今年以来兴森科技已经3次登上龙虎榜，最近一次登上龙虎榜为10月15日，当日龙虎榜净买入1.13亿 元；买入总计5.30亿元 ，占总成交额比25.05%；卖出总计4.17亿元 ，占总成交额比19.70%。 资料显示，深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层，成立日期1999年3月18日，上市日期2010年6月18日，公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为：PCB印制电路板71.45%，IC封装基板 21.09%，其他4.29%，半导体测试板3.17%。 兴森科技所属申万行业为：电子-元件-印制电路板。所属概念板块包括：中盘、HBM概念、融资融券、 航天军工、增持回购等。 截至11月20日，兴森科技股东户数11.90万，较上期减少4.03%；人均流通股12693股，较上期增加 4.20%。2025年1月-9月，兴森科技实现营业收入53.73亿元，同比增长23.48%；归母净利润1.31亿元，同 比增长516.08%。 11月26日，兴森科技盘中上涨2.04%，截至11:09，报20.51元/股，成交8.02亿元， ...

证券日报网讯兴森科技（002436）11月24日在互动平台回答投资者提问时表示，公司IC封装基板为芯片 封装原材料，芯片设计公司及封装厂商均为公司目标客户。具体客户和具体业务合作内容因保密协议约 定不便披露。 ...

Core Insights - On November 17, 2023, Xingsen Technology's stock rose by 4.01%, with a trading volume of 1.731 billion yuan [1] - The company reported a financing buy-in of 140 million yuan and a net financing outflow of approximately 90.56 million yuan on the same day [1] - As of November 17, the total margin balance for Xingsen Technology was 2.391 billion yuan, indicating a high level of financing activity [1] Financing Summary - On November 17, Xingsen Technology had a financing buy-in of 140 million yuan, with a current financing balance of 2.370 billion yuan, representing 6.64% of its market capitalization [1] - The financing balance is above the 90th percentile of the past year, indicating a high level of leverage [1] - In terms of securities lending, 195,700 shares were repaid, while 17,800 shares were sold short, with a total short balance of 20.968 million yuan, also above the 90th percentile of the past year [1] Shareholder and Financial Performance - As of November 10, 2023, Xingsen Technology had 124,000 shareholders, an increase of 4.20%, with an average of 12,181 shares per shareholder, a decrease of 4.03% [2] - For the period from January to September 2025, the company achieved a revenue of 5.373 billion yuan, a year-on-year increase of 23.48%, and a net profit attributable to shareholders of 131 million yuan, a significant increase of 516.08% [2] Dividend and Institutional Holdings - Since its A-share listing, Xingsen Technology has distributed a total of 1.129 billion yuan in dividends, with 270 million yuan distributed over the past three years [3] - As of September 30, 2025, the top ten circulating shareholders included Hong Kong Central Clearing Limited and Southern CSI 500 ETF, with notable changes in their holdings [3]

Core Viewpoint - The company, Xingsen Technology, is focusing on the development of IC packaging substrates, which are essential materials for chip packaging, targeting various sectors including CPU, GPU, FPGA, ASIC, and storage chips [2] Group 1: Business Focus - The company is strategically advancing its FCBGA packaging substrate business, with customer expansion proceeding as planned [2] - The CSP packaging substrate business is concentrating on storage and RF markets, while also expanding into the automotive sector [2] Group 2: Product Development - The product structure is gradually shifting towards high value-added and high-priced offerings, particularly in multilayer boards [2]

Core Insights - On November 11, 2023, Xingsen Technology's stock rose by 6.02%, with a trading volume of 6.155 billion yuan [1] - As of October 31, 2023, Xingsen Technology reported a significant increase in revenue and net profit for the first nine months of 2025 [2] Financing and Trading Activity - On November 11, Xingsen Technology had a financing buy-in of 905 million yuan, with a net financing outflow of 161 million yuan [1] - The total financing and securities lending balance reached 2.648 billion yuan, indicating a high level of activity [1] - The financing balance accounted for 6.68% of the circulating market value, exceeding the 90th percentile of the past year [1] Company Performance - For the period from January to September 2025, Xingsen Technology achieved a revenue of 5.373 billion yuan, representing a year-on-year growth of 23.48% [2] - The net profit attributable to shareholders was 131 million yuan, showing a remarkable increase of 516.08% year-on-year [2] Shareholder and Dividend Information - Since its A-share listing, Xingsen Technology has distributed a total of 1.129 billion yuan in dividends, with 270 million yuan distributed over the past three years [3] - As of September 30, 2025, the number of shareholders increased to 119,000, with an average of 12,693 shares held per shareholder [2][3]

