9月29日，兴森科技盘中上涨2.02%，截至10:11，报22.70元/股，成交5.85亿元，换手率1.72%，总市值 385.83亿元。 资金流向方面，主力资金净流入2534.39万元，特大单买入1.04亿元，占比17.82%，卖出8630.99万元， 占比14.74%；大单买入1.73亿元，占比29.63%，卖出1.66亿元，占比28.38%。 兴森科技今年以来股价涨104.87%，近5个交易日跌5.34%，近20日涨4.22%，近60日涨74.21%。 今年以来兴森科技已经2次登上龙虎榜，最近一次登上龙虎榜为8月29日，当日龙虎榜净买入4361.16万 元；买入总计6.78亿元 ，占总成交额比13.11%；卖出总计6.35亿元 ，占总成交额比12.27%。 资料显示，深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层，成立日期1999年3月18日，上市日期2010年6月18日，公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为：PCB印制电路板71.45%，IC封装基板 21.09%，其他4.29%，半导体测试板3.17%。 ...

兴森科技所属申万行业为：电子-元件-印制电路板。所属概念板块包括：PCB概念、5G、光通信、华为 概念、毫米波雷达等。 截至9月19日，兴森科技股东户数13.30万，较上期增加13.68%；人均流通股11357股，较上期减少 12.03%。2025年1月-6月，兴森科技实现营业收入34.26亿元，同比增长18.91%；归母净利润2883.29万 元，同比增长47.85%。 分红方面，兴森科技A股上市后累计派现11.29亿元。近三年，累计派现2.70亿元。 机构持仓方面，截止2025年6月30日，兴森科技十大流通股东中，香港中央结算有限公司位居第五大流 通股东，持股3361.64万股，相比上期增加831.05万股。南方中证500ETF（510500）位居第六大流通股 东，持股2504.68万股，相比上期增加351.90万股。光大保德信信用添益债券A类（360013）位居第九大 流通股东，持股1129.31万股，相比上期减少1064.60万股。易方达供给改革混合（002910）退出十大流 通股东之列。 9月25日，兴森科技盘中下跌2.05%，截至09:39，报22.48元/股，成交2.44亿元，换手率0.71%， ...

融资方面，兴森科技当日融资买入4.43亿元。当前融资余额28.91亿元，占流通市值的7.41%，融资余额 超过近一年90%分位水平，处于高位。 融券方面，兴森科技9月24日融券偿还15.78万股，融券卖出2300.00股，按当日收盘价计算，卖出金额 5.28万元；融券余量81.93万股，融券余额1880.29万元，超过近一年90%分位水平，处于高位。 资料显示，深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层，成立日期1999年3月18日，上市日期2010年6月18日，公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为：PCB印制电路板71.45%，IC封装基板 21.09%，其他4.29%，半导体测试板3.17%。 9月24日，兴森科技跌1.33%，成交额31.71亿元。两融数据显示，当日兴森科技获融资买入额4.43亿 元，融资偿还2.30亿元，融资净买入2.12亿元。截至9月24日，兴森科技融资融券余额合计29.10亿元。 分红方面，兴森科技A股上市后累计派现11.29亿元。近三年，累计派现2.70亿元。 机构持仓方面，截止 ...

Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected stock price increase of over 15% relative to the industry index in the next six months [4][16]. Core Views - The company achieved revenue and net profit growth in the first half of 2025, with revenue reaching 3.426 billion yuan, a year-on-year increase of 18.91%, and net profit of 29 million yuan, up 47.85% year-on-year [2][3]. - The semiconductor business, particularly the IC packaging substrate segment, is a focus area for technological enhancement and customer expansion, with revenue from this segment growing by 36.04% year-on-year [3][8]. - The company is optimistic about future performance due to ongoing product upgrades and increasing capacity utilization, projecting net profits of 93 million yuan, 280 million yuan, and 742 million yuan for 2025, 2026, and 2027 respectively [8]. Financial Performance Summary - Revenue is projected to grow from 5.36 billion yuan in 2023 to 10.57 billion yuan in 2027, with a compound annual growth rate (CAGR) of 25.1% [1]. - The net profit is expected to recover from a loss of 198 million yuan in 2024 to a profit of 742 million yuan by 2027, reflecting significant growth rates in subsequent years [1][8]. - The company's return on equity (ROE) is forecasted to improve from 2.0% in 2023 to 11.1% in 2027, indicating enhanced profitability [1][8]. Business Segment Insights - The PCB business generated 2.448 billion yuan in revenue, with a gross margin of 26.32%, while the semiconductor segment achieved 831 million yuan in revenue, marking a 38.39% increase [2][3]. - The CSP packaging substrate business is expanding into high-value markets, including automotive, with increasing capacity utilization and a focus on high-end products [3]. - The company is actively pursuing both domestic and international clients to enhance its market presence and secure future production opportunities [3].

