每经AI快讯，有投资者在投资者互动平台提问：董秘您好，请简要分析一下今年行业需求与贵司相关 业务可否延续去年供不应求状态；目前贵司FCBGA封装基板业务与相关客户的验测状况是否顺利，今 年可否扭亏为盈？最后一个问题，目前最新股东人数是多少？感谢董秘！ 兴森科技（002436.SZ）2月24日在投资者互动平台表示，尊敬的投资者，您好！2025年以来全球PCB行 业仍延续结构分化的复苏态势，AI产业仍为主要驱动力。根据Prismark报告，预计2025年全球PCB行业 的产值为848.91亿美元、同比增长15.4%。公司CSP封装基板业务行业整体需求较好，后期公司将根据 市场需求情况适时启动扩产。公司FCBGA封装基板业务市场拓展、客户认证均按计划稳步推进中，具 体业务情况请关注公司定期报告。截至2026年2月10日，公司股东总户数为十二万七千余户。感谢您的 关注。 （文章来源：每日经济新闻） ...

（文章来源：证券日报） 证券日报网讯 2月12日，兴森科技在互动平台回答投资者提问时表示，FCBGA封装基板业务进度主要 取决于行业需求恢复状况、客户自身的量产进展及其供应商管理策略，公司层面主要在于提升技术能 力、良率水准，并加强市场拓展，为未来的大批量量产打下坚实的基础，具体业务情况请关注公司定期 报告。 ...

Group 1 - The company, Xingsen Technology, stated that its FCBGA packaging substrates are primarily used in high-performance chip fields such as CPU, GPU, FPGA, and ASIC [2] - The CSP packaging substrates are mainly utilized in storage and RF chip sectors, with an overall production capacity of 50,000 square meters per month [2] - The previous capacity of 35,000 square meters per month has reached full production, and the new expansion of 15,000 square meters per month is progressing rapidly [2] - The overall industry demand is currently strong, and future expansion plans will depend on market demand [2]

Group 1 - The company expects to turn a profit in the fiscal year 2025, with the performance forecast period from January 1, 2025, to December 31, 2025 [1] - The company has communicated with its auditing firm regarding the performance forecast, and there are no discrepancies between the company and the auditors [1][3] - The main reasons for the performance changes include stable revenue growth due to industry recovery, with specific impacts from the FCBGA packaging substrate business and the high-layer PCB business [3] Group 2 - The FCBGA packaging substrate business has not yet achieved mass production, resulting in a financial drag with an annual expense of approximately 660 million yuan, although sample order quantities have significantly increased year-on-year [3] - The high-layer PCB business incurred a loss of about 100 million yuan for the year, but quarterly losses have been narrowing, nearing breakeven in the fourth quarter [3] - Other financial impacts include interest expenses from convertible bonds of approximately 17 million yuan, a fair value loss of about 38 million yuan from equity redemption rights, and an increase in income tax expenses of about 36 million yuan due to high-tech enterprise certification [4] Group 3 - The total impact on the company's net profit attributable to shareholders is approximately 100 million yuan [5] - The company has not identified any significant uncertainties affecting the accuracy of the performance forecast as of the announcement date [6]

Core Viewpoint - The company expects to achieve a net profit attributable to shareholders of 132 million to 140 million yuan in 2025, marking a turnaround from losses in the previous year [1] Financial Performance - The net profit excluding non-recurring gains and losses is projected to be between 138 million and 146 million yuan, also indicating a return to profitability year-on-year [1] - The company’s revenue is experiencing stable growth due to industry recovery [1] Business Segments - The FCBGA packaging substrate business of Guangzhou Xingsen Semiconductor Co., Ltd. has not yet achieved mass production, which continues to drag on profitability, with total expenses for the year amounting to approximately 660 million yuan [1] - The sample order quantity for the FCBGA business has seen significant year-on-year growth [1] - The high-layer PCB business of Yixing Silicon Valley Electronic Technology Co., Ltd. suffered a loss of about 100 million yuan for the year due to suboptimal product structure, although quarterly losses have been narrowing, with the fourth quarter nearing breakeven [1]

