公众号记得加星标⭐️，第一时间看推送不会错过。 英特尔与联电传将进行「世纪大合作」，英特尔要把独家用于下世代埃米级制程与先进封装关键的独 家技术「Super MIM」超级电容授权联电，联电技术能力将大跃进，双方并将携手抢攻AI世代大商 机，树立台美半导体合作新里程碑。 对于相关消息，联电表示，目前与英特尔的合作重心仍放在12纳米平台，持续强化制程竞争力与客户 服务，但未来不排除扩大合作范围，朝更多元技术领域发展。 消息人士透露，联电内部已有专门团队开始对此新合作「动起来」。英特尔则不评论。 业界指出，随着晶体管尺寸持续微缩，芯片在高负载运算时会出现剧烈瞬时电流需求，传统去耦电容 面临容量密度不足或漏电流过高等瓶颈，已难以支撑埃米级芯片运作稳定。 Super MIM是英特尔挥军埃米级制程的关键技术，藉由该电容技术，解决先进制程下电源噪声与瞬时 功率波动问题，堪称英特尔迈入下世代制程节点的秘密武器。 据 了 解 ， 英 特 尔 Super MIM 超 级 电 容 采 用 铁 电 铪 锆 氧 化 物 （ HZO ） 、 氧 化 钛 （ TiO ） 、 钛 酸 锶 （STO）等材料堆叠，可在相容既有后段制程（BEOL ...

Core Viewpoint - The introduction of Backside Power Delivery Network (BSPDN) by major semiconductor companies like Intel and TSMC is a significant advancement in semiconductor technology, aimed at addressing the limitations of traditional chip designs and extending Moore's Law [2][4]. Group 1: What is Backside Power Delivery? - BSPDN is considered a breakthrough that continues Moore's Law, improving heat dissipation, reducing IR drop, and increasing chip density [4]. - Traditional chip designs concentrate power and signal lines on the front of the wafer, which becomes problematic as advanced processes approach 2nm and below [5]. Group 2: Importance of Backside Power Delivery - Reduces voltage drop and power loss, ensuring stable power supply during high-speed AI computations and server applications [6]. - Addresses thermal bottlenecks and IR drop issues caused by lengthy circuits, which can lead to operational errors or performance degradation [7]. - Enhances performance by separating power and signal, thereby reducing interference [8]. Group 3: Global Strategies for Backside Power Delivery - Three main solutions are currently being developed: imec's Buried Power Rail, Intel's PowerVia, and TSMC's Super Power Rail [10]. - imec is a leader in BSPDN technology, having published its findings in collaboration with Arm in 2022, utilizing BPR and nTSV architecture [11]. - Intel plans to implement BSPDN in its 18A process, expected to enter mass production in late 2025, focusing on complete separation of power and signal [11]. - Samsung will introduce BSPDN technology in its SF2Z process, with mass production anticipated in 2027 [12]. - TSMC's approach involves using Super Power Rail to direct power to the front transistors, which is crucial for maintaining its competitive edge in advanced processes [13]. Group 4: Implications for the Semiconductor Industry - BSPDN is seen as a key technology for extending Moore's Law, especially as traditional methods of shrinking transistors face limitations [15]. - The competition among major players to mature and commercialize this technology will determine their influence in the semiconductor industry over the next decade [13].