Core Insights - The overall packaging market is expected to grow by 16% year-on-year to reach $105.5 billion in 2024, with the advanced packaging market growing by 20.6% to $51.3 billion, accounting for nearly 50% of the total market [1][2] - By 2030, the overall packaging market is projected to reach $160.9 billion, with advanced packaging expected to grow to $91.1 billion, resulting in a compound annual growth rate (CAGR) of 10% from 2024 to 2039 [1][2] - The high-end market share is anticipated to increase from 8% in 2023 to 33% by 2029, driven by the demand for performance in generative AI, edge computing, and intelligent driving ADAS [2] Packaging Market Overview - The traditional packaging market is projected to reach $54.2 billion in 2024 and $69.8 billion by 2030, indicating significant potential for panel-level packaging (PLP) to replace traditional methods [3] - The wafer-level packaging market is expected to be $2.1 billion in 2024, with the FO/2.5D organic interposer market at $1.8 billion, potentially reaching $8.4 billion by 2030 [3] Advanced Packaging Necessity - Advanced packaging is becoming essential due to the end of Moore's Law in process technology, shifting focus to packaging technology to achieve higher performance at lower costs [3] - The need for panel-level packaging (PLP) arises from its cost-effectiveness, design flexibility, and superior thermal and electrical performance [3] Substrate Importance in High-End Market - Packaging substrates play a crucial role in signal transmission, heat dissipation, protection, and functional integration, which are vital for meeting the increasing I/O density demands in mobile devices, 5G, data centers, and high-performance computing [4][5] COWOP Technology - The Chip on Wafer on PCB (COWOP) concept blurs the lines between PCB and substrate, focusing on transferring substrate functions to PCB while maintaining compatibility with existing technologies [6] Related Companies - Key companies in the packaging substrate and materials sector include Lianrui New Materials (688300.SH), Huazheng New Materials (603186.SH), and others [7]

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