Core Insights - The company reported a revenue of 3.43 billion yuan for the first half of 2025, representing an 18.91% increase compared to the same period last year [1] - Net profit attributable to shareholders reached 28.83 million yuan, a 47.85% increase year-on-year [1] - The company’s semiconductor business, including IC packaging substrate and semiconductor testing board, achieved a revenue of 830 million yuan, marking a 38.39% increase [2][3] Financial Performance - Revenue for the PCB business was 2.448 billion yuan, a year-on-year growth of 12.8%, with a gross margin of 26.32%, slightly down by 0.77 percentage points [2] - The net profit for the Fineline subsidiary was 75.96 million yuan, a decrease of 13.5%, primarily due to foreign exchange losses [2] - The company’s total assets at the end of the reporting period were 14.99 billion yuan, a 9.67% increase from the previous year [1] Business Segments - The IC packaging substrate business generated 722 million yuan in revenue, a 36.04% increase, driven by CSP packaging substrate contributions [2][3] - The company is focusing on high-value products in the CSP packaging substrate business, particularly in storage and RF sectors, and is expanding into the automotive market [3] - The FCBGA packaging substrate project has not yet achieved mass production, leading to a negative gross margin of -25.17% [3]

Investment Rating - The report maintains a "Buy" rating for the company, indicating a positive outlook for long-term growth potential [4][6]. Core Insights - The company, Xingsen Technology, focuses on advanced electronic circuit solutions, with its PCB and semiconductor businesses driving growth. The traditional PCB business emphasizes rapid prototyping and mass production, while the semiconductor segment concentrates on IC packaging substrates [2][3]. - The company has achieved continuous revenue growth, with a reported revenue of 5.817 billion yuan in 2024, representing an 8.53% year-on-year increase. However, it faced a net loss of 198 million yuan [4]. Summary by Sections Business Overview - Xingsen Technology specializes in advanced electronic circuit solutions, with a focus on PCB and semiconductor sectors. The company is enhancing its PCB factory's digital transformation to improve operational efficiency and customer satisfaction [2]. - The company is expanding its high-end PCB offerings, including Anylayer HDI boards and SLP products, while also targeting high-end optical modules and millimeter-wave communication markets [2][3]. Market Position - Xingsen Technology maintains a leading position in the PCB industry, ranking 14th among comprehensive PCB companies in China and 7th among domestic firms according to CPCA. It is also ranked 30th among the top 40 global PCB suppliers by Prismark [3]. Financial Performance - In 2024, the company reported a revenue of 5.817 billion yuan, an increase of 8.53% from the previous year. The first quarter of 2025 saw a revenue of 1.580 billion yuan, reflecting a 13.77% year-on-year growth [4]. - The forecast for net profit has been adjusted downward for 2025 and 2026 due to industry demand issues, with projected net profits of 112 million yuan and 271 million yuan, respectively [4]. Growth Potential - The CSP packaging substrate business is expected to have significant growth potential, focusing on storage and RF markets while expanding into the automotive sector. The company aims to enhance profitability through a shift towards high-value products [3][4].

Core Viewpoint - The credit rating report indicates that Shenzhen Xingsen Quick Circuit Technology Co., Ltd. (referred to as "Xingsen Technology") maintains a stable credit rating of AA, reflecting its leading position in the domestic PCB prototype and small batch board sector, despite facing significant financial challenges due to high upfront costs in semiconductor projects and slow order integration [2][4][5]. Company Overview - Xingsen Technology is recognized as one of the few domestic manufacturers capable of mass production of FCBGA packaging substrates, maintaining a technological edge in the industry [2][17]. - The company has a diversified product application across various sectors, including communication, industrial control, medical electronics, and consumer electronics, with a stable customer base [4][17]. Financial Performance - The company reported total assets of 145.69 billion and total liabilities of 59.44 billion as of March 2025, with operating revenue of 15.80 billion for the year [2]. - The net profit for 2024 was a loss of 5.31 billion, reflecting the impact of high costs associated with semiconductor projects and insufficient order volume [3][5]. - The company's debt-to-equity ratio increased, indicating rising financial leverage and debt repayment pressure [5][19]. Industry Environment - The PCB market is expected to recover in 2024, driven by demand from AI servers and consumer electronics, with a projected global market value of 73.6 billion, representing a 5.8% year-on-year growth [11][12]. - The domestic PCB market in China is anticipated to grow from 41.2 billion to 50.8 billion from 2024 to 2029, with a compound annual growth rate of 4.3% [11][12]. - The industry faces challenges such as high raw material costs and competitive pressures, which may impact profit margins [15][19]. Competitive Position - Xingsen Technology ranks seventh among domestic PCB manufacturers according to the CPCA, showcasing its competitive strength [17]. - The company has invested significantly in R&D, with 4.42 billion allocated in 2024, and has received national awards for its technological advancements [18][19]. - Despite the competitive landscape, Xingsen Technology's PCB business saw a revenue increase of 5.11% in 2024, primarily due to recovery in the consumer electronics sector [19].

