edge Optical Communication Technologies - New technologies such as Co-Packaged Optics (CPO), Optical Circuit Switching (OCS), and Optical Input/Output (OIO) are anticipated to play significant roles in the future of optical communication [5][96] - The global market for OCS is expected to exceed $1.6 billion, while the DCI market could reach $28.4 billion by 2029 [5] Major CSPs and Their Developments - Google, AWS, and Meta are leading the development of self-researched ASIC chips, with significant advancements in their respective architectures [3][32] - CSPs are increasingly focusing on high-density optical connections and innovative interconnection solutions to meet the growing demands of AI applications [21][106]