Core Viewpoint - The global semiconductor industry is undergoing unprecedented capacity restructuring, with a significant disparity between advanced and mature processes driven by geopolitical dynamics, technological divergence, and changing market demands [2][4]. Group 1: Advanced Process Competition - TSMC, Samsung, and Intel are fiercely competing in the advanced process segment, particularly in the 3nm and below category, with TSMC's 2nm process expected to start mass production in late 2025 [6][7]. - TSMC's 2nm process will have a monthly capacity of 50,000 wafers, primarily supplying Apple and Nvidia, with a projected ramp-up to 120,000 wafers per month by the end of 2026 [6]. - Samsung's 3nm GAA process has achieved an 80% yield and secured a $16.5 billion contract with Tesla, while its 2nm process is set for trial production in Q2 2025 [6][7]. - Intel's 18A process, utilizing Power Via technology, aims for a monthly capacity of 15,000 wafers by the end of 2025, targeting AI and autonomous driving applications [7]. Group 2: Mature Process Landscape - The global capacity for mature processes (8nm to 45nm) has surpassed 15 million wafers per month, with significant contributions from Chinese manufacturers [9][11]. - SMIC, as a leading Chinese foundry, has a monthly capacity of 50,000 wafers for 28nm and 30,000 wafers for 14nm processes, focusing on automotive electronics and IoT applications [9][11]. - UMC plans to reach a quarterly capacity of 128,000 12-inch equivalent wafers by Q4 2025, with strong demand for 22nm and 28nm processes [9][11]. - GlobalFoundries operates six fabs with a focus on 14nm, 12nm, and 22FDX processes, maintaining over 80% utilization in niche markets [10][11]. Group 3: Regional Capacity Dynamics - The construction of new fabs is increasingly regionalized, with 18 new fabs expected to start in 2025, reflecting a "chip sovereignty" strategy [38][39]. - The U.S. CHIPS Act incentivizes local production, while the EU's Chip Act supports expansion in Germany, and China continues to enhance its mature process capabilities [39]. - The trend towards "Local for Local" is evident, with Intel's Arizona fab prioritizing U.S. AI chip needs and TSMC's Kumamoto fab focusing on automotive chips for Japanese clients [39][40]. Group 4: Capacity and Process Overview in China - By 2025, China's wafer production capacity is projected to reach 4.49 million wafers per month, with a 14% year-on-year growth, particularly in the 28nm segment [11][17]. - Major Chinese foundries like SMIC and Hua Hong Semiconductor are expanding their capacities significantly, with SMIC's various fabs contributing to a diverse range of processes [18][19][20]. - The domestic semiconductor industry is forming a matrix centered around logic, memory, and specialty processes, with 12-inch lines accounting for 62% of the total capacity [17][41].

反噬来了！北美芯片价格暴跌66%，外媒：简直是"灭顶之灾"！ 这些数据表明中国的芯片不仅在数量上占据了优势，还在价格上与欧美竞争对手拉开了差距，这正是欧美厂商最为头痛的部分。价格战的背后是中国芯 片产业强大产业链的支撑，这让欧美厂商难以应对。 在这种价格优势的带动下，中国的中低端芯片已经成为全球各大行业的重要选择，尤其是在欧美市场。低价芯片的涌入，不仅仅让美国本土芯片厂商的 利润下降，还让许多科技产品的生产成本被迫下降，进一步加剧了欧美企业的压力。 面对中国芯片的猛烈进攻，美国的很多芯片厂商已经感受到了生存压力。比如美国碳化硅晶圆巨头Wolfspeed在过去三年里的业绩下滑了96%，不得不裁 员20%；美国微控制器巨头微芯科技也在2024年第四季度营收暴跌了41.9%。他们还不得不关闭部分工厂，以应对市场低迷。 美国一直在高喊"打压中国芯片"，事情的走向却让他们有点措手不及。2024年随着中国在芯片产业中迅猛发展，北美市场上的芯片价格开始暴跌，这一 反转让很多西方媒体开始担忧，甚至有人称这是一场"灭顶之灾"。到底发生了什么？我们又该如何理解这一变局？ 近几年中国在芯片领域的进步可谓飞速。特别是在中低端芯片的生 ...