Core Viewpoint - The company, Xingsen Technology, is focusing on the development of IC packaging substrates, which are essential materials for chip packaging, targeting various sectors including CPU, GPU, FPGA, ASIC, and storage chips [2] Group 1: Business Focus - The company is strategically advancing its FCBGA packaging substrate business, with customer expansion proceeding as planned [2] - The CSP packaging substrate business is concentrating on storage and RF markets, while also expanding into the automotive sector [2] Group 2: Product Development - The product structure is gradually shifting towards high value-added and high-priced offerings, particularly in multilayer boards [2]