国家知识产权局信息显示，中芯国际集成电路制造（上海）有限公司申请一项名为"半导体结构及其形 成方法"的专利，公开号CN121487311A，申请日期为2024年8月。 专利摘要显示，一种半导体结构及其形成方法，结构包括：衬底；沟道层结构，悬置于衬底上方，在纵 向上，沟道层结构包括一个或多个间隔的沟道层；栅极结构，位于衬底上且横跨沟道层结构，栅极结构 沿栅极结构延伸方向环绕沟道层；源漏掺杂层，位于栅极结构两侧的衬底上，在沟道层结构的延伸方向 上，源漏掺杂层与沟道层结构的端部相接触；源漏插塞，位于源漏掺杂层底部的衬底中，源漏插塞在纵 向上贯穿源漏掺杂层底部的衬底并与源漏掺杂层电连接。本发明有利于实现更佳的供电效果，从而有利 于提高半导体结构的工作性能。 天眼查资料显示，中芯国际集成电路制造（上海）有限公司，成立于2000年，位于上海市，是一家以从 事计算机、通信和其他电子设备制造业为主的企业。企业注册资本244000万美元。通过天眼查大数据分 析，中芯国际集成电路制造（上海）有限公司共对外投资了4家企业，参与招投标项目129次，财产线索 方面有商标信息150条，专利信息5000条，此外企业还拥有行政许可447个。 ...

国家知识产权局信息显示，南京云程半导体有限公司、上海云攀半导体有限公司取得一项名为"降低Wi- Fi信号峰均比的方法、电子设备及存储介质"的专利，授权公告号CN116633747B，申请日期为2023年6 月。 声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 来源：市场资讯 上海云攀半导体有限公司，成立于2021年，位于上海市，是一家以从事专业技术服务业为主的企业。企 业注册资本1000万人民币。通过天眼查大数据分析，上海云攀半导体有限公司专利信息74条。 天眼查资料显示，南京云程半导体有限公司，成立于2021年，位于南京市，是一家以从事软件和信息技 术服务业为主的企业。企业注册资本1440.4925万人民币。通过天眼查大数据分析，南京云程半导体有 限公司共对外投资了4家企业，参与招投标项目1次，财产线索方面有商标信息7条，专利信息69条，此 外企业还拥有行政许可7个。 ...

Core Insights - Semiconductor Manufacturing International Corporation (SMIC) has obtained a patent for "Optical Proximity Correction Method and System, Mask, Equipment, and Storage Medium" with authorization number CN115993753B, applied for on October 2021 [1] Company Overview - SMIC (Shanghai) was established in 2000, located in Shanghai, primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 244 million USD [1] - SMIC (Beijing) was founded in 2002, located in Beijing, also focused on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [1] Investment and Intellectual Property - SMIC (Shanghai) has invested in 4 companies, participated in 127 bidding projects, holds 150 trademark records, and has 5000 patent records, along with 450 administrative licenses [1] - SMIC (Beijing) has invested in 1 company, participated in 52 bidding projects, holds 5000 patent records, and has 225 administrative licenses [1]

Core Insights - Semiconductor companies, specifically SMIC, have recently obtained a patent for "semiconductor structure and its formation method," indicating ongoing innovation in the industry [1] Company Overview - SMIC (Shanghai) was established in 2000 and is primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 244 million USD [1] - SMIC (Beijing) was founded in 2002, also focusing on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [1] Investment and Operations - SMIC (Shanghai) has made investments in 4 companies and participated in 127 bidding projects, holding 150 trademark records and 5000 patent records, along with 452 administrative licenses [1] - SMIC (Beijing) has invested in 1 company, participated in 52 bidding projects, holds 5000 patent records, and has 226 administrative licenses [1]

Group 1 - The core viewpoint of the news is that Semiconductor Manufacturing International Corporation (SMIC) has applied for a patent related to semiconductor structures and their formation methods, which aims to enhance the integration of photodetectors [1] - The patent application was filed for a semiconductor structure that includes a first substrate with multiple discrete photosensitive areas and an isolation trench containing a capacitive structure, which improves the optical isolation between adjacent photosensitive areas [1] - The capacitive structure is designed to reduce the size in the vertical direction relative to the first substrate, thereby increasing the integration level of the photodetector [1] Group 2 - SMIC Beijing was established in 2002 with a registered capital of 100 million USD and has participated in 52 bidding projects, holding 5000 patent records [2] - SMIC Shanghai was founded in 2000 with a registered capital of 244 million USD, involved in 127 bidding projects, and also holds 5000 patent records [2] - Both companies are primarily engaged in the manufacturing of computers, communications, and other electronic devices, with SMIC Shanghai having more administrative licenses (451) compared to SMIC Beijing (226) [2]

Core Viewpoint - Semiconductor companies, specifically SMIC, are actively pursuing innovation through patent applications, indicating a focus on enhancing semiconductor structures and methods, which may strengthen their market position in the industry [1][2]. Group 1: Patent Application - SMIC has applied for a patent titled "Semiconductor Structure and Its Formation Method," with publication number CN120035224A, filed on November 2023 [1]. - The patent describes a semiconductor structure that includes a substrate with an insulating layer and an active region, featuring gate structures that enhance ESD (Electrostatic Discharge) robustness and provide bidirectional ESD protection [1]. Group 2: Company Overview - SMIC Beijing was established in 2002, focusing on manufacturing for computers, communications, and other electronic devices, with a registered capital of 100 million USD [2]. - SMIC Shanghai was founded in 2000, also in the same industry, with a registered capital of 244 million USD [2]. - SMIC Beijing has participated in 51 bidding projects and holds 5000 patent records, while SMIC Shanghai has engaged in 127 bidding projects and also possesses 5000 patents [2].