Core Viewpoint - Nvidia plans to collaborate with Intel on the Feynman architecture platform expected to launch in 2028, adopting a "low-volume, low-tier, non-core" strategy in this partnership, reflecting a shift in supply chain strategy among US tech giants due to political and supply chain pressures [2][3][6]. Group 1: Nvidia and Intel Collaboration - Nvidia's Feynman architecture will involve collaboration with Intel, with core GPU chips still being manufactured by TSMC, while I/O chips will utilize Intel's 18A or the anticipated 14A process, depending on yield conditions [3][6]. - The collaboration is part of a broader trend among US tech companies to diversify their supply chains and reduce reliance on TSMC, driven by political pressures and supply chain resilience considerations [3][4][10]. Group 2: Impact on TSMC - Despite some orders being diverted to Intel, industry analysts believe this shift will benefit TSMC by alleviating monopoly concerns and political pressures, while TSMC remains confident in securing high-end chip orders [4][10]. - TSMC is expected to maintain a dominant position in high-end chip manufacturing, as the orders moving to Intel are primarily non-core, allowing TSMC to strengthen its bargaining power and supply capabilities in the future [10]. Group 3: Other Companies Involved - Other major companies such as Apple, Google, Microsoft, AWS, Qualcomm, Broadcom, AMD, and Tesla are also in discussions with Intel for potential collaborations, indicating a significant shift in the semiconductor landscape [2][3][8]. - Apple's renewed partnership with Intel for entry-level M-series processors is driven by the need to mitigate manufacturing risks and respond to US manufacturing goals and tariff impacts [8].

Core Viewpoint - Qualcomm is transitioning to TSMC's advanced 2nm N2P process for its Snapdragon 8 Elite Gen 6 and Gen 7 chipsets, moving away from the 3nm process, which indicates a significant investment in manufacturing technology [1][2]. Group 1: Technology Transition - Snapdragon 8 Elite Gen 5 is the last flagship chipset made using the 3nm process, with future models adopting the 2nm N2P process [1]. - TSMC's 2nm N2P architecture offers a 5% performance boost or a 5% reduction in power consumption at the same clock speed compared to the previous generation [2]. Group 2: Strategic Partnerships - There is uncertainty regarding Qualcomm's potential collaboration with Samsung for utilizing its 2nm GAA process, which could provide Qualcomm with better negotiation leverage for wafer pricing [2]. - Qualcomm and MediaTek reportedly paid up to 24% more for 3nm wafers, highlighting the need for a dual-sourcing strategy to mitigate rising costs as TSMC is expected to increase prices for 2nm wafers by 50% [2]. Group 3: Future Outlook - Qualcomm's strategy appears to focus on maximizing performance through increased core frequency while maintaining efficiency with the new N2P process [2]. - Samsung has completed the foundational design for its second-generation 2nm GAA process, indicating potential future opportunities for Qualcomm to collaborate with Samsung [2].