继苹果之后，英伟达也计划将部分芯片制造业务转向英特尔代工。英伟达预计在2028年推出的Feynman 架构平台将与英特尔合作，这是美国科技巨头在特朗普政府推动"美国制造"目标下调整供应链策略的最 新案例。 据DIGITIMES周三报道，供应链人士透露，英伟达将在与英特尔的合作中采用"量少、低阶、非核 心"的合作策略。GPU核心芯片仍由台积电代工，而I/O芯片则部分采用英特尔18A或预定2028年量产的 14A制程，最后由英特尔EMIB进行先进封装。按先进封装比重计算，英特尔最高约占25%，台积电约 占75%。 这一转变反映出美国科技企业在政治压力、关税威胁和供应链韧性考量下，不得不从高度集中于台积电 的模式转向"多源供应、分散风险"的新策略。除英伟达和苹果外，谷歌、微软、AWS、高通、博通、 超微和特斯拉等企业也在与英特尔洽谈合作。 尽管部分订单分流至英特尔，但业界认为这对台积电"利远大于弊"，有助于降低垄断疑虑、释放政治压 力，同时台积电仍有信心稳固高阶芯片代工大单。 台积电三层战略应对客户分流 目前观察，苹果、英伟达都以代工风险最低的产品渐进式调整。与英特尔洽谈合作的还有谷歌、微软、 AWS、高通、博通、 ...

Group 1 - The possibility of Apple reselecting Intel as its supplier for M-series chips by 2027 has significantly increased according to supply chain analyst Ming-Chi Kuo [1] - Apple has signed a confidentiality agreement with Intel to procure its 18AP PDK 0.9.1GA chip design toolkit, with expectations for Intel to deliver updated PDK versions in Q1 2026 [1] - If successful, Intel could begin mass production of entry-level M-series processors for Apple as early as Q2 or Q3 2027, depending on the delivery and validation of the new PDK versions [1] Group 2 - A partnership with Intel would allow Apple to signal support for American manufacturing, potentially addressing policy pressures from the Trump administration [2] - This order could signify that Intel has moved past its most challenging period, with future prospects for winning more orders from Apple and other leading clients [2] - Intel's 14A and subsequent processes are expected to enhance the company's long-term outlook by securing more orders [2]