Core Viewpoint - The article provides a comprehensive overview of the semiconductor manufacturing process, emphasizing the intricate division of labor within the industry and the various stages involved in chip production. Group 1: Chip Manufacturing Division - The semiconductor manufacturing process consists of several stages: chip design, wafer preparation, chip manufacturing (front-end), and packaging/testing (back-end) [8][12][14] - The industry operates under different models: Fabless, Foundry, IDM (Integrated Device Manufacturer), and OSAT (Outsourced Semiconductor Assembly and Test) [13][14] Group 2: Wafer Preparation - Wafer preparation involves multiple steps, including deoxidation, purification, single crystal silicon pulling, wafer cutting, chamfering, grinding, polishing, cleaning, and inspection [17][19][32] - The purity of silicon is crucial, with semiconductor-grade silicon requiring a purity of 99.9999999% to 99.99999% [20][19] - The typical wafer sizes include 2-inch, 3-inch, 4-inch, 5-inch, 6-inch, 8-inch, and 12-inch, with 8-inch and 12-inch being the most common [48] Group 3: Chip Manufacturing Process - The chip manufacturing process includes oxidation, photolithography, etching, doping (ion implantation), and thin film deposition [54][60][75][90] - Photolithography involves applying photoresist, exposure, and development to create circuit patterns on the wafer [60][66] - Etching can be either wet or dry, with dry etching currently dominating the industry due to its precision [82] Group 4: Testing and Quality Control - After the manufacturing process, chips undergo testing to ensure quality, including electrical parameter monitoring, wafer aging tests, and probe testing [118] - Chips that fail testing are marked for identification and may be repaired if possible [118]