Group 1 - The core viewpoint of the news is that Xingsen Technology's stock has seen a significant increase, with a rise of 5.19% to reach 22.90 CNY per share, and a total market capitalization of 389.23 billion CNY [1] - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is primarily engaged in PCB and semiconductor businesses, with revenue composition as follows: 71.45% from PCB printed circuit boards, 21.09% from IC packaging substrates, 4.29% from other sources, and 3.17% from semiconductor testing boards [1] Group 2 - From the perspective of fund holdings, Xingsen Technology is a significant position in the Su Xin fund, specifically in the Su Xin CSI 500 Index Enhanced A fund (022790), which held 79,700 shares, accounting for 0.7% of the fund's net value, ranking as the eighth largest holding [2] - The Su Xin CSI 500 Index Enhanced A fund has a total asset size of 150 million CNY and has achieved a year-to-date return of 35.39%, ranking 1443 out of 4216 in its category [2]

Core Viewpoint - On November 10, 2023, Xingsen Technology's stock price fell by 5.09%, closing at 21.43 CNY per share, with a trading volume of 1.241 billion CNY and a turnover rate of 3.71%, resulting in a total market capitalization of 36.424 billion CNY [1] Company Overview - Shenzhen Xingsen Quick Circuit Technology Co., Ltd. was established on March 18, 1999, and went public on June 18, 2010. The company is primarily engaged in PCB and semiconductor businesses [1] - The revenue composition of the main business includes: PCB printed circuit boards 71.45%, IC packaging substrates 21.09%, others 4.29%, and semiconductor test boards 3.17% [1] Shareholder Analysis - Southern Fund's Southern CSI 500 ETF (510500) is among the top ten circulating shareholders of Xingsen Technology. In the third quarter, it reduced its holdings by 435,600 shares, now holding 24.6112 million shares, which accounts for 1.63% of circulating shares. The estimated floating loss today is approximately 28.3029 million CNY [2] - The Southern CSI 500 ETF (510500) was established on February 6, 2013, with a latest scale of 140.098 billion CNY. Year-to-date return is 29.93%, ranking 1781 out of 4216 in its category; the one-year return is 19.19%, ranking 2057 out of 3917; and since inception, the return is 146.52% [2] Fund Performance - The fund manager of Southern CSI 500 ETF (510500) is Luo Wenjie, who has a cumulative tenure of 12 years and 206 days. The total asset scale of the fund is 170.445 billion CNY, with the best fund return during his tenure being 151.42% and the worst being -47.6% [3] Top Holdings - Southern Fund's Southern CSI 500 Enhanced Strategy ETF (560100) also holds Xingsen Technology as a significant position. In the third quarter, it held 38,500 shares, accounting for 1.18% of the fund's net value, ranking as the third-largest holding. The estimated floating loss today is about 44,300 CNY [4] - The Southern CSI 500 Enhanced Strategy ETF (560100) was established on January 26, 2022, with a latest scale of 72.2298 million CNY. Year-to-date return is 29.14%, ranking 1858 out of 4216; the one-year return is 22.4%, ranking 1715 out of 3917; and since inception, the return is 23.21% [4] Fund Manager Profile - The fund manager of Southern CSI 500 Enhanced Strategy ETF (560100) is Cui Lei, who has a cumulative tenure of 7 years and 5 days. The total asset scale of the fund is 122.76 billion CNY, with the best fund return during her tenure being 178.4% and the worst being -15.93% [5]

