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兴森科技涨2.06%,成交额9.86亿元,主力资金净流出1430.57万元
Xin Lang Cai Jing· 2026-01-08 03:10
1月8日,兴森科技盘中上涨2.06%,截至10:44,报22.77元/股,成交9.86亿元,换手率2.92%,总市值 387.02亿元。 资金流向方面,主力资金净流出1430.57万元,特大单买入1.29亿元,占比13.09%,卖出1.34亿元,占比 13.58%;大单买入3.03亿元,占比30.71%,卖出3.12亿元,占比31.66%。 兴森科技今年以来股价涨7.56%,近5个交易日涨4.93%,近20日涨3.97%,近60日涨21.38%。 资料显示,深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层,成立日期1999年3月18日,上市日期2010年6月18日,公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为:PCB印制电路板71.45%,IC封装基板 21.09%,其他4.29%,半导体测试板3.17%。 兴森科技所属申万行业为:电子-元件-印制电路板。所属概念板块包括:华为海思、机器人概念、华为 概念、毫米波雷达、基金重仓等。 截至12月19日,兴森科技股东户数11.90万,较上期增加7.21%;人均流通股12693股 ...
兴森科技涨2.04%,成交额7.64亿元,主力资金净流出3536.23万元
Xin Lang Cai Jing· 2025-12-24 05:36
12月24日,兴森科技盘中上涨2.04%,截至13:08,报20.55元/股,成交7.64亿元,换手率2.49%,总市值 349.28亿元。 资金流向方面,主力资金净流出3536.23万元,特大单买入8474.39万元,占比11.09%,卖出1.05亿元, 占比13.72%;大单买入1.90亿元,占比24.93%,卖出2.06亿元,占比26.93%。 截至12月19日,兴森科技股东户数11.90万,较上期增加7.21%;人均流通股12693股,较上期减少 6.72%。2025年1月-9月,兴森科技实现营业收入53.73亿元,同比增长23.48%;归母净利润1.31亿元,同 比增长516.08%。 分红方面,兴森科技A股上市后累计派现11.29亿元。近三年,累计派现2.70亿元。 今年以来兴森科技已经3次登上龙虎榜,最近一次登上龙虎榜为10月15日,当日龙虎榜净买入1.13亿 元;买入总计5.30亿元 ,占总成交额比25.05%;卖出总计4.17亿元 ,占总成交额比19.70%。 资料显示,深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层, ...
兴森科技股价涨5.31%,兴银基金旗下1只基金重仓,持有2.3万股浮盈赚取2.35万元
Xin Lang Cai Jing· 2025-12-22 03:32
数据显示,兴银基金旗下1只基金重仓兴森科技。兴银中证500指数增强A(010253)三季度持有股数2.3 万股,占基金净值比例为0.67%,位居第六大重仓股。根据测算,今日浮盈赚取约2.35万元。 兴银中证500指数增强A(010253)成立日期2021年3月1日,最新规模3118.54万。今年以来收益 29.93%,同类排名1496/4197;近一年收益26.77%,同类排名1535/4152;成立以来收益16.55%。 兴银中证500指数增强A(010253)基金经理为翁子晨。 12月22日,兴森科技涨5.31%,截至发稿,报20.22元/股,成交8.65亿元,换手率2.89%,总市值343.67 亿元。 资料显示,深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层,成立日期1999年3月18日,上市日期2010年6月18日,公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为:PCB印制电路板71.45%,IC封装基板 21.09%,其他4.29%,半导体测试板3.17%。 从基金十大重仓股角度 截至发稿,翁子晨累计任职时间1 ...
兴森科技股价涨5.31%,鹏华基金旗下1只基金重仓,持有2.78万股浮盈赚取2.84万元
Xin Lang Cai Jing· 2025-12-22 03:32
鹏华弘裕一年持有期混合A(011052)基金经理为李君。 截至发稿,李君累计任职时间12年329天,现任基金资产总规模17.42亿元,任职期间最佳基金回报 89.36%, 任职期间最差基金回报-2.77%。 风险提示:市场有风险,投资需谨慎。本文为AI大模型自动发布,任何在本文出现的信息(包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等)均只作为参考,不构成个人投资建 议。 责任编辑:小浪快报 12月22日,兴森科技涨5.31%,截至发稿,报20.22元/股,成交8.64亿元,换手率2.89%,总市值343.67 亿元。 资料显示,深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层,成立日期1999年3月18日,上市日期2010年6月18日,公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为:PCB印制电路板71.45%,IC封装基板 21.09%,其他4.29%,半导体测试板3.17%。 从基金十大重仓股角度 数据显示,鹏华基金旗下1只基金重仓兴森科技。鹏华弘裕一年持有期混合A(011052)三季度持有股 数2 ...
兴森科技涨2.03%,成交额1.52亿元,主力资金净流入1449.47万元
Xin Lang Cai Jing· 2025-12-22 02:01
今年以来兴森科技已经3次登上龙虎榜,最近一次登上龙虎榜为10月15日,当日龙虎榜净买入1.13亿 元;买入总计5.30亿元 ,占总成交额比25.05%;卖出总计4.17亿元 ,占总成交额比19.70%。 资料显示,深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层,成立日期1999年3月18日,上市日期2010年6月18日,公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为:PCB印制电路板71.45%,IC封装基板 21.09%,其他4.29%,半导体测试板3.17%。 兴森科技所属申万行业为:电子-元件-印制电路板。所属概念板块包括:华为海思、机器人概念、华为 概念、毫米波雷达、基金重仓等。 分红方面,兴森科技A股上市后累计派现11.29亿元。近三年,累计派现2.70亿元。 12月22日,兴森科技盘中上涨2.03%,截至09:40,报19.59元/股,成交1.52亿元,换手率0.52%,总市值 332.97亿元。 机构持仓方面,截止2025年9月30日,兴森科技十大流通股东中,香港中央结算有限公司位居第五大流 通股东,持股35 ...
