Group 1 - TSMC's new 1.4nm advanced process plant in Central Taiwan Science Park has officially commenced construction, with a total investment estimated at NT$1.5 trillion, expected to complete risk production by the end of 2027 and mass production in the second half of 2028, potentially generating over NT$500 billion in revenue [1] - The A14 process technology promises significant improvements over the N2 process, including a speed increase of 10-15%, a power reduction of 25-30%, and a logic density increase of approximately 1.23 times [3][5] - A14 technology utilizes TSMC's second-generation GAA (Gate-All-Around) nanosheet transistors and NanoFlex Pro technology, which allows for greater design flexibility [3][11] Group 2 - The A14 process will initially lack the back-side power delivery (BSPDN) feature, limiting its application to those that do not require intensive power routing, while a version with BSPDN is planned for 2029 [8][11] - TSMC plans to introduce high-performance (A14P) and cost-optimized (A14C) versions of the A14 process after 2029, with the first version expected to be available in 2028 [11][12] - The NanoFlex Pro architecture enables chip designers to fine-tune transistor configurations for optimal power, performance, and area (PPA), enhancing the overall efficiency of the design process [12]

Core Viewpoint - TSMC is set to begin construction of its A14 factory, which will utilize the advanced 1.4nm process technology, with an initial investment of approximately $49 billion, creating 8,000 to 10,000 job opportunities [2][3]. Group 1: Factory Construction and Planning - TSMC's A14 factory is the first new facility in the second phase of the Central Taiwan Science Park expansion, with plans for four main buildings, including a main wafer fab and equipment supply factory [3]. - The construction of the A14 factory is expected to start on November 5, following the completion of preliminary water conservation and infrastructure projects [3]. - The first production facility is projected to begin risk production by the end of 2027, with mass production anticipated in the second half of 2028, potentially generating over NT$500 billion in revenue [2]. Group 2: A14 Process Technology - The A14 process technology promises significant improvements over the N2 process, including a performance increase of 10% to 15%, a power consumption reduction of 25% to 30%, and a transistor density increase of 20% to 23% [7][9]. - A14 will utilize TSMC's second-generation GAA (Gate-All-Around) transistor technology and NanoFlex Pro technology, which allows for flexible design optimization [4][12]. - The initial version of the A14 process will not include back-side power delivery (BSPDN), with a version featuring this capability expected to be released in 2029 [9][12]. Group 3: Future Developments and Market Position - TSMC plans to introduce high-performance (A14P) and cost-optimized (A14C) versions of the A14 process after 2029, indicating a long-term strategy for advanced semiconductor manufacturing [12][13]. - The A14 technology is designed to meet the needs of high-performance client and data center applications, reflecting TSMC's commitment to innovation in the semiconductor industry [12][13].