Core Viewpoint - The article discusses the recent share reduction plan by the chairman and general manager of Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd., highlighting the company's financial performance and market challenges in the semiconductor industry [2][3]. Financial Performance - Zhongwei's revenue for 2024 is projected to grow by 44.7% to 9.07 billion yuan, while net profit is expected to decline by 9.53% to 1.62 billion yuan, primarily due to a significant increase in R&D expenses, which surged by 94.3% to 2.45 billion yuan [2]. - In Q1 2025, revenue and net profit are anticipated to increase by 35.4% and 25.67%, respectively, indicating sustained growth momentum in core businesses such as etching equipment [2]. Share Reduction Plan - Chairman and General Manager Yin Zhiyao plans to reduce his shareholding by up to 280,000 shares, representing 0.045% of the total share capital, potentially cashing out approximately 52.71 million yuan [2]. - Since August 2022, Yin has cumulatively reduced his holdings by 1.87 million shares, realizing a total cash amount of 236 million yuan, with his ownership percentage decreasing from 1.5% at IPO to the current 0.7% [2][4]. Market Context - The global semiconductor sales are expected to grow by 19.1% in 2024, but the growth rate is projected to slow to 11.2% in 2025, posing challenges for the company as it navigates a decelerating market [2]. - Historical data indicates that share reductions by semiconductor founders often lead to short-term stock price declines, as seen in the case of Weier Co., which caused a market value loss of 1.7 billion yuan for Beijing Junzheng [3]. Product Development - The company continues to make breakthroughs in advanced etching and thin film equipment, with etching equipment sales expected to reach 7.28 billion yuan in 2024, reflecting a 54.72% increase [3]. - In Q1 2025, R&D expenditures reached 687 million yuan, marking a 90.53% increase, focusing on the development of metal film vapor deposition equipment and next-generation PECVD equipment [3].

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 成熟制程（45nm及以上）：占公司产能的75%以上，广泛应用于消费电子、汽车电子、物联网等领域。先进制程（28nm及以下）：包括14nm FinFET工 艺及等效7nm的N+1技术（受美国制裁影响，先进制程量产受限）。8英寸晶圆：主要用于模拟、功率器件等特色工艺，月产能超23万片。12英寸晶圆： 聚焦先进工艺和高附加值产品，2025年总产能预计突破50万片/月。 在 Fab 厂布局方面，中芯国际在国内多个地区建立了生产基地，构建起庞大且完善的制造网络。 上海地区 上海张江 fab1 ：中芯国际起家的地方，也是中国最先进的工艺研发、生产基地。fab1包括了fab1-p1、p2、p3、so1四个洁净室，以前也叫一厂、二厂、三 厂等，so1是洁净室车间+办公室，过去作为8寸0.15umbcd工艺研发及产业化的基地。 上海张江 fab8 ：包括fab8p1、fab8p2、fab8p3。其中fab8p1又包括p1a、p1b、p1c，fab8p1a过去叫fab8，之前量产过12英寸工艺，最高到45nm，后来增加 了掩膜版生产线，目前主要生产掩膜版；fab8p1b过 ...