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南芯科技:拟发行可转债募资不超19.33亿元 用于智能算力领域电源管理芯片研发及产业化项目等
Zheng Quan Shi Bao Wang· 2025-09-07 08:03
Group 1 - The company, Nanchip Technology, announced on September 7 that it plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding 1.933 billion yuan [1] - The net proceeds from the fundraising, after deducting issuance costs, will be allocated to several projects, including the development and industrialization of power management chips in the intelligent computing field, automotive chips, and sensors and control chips for industrial applications [1]
南芯科技:拟发行可转债募资不超19.33亿元 用于智能算力等领域项目
Ge Long Hui· 2025-09-07 07:49
Core Viewpoint - Nanchip Technology (688484.SH) plans to issue convertible bonds to raise up to 1.933 billion yuan for various chip development projects aimed at enhancing core competitiveness and profitability [1] Group 1: Fundraising and Projects - The company intends to raise a total of no more than 1.933 billion yuan through the issuance of convertible bonds [1] - The funds will be allocated to projects in smart computing power, automotive chips, and industrial application sensors and control chips [1] - These projects align with national policy directions and market demands, indicating a strategic focus on growth areas [1]