Core Viewpoint - The company expects a net profit attributable to shareholders of 132 million to 140 million yuan for the year 2025, indicating a turnaround from losses in the previous year [1] Group 1: Financial Performance - The company anticipates a net profit excluding non-recurring gains and losses of 138 million to 146 million yuan for 2025 [1] - The net profit is expected to show a year-on-year improvement, moving from a loss to profitability [1] Group 2: Revenue and Business Impact - The company's revenue is projected to grow steadily due to industry recovery, with significant contributions from its subsidiaries [1] - The FCBGA packaging substrate business has not yet achieved mass production, impacting profitability, with an annual expense of approximately 660 million yuan [1] - The high-layer PCB business is expected to incur a loss of about 100 million yuan for the year, although quarterly losses are narrowing, nearing breakeven in Q4 [1] Group 3: Other Financial Influences - Interest expenses related to convertible bonds are estimated to impact profits by about 17 million yuan [1] - Fair value loss from the redemption rights of Guangzhou Xingsen Semiconductor Co., Ltd. is expected to be around 38 million yuan [1] - The company anticipates an increase in income tax expenses by approximately 36 million yuan due to the recognition of deferred tax assets following the high-tech enterprise certification of Zhuhai Xinke Semiconductor Co., Ltd. [1] - The company expects to recognize a fair value loss of about 13 million yuan from its investment in Shenzhen Ruijun Semiconductor Co., Ltd., which continues to operate at a loss [1]

Group 1 - The core viewpoint of the news is that Xingsen Technology (兴森科技) experienced a significant stock price increase, reaching a limit up of 10% on January 21, 2026, driven by strong financial performance and positive market conditions in the semiconductor sector [1][2]. Group 2 - Xingsen Technology reported impressive third-quarter results, with net profit increasing by 516.08%, non-recurring net profit rising by 1195.59%, and operating revenue growing by 23.48%, indicating substantial business expansion [2]. - The company highlighted an improvement in the storage chip sector, which is expected to positively impact its business, as rising storage chip prices may enhance product pricing and overall performance [2]. - Xingsen Technology is making steady progress in its FCBGA packaging substrate business, with capacity expansion and product yield preparations in place, while also focusing on CoWoP packaging technologies and actively pursuing new industry opportunities [2]. - The semiconductor and components sector saw capital inflows on January 21, 2026, with multiple related stocks rising, and Xingsen Technology, being a competitive player in the sector, benefited from this sector-wide momentum [2]. - Technical indicators suggest that if the MACD forms a golden cross and the stock price breaks through significant resistance levels, it may attract more technical investors, further driving the stock price up [2].

Group 1 - The core viewpoint of the article is that the company is making steady progress in expanding its FCBGA packaging substrate business and customer certification, with no abnormalities found in the substrate based on feedback from testing results [1] - The company has adequately prepared for mass production in terms of capacity scale and product yield, with the pace of large-scale production primarily dependent on industry demand recovery, customer mass production progress, and supplier management strategies [1]

Core Viewpoint - The company is making steady progress in expanding its FCBGA packaging substrate business, with customer certification and market development on track [1] Group 1: Business Development - The company has reported that the feedback from testing results shows no abnormalities in the substrates [1] - The company is fully prepared for mass production in terms of capacity scale and product yield [1] Group 2: Production and Market Factors - The pace of large-scale mass production primarily depends on the recovery of industry demand, the customer's own mass production progress, and their supplier management strategies [1]

Core Viewpoint - The company is progressing steadily in the market expansion and customer certification of its FCBGA packaging substrate project, and the operational situation will be detailed in future regular reports [2][4]. Group 1 - Investors inquired about whether the certification and introduction speed of key customers for the ABF substrate is below expectations [2][4]. - There are concerns regarding whether the idle high-end capacity will impact this year's financial report [2][4].