Group 1 - The core point of the article is that Xingsen Technology plans to acquire a 24% stake in Guangzhou Xinke Semiconductor for 320 million yuan, which will enhance its control over the subsidiary [1] - Guangzhou Xinke, originally a subsidiary of Xingsen Technology, focuses on CSP packaging and was established in January 2020 with a registered capital of 1 billion yuan, where Xingsen contributed 410 million yuan, holding a 41% stake [1][2] - The exit of the major fund from Guangzhou Xinke is seen as the final exercise of its exit rights, following a previous announcement regarding the cash buyback of shares [1][2] Group 2 - The establishment of Guangzhou Xinke was driven by Xingsen Technology's need to increase production capacity and enhance advanced process capabilities to meet the growing demands of international clients [2] - Despite the ambitious profit targets set for 2021, 2022, and 2023, Guangzhou Xinke reported a revenue of 319 million yuan and a net loss of 70.7 million yuan for 2024, indicating ongoing challenges in achieving profitability [2] - Xingsen Technology aims to enhance its management efficiency and decision-making by increasing its stake in Guangzhou Xinke to 90% directly and 9.92% indirectly, aligning with its overall strategic development plan [3]

Investment Rating - The report maintains an "Accumulate" rating for the company [1][4] Core Views - The company's profits are under pressure due to strategic investments and market conditions, but it continues to focus on technological improvements and market expansion in its semiconductor business [3][4][7] - The company is expected to achieve revenues of RMB 76.21 billion, RMB 92.79 billion, and RMB 109.86 billion for the years 2025, 2026, and 2027 respectively, with corresponding net profits of RMB 1.08 billion, RMB 3.04 billion, and RMB 4.26 billion [4][6] Financial Summary - The company reported a revenue of RMB 58.17 billion in 2024, a year-on-year increase of 8.53%, but a net loss of RMB 1.98 billion [7] - For Q1 2025, the company achieved a revenue of RMB 15.80 billion, a year-on-year increase of 13.77%, but a net profit of RMB 0.09 billion, down 62.24% year-on-year [7] - The company's PCB business generated revenue of RMB 43.00 billion in 2024, with a gross margin of 26.96%, down 1.76 percentage points year-on-year [7] - The semiconductor business generated revenue of RMB 12.85 billion in 2024, with a gross margin of -33.16%, down 28.60 percentage points year-on-year [7] Revenue and Profit Forecast - The company is projected to have a revenue growth rate of 31.0% in 2025, followed by 21.7% in 2026 and 18.4% in 2027 [6][21] - The projected net profit for 2025 is RMB 108 million, with significant growth expected in subsequent years [6][21] Valuation Metrics - The company is expected to have a PE ratio of 177.6 in 2025, decreasing to 63.3 in 2026 and 45.1 in 2027 [4][6] - The projected EBITDA for 2025 is RMB 732 million, with a significant increase in the following years [6][21]

Group 1 - The well-known private equity firm Tongben Investment recently conducted research on three listed companies [1][2][3] - The first company, Haixiangni, aims to promote its brand culture through the IP image of "Feini and Xiangzai," targeting younger demographics [1] - The second company, Xingsen Technology, specializes in PCB products for industrial control and robotics, with target clients including chip design companies and packaging factories [2] - The third company, Ruilite, has launched an AI health toilet featuring the Deepseek model, introducing AI technology into the bathroom industry [3] Group 2 - Tongben Investment was established in January 2014 with a registered capital of 10 million, and it is recognized for its unique approach as a sunshine private equity firm [3] - The firm is notable for being founded by award-winning analysts, with its general manager and investment director, Mr. Tong Xun, having a strong background in the food and beverage sector [3]