兴森科技:公司PCB、半导体测试板、IC封装基板业务均正常经营
Zheng Quan Ri Bao· 2025-12-15 14:16
证券日报网讯 12月15日,兴森科技在互动平台回答投资者提问时表示,公司PCB、半导体测试板、IC 封装基板业务均正常经营。FCBGA封装基板业务公司已在产能规模和产品良率层面做好充分的量产准 备,大批量量产的进度主要取决于行业需求恢复状况、客户自身的量产进展及其供应商管理策略。 (文章来源:证券日报) ...
兴森科技:公司IC封装基板为芯片封装原材料
Zheng Quan Ri Bao· 2025-12-05 15:48
Core Insights - The company, Xingsen Technology, has confirmed that its IC packaging substrates are essential raw materials for chip packaging, utilized in various applications including CPU, GPU, FPGA, ASIC, storage chips, and RF chips [2] Group 1 - The IC packaging substrates are specifically designed for chip packaging applications [2] - The specific application scenarios for chip products are determined by customers based on their individual needs [2]
兴森科技股价涨5%,南方基金旗下1只基金位居十大流通股东,持有2461.12万股浮盈赚取2485.73万元
Xin Lang Cai Jing· 2025-11-28 02:31
Core Viewpoint - The stock of Xingsen Technology increased by 5% on November 28, reaching a price of 21.20 CNY per share, with a trading volume of 869 million CNY and a turnover rate of 2.77%, resulting in a total market capitalization of 36.033 billion CNY [1] Group 1: Company Overview - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is located in Shenzhen, Guangdong Province. The company primarily engages in PCB and semiconductor businesses [1] - The revenue composition of Xingsen Technology includes: 71.45% from PCB printed circuit boards, 21.09% from IC packaging substrates, 4.29% from other sources, and 3.17% from semiconductor testing boards [1] Group 2: Shareholder Information - Southern Fund's Southern CSI 500 ETF (510500) is among the top ten circulating shareholders of Xingsen Technology, having reduced its holdings by 435,600 shares in the third quarter, now holding 24.6112 million shares, which accounts for 1.63% of circulating shares [2] - The estimated floating profit from this position is approximately 24.8573 million CNY [2] Group 3: Fund Performance - The Southern CSI 500 ETF (510500) has a total asset size of 140.098 billion CNY, with a year-to-date return of 23.3%, ranking 1975 out of 4206 in its category, and a one-year return of 21.6%, ranking 1987 out of 4008 [2] - The fund manager, Luo Wenjie, has been in position for 12 years and 224 days, achieving a best fund return of 145.85% and a worst return of -47.6% during his tenure [3] Group 4: Additional Fund Holdings - The Southern CSI 500 Enhanced Strategy ETF (560100) also holds Xingsen Technology as a significant position, with 38,500 shares, representing 1.18% of the fund's net value [4] - The estimated floating profit from this position is about 38,900 CNY [4] Group 5: Enhanced Strategy ETF Performance - The Southern CSI 500 Enhanced Strategy ETF (560100) has a total asset size of 72.2298 million CNY, with a year-to-date return of 22.17%, ranking 2130 out of 4206, and a one-year return of 22.88%, ranking 1820 out of 4008 [4] - The fund manager, Cui Lei, has been in position for 7 years and 23 days, achieving a best fund return of 167.8% and a worst return of -15.93% during her tenure [5]
兴森科技涨2.04%,成交额8.02亿元,主力资金净流出7513.22万元
Xin Lang Zheng Quan· 2025-11-26 03:21
Core Viewpoint - The stock of Xingsen Technology has shown significant volatility, with a year-to-date increase of 85.11%, but recent trading indicates a slight decline in the short term [1][2]. Group 1: Stock Performance - As of November 26, Xingsen Technology's stock price reached 20.51 CNY per share, with a market capitalization of 34.86 billion CNY [1]. - The stock has experienced a net outflow of 75.13 million CNY in principal funds, with large orders accounting for 25.54% of purchases and 32.19% of sales [1]. - Over the past five trading days, the stock has decreased by 0.34%, and over the past 20 days, it has declined by 5.92% [1]. Group 2: Financial Performance - For the period from January to September 2025, Xingsen Technology reported a revenue of 5.373 billion CNY, representing a year-on-year growth of 23.48%, and a net profit attributable to shareholders of 131 million CNY, which is a significant increase of 516.08% [2]. - The company has distributed a total of 1.129 billion CNY in dividends since its A-share listing, with 270 million CNY distributed in the last three years [3]. Group 3: Shareholder Information - As of November 20, the number of shareholders for Xingsen Technology was 119,000, a decrease of 4.03% from the previous period, while the average circulating shares per person increased by 4.20% to 12,693 shares [2]. - Notable changes in the top ten circulating shareholders include an increase in holdings by Hong Kong Central Clearing Limited and new entries from Yongying Technology Smart Selection Mixed Fund A and other funds [3].
兴森科技:IC封装基板为芯片封装原材料
Zheng Quan Ri Bao Wang· 2025-11-24 09:44
Core Viewpoint - The company, Xingsen Technology, specializes in IC packaging substrates, which are essential raw materials for chip packaging, targeting chip design companies and packaging manufacturers as its primary customers [1] Group 1 - The company confirmed on November 24 that its IC packaging substrates serve as raw materials for chip packaging [1] - The specific clients and business cooperation details are not disclosed due to confidentiality agreements [1]