Core Viewpoint - Xingsen Technology's stock has shown significant growth this year, with a year-to-date increase of 96.57%, reflecting strong market interest and performance in the PCB and semiconductor sectors [1][2]. Financial Performance - For the period from January to September 2025, Xingsen Technology achieved a revenue of 5.373 billion yuan, representing a year-on-year growth of 23.48%. The net profit attributable to shareholders was 131 million yuan, marking a substantial increase of 516.08% [2]. - The company has distributed a total of 1.129 billion yuan in dividends since its A-share listing, with 270 million yuan distributed over the past three years [3]. Stock Market Activity - On November 4, Xingsen Technology's stock price rose by 2.11%, reaching 21.78 yuan per share, with a trading volume of 681 million yuan and a turnover rate of 2.11%. The total market capitalization stood at 37.019 billion yuan [1]. - The stock has appeared on the "Dragon and Tiger List" three times this year, with the most recent instance on October 15, where it recorded a net purchase of 113 million yuan [1]. Shareholder Information - As of October 20, 2025, the number of shareholders for Xingsen Technology was 118,000, an increase of 3.51% from the previous period. The average number of circulating shares per shareholder decreased by 3.39% to 12,800 shares [2]. - Notable shareholders include Hong Kong Central Clearing Limited and Southern CSI 500 ETF, with changes in their holdings noted [3].

Investment Rating - The report maintains a "Buy" rating for the companies mentioned, indicating a potential upside of over 15% relative to the benchmark index [4][5]. Core Insights - The report highlights a significant shortage of upstream materials affecting high-end substrates, with expectations that the supply issues will persist for about a year [1]. - The demand for high-end substrates is projected to grow alongside the increasing need for computing power driven by AI developments, creating a favorable investment landscape [3]. - Companies like Xingsen Technology are focusing on enhancing their IC packaging substrate business, achieving a revenue increase of 36.04% year-on-year in the first half of 2025 [2]. Summary by Sections Upstream Material Shortage - The shortage of materials such as T-Glass and quartz fabric is expected to impact high-end substrate shipments, with a peak shortage anticipated in the next six months [1]. - The chairman of Xinxing noted that the supply gap for high-end copper-clad laminates (CCL) is challenging, but improvements are expected starting from Q3 2026 [1]. Company Performance - Xingsen Technology's IC packaging substrate business generated revenue of 722 million yuan in the first half of 2025, with a focus on high-value products and expansion into the automotive market [2]. - The company is also seeing a significant increase in sample orders for FCBGA substrates, indicating potential for mass production opportunities [2]. Investment Opportunities - The report suggests continued attention to investment opportunities in companies such as Xingsen Technology, Shennan Circuit, Shengyi Technology, and Nanya New Materials due to the expected growth in high-end substrate demand and domestic substitution potential [3].

Core Insights - On October 24, Xingsen Technology's stock rose by 5.3%, reaching a price of 20.05 CNY per share, with a trading volume of 620 million CNY and a turnover rate of 2.09%, resulting in a total market capitalization of 34.078 billion CNY [1] Company Overview - Shenzhen Xingsen Quick Circuit Technology Co., Ltd. is located in Nanshan District, Shenzhen, Guangdong Province, and was established on March 18, 1999, with its IPO on June 18, 2010 [1] - The company's main business includes PCB (Printed Circuit Board) and semiconductor operations, with revenue composition as follows: PCB business 71.45%, IC packaging substrate 21.09%, other 4.29%, and semiconductor testing board 3.17% [1] Shareholder Analysis - Among the top ten circulating shareholders of Xingsen Technology, a fund under Everbright Pramerica Asset Management holds a significant position. The Everbright Pramerica Credit Enhancing Bond A Class Fund (360013) reduced its holdings by 10.646 million shares in Q2, retaining 11.2931 million shares, which accounts for 0.75% of the circulating shares [2] - The fund has achieved a year-to-date return of 20.86%, ranking 57 out of 6231 in its category, and a one-year return of 28.41%, ranking 22 out of 6005 [2] Fund Management - The fund manager of Everbright Pramerica Credit Enhancing Bond A Class Fund is Huang Bo, who has been in the position for 6 years and 18 days. The fund's total asset size is 14.614 billion CNY, with the best return during his tenure being 89.13% and the worst being 10.02% [3]