证券代码：688409 证券简称：富创精密 公告编号：2026-010 沈阳富创精密设备股份有限公司 2025年年度业绩预告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 一、本期业绩预告情况 （一）业绩预告期间 2025年1月1日至2025年12月31日。 （二）业绩预告情况 经沈阳富创精密设备股份有限公司（以下简称"公司"）财务部门初步测算： 1、预计2025年年度实现归属于母公司所有者的净利润与上年同期（法定披露数据）相比，将出现亏 损，预计实现归属于母公司所有者的净利润-1,200.00万元到-600.00万元。 2、预计2025年年度归属于母公司所有者扣除非经常性损益后的净利润为 -6,000.00万元到-4,000.00万元。 （三）本次业绩预告未经注册会计师审计。 二、上年同期业绩情况和财务状况 （一）2024年度利润总额：19,245.98万元。 归属于母公司所有者的净利润：20,264.98万元。归属于母公司所有者的扣除非经常性损益的净利润： 17,190.34万元。 （二）2024年度每股收益：0.7 ...

Core Insights - The semiconductor industry is undergoing a significant capacity restructuring driven by the AI spillover effect, impacting both advanced and mature process nodes [1][11] - Major players like TSMC and Samsung are reducing their 8-inch wafer production capacity, indicating a shift in focus towards more efficient 12-inch processes [3][4] - The demand for power management integrated circuits (PMIC) and power devices is surging due to increased data center power consumption, further straining the supply of mature process nodes [1][5] Group 1: Industry Trends - The closure of 8-inch fabs by TSMC and Samsung is not due to a lack of demand but rather economic considerations and a shift in product platforms towards 12-inch [4][5] - TSMC plans to phase out its 6-inch wafer production by 2027, while Samsung will reduce its 8-inch capacity by approximately 50,000 wafers per month by late 2026 [3][4] - The global supply of 8-inch wafers is expected to decline by about 2.4% year-on-year by 2026, with average utilization rates rising from 75-80% in 2025 to 85-90% [6] Group 2: Opportunities and Challenges - The exit of major players from the 8-inch market opens opportunities for second-tier and regional players, such as DB HiTek and Chinese manufacturers, to capture overflow orders [6][11] - The transition to 12-inch processes is seen as irreversible, with companies like TI investing in new 12-inch fabs to enhance manufacturing scale and cost structure [7][10] - The sale of Powerchip's P5 factory to Micron for $1.8 billion highlights the survival strategies of second-tier manufacturers amid capacity expansions and financial pressures [8][9] Group 3: Implications for Chinese Manufacturers - The reduction in 8-inch capacity presents a valuable window for Chinese wafer fabs to capture market share and improve pricing power [11][12] - Chinese manufacturers must focus on transitioning to 12-inch specialty processes to maintain competitiveness and leverage the current 8-inch market dynamics [12][13] - The ability to convert 8-inch opportunities into 12-inch capabilities will be crucial for long-term success in the evolving semiconductor landscape [12][13]

Core Viewpoint - The global semiconductor industry is undergoing unprecedented capacity restructuring, with a significant disparity between advanced and mature processes driven by geopolitical dynamics, technological divergence, and changing market demands [2][4]. Group 1: Advanced Process Competition - TSMC, Samsung, and Intel are fiercely competing in the advanced process segment, particularly in the 3nm and below category, with TSMC's 2nm process expected to start mass production in late 2025 [6][7]. - TSMC's 2nm process will have a monthly capacity of 50,000 wafers, primarily supplying Apple and Nvidia, with a projected ramp-up to 120,000 wafers per month by the end of 2026 [6]. - Samsung's 3nm GAA process has achieved an 80% yield and secured a $16.5 billion contract with Tesla, while its 2nm process is set for trial production in Q2 2025 [6][7]. - Intel's 18A process, utilizing Power Via technology, aims for a monthly capacity of 15,000 wafers by the end of 2025, targeting AI and autonomous driving applications [7]. Group 2: Mature Process Landscape - The global capacity for mature processes (8nm to 45nm) has surpassed 15 million wafers per month, with significant contributions from Chinese manufacturers [9][11]. - SMIC, as a leading Chinese foundry, has a monthly capacity of 50,000 wafers for 28nm and 30,000 wafers for 14nm processes, focusing on automotive electronics and IoT applications [9][11]. - UMC plans to reach a quarterly capacity of 128,000 12-inch equivalent wafers by Q4 2025, with strong demand for 22nm and 28nm processes [9][11]. - GlobalFoundries operates six fabs with a focus on 14nm, 12nm, and 22FDX processes, maintaining over 80% utilization in niche markets [10][11]. Group 3: Regional Capacity Dynamics - The construction of new fabs is increasingly regionalized, with 18 new fabs expected to start in 2025, reflecting a "chip sovereignty" strategy [38][39]. - The U.S. CHIPS Act incentivizes local production, while the EU's Chip Act supports expansion in Germany, and China continues to enhance its mature process capabilities [39]. - The trend towards "Local for Local" is evident, with Intel's Arizona fab prioritizing U.S. AI chip needs and TSMC's Kumamoto fab focusing on automotive chips for Japanese clients [39][40]. Group 4: Capacity and Process Overview in China - By 2025, China's wafer production capacity is projected to reach 4.49 million wafers per month, with a 14% year-on-year growth, particularly in the 28nm segment [11][17]. - Major Chinese foundries like SMIC and Hua Hong Semiconductor are expanding their capacities significantly, with SMIC's various fabs contributing to a diverse range of processes [18][19][20]. - The domestic semiconductor industry is forming a matrix centered around logic, memory, and specialty processes, with 12-inch lines accounting for 62% of the total capacity [17][41].