（文章来源：每日经济新闻） （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：公司ABF载板关键客户认证与导入速度是否低于预期？ 高端产能的闲置会影响今年的财报吗？ 兴森科技（002436.SZ）12月31日在投资者互动平台表示，公司FCBGA封装基板项目市场拓展、客户认 证均按计划稳步推进中，公司经营情况请关注后续定期报告。 每经AI快讯，有投资者在投资者互动平台提问：公司ABF载板关键客户认证与导入速度是否低于预期？ 高端产能的闲置会影响今年的财报吗？ 兴森科技（002436.SZ）12月31日在投资者互动平台表示，公司FCBGA封装基板项目市场拓展、客户认 证均按计划稳步推进中，公司经营情况请关注后续定期报告。 ...

证券日报网讯12月25日，兴森科技（002436）在互动平台回答投资者提问时表示，芯片设计公司和封装 厂商均为公司封装基板业务的目标客户，公司与具体客户的合作因涉及保密协议不便披露。公司 FCBGA封装基板已反馈封测结果均为未发现基板异常。 ...

每经AI快讯，有投资者在投资者互动平台提问：尊敬的公司高管：（1）请问之前公司已经给北美某潜 在大客户送样，请问送样通过后，后续的审厂一般需要多久的流程？（2）公司目前在算力板、存储环 节的业务在总的业务占比中大致是多少的比例？ （记者 胡玲） 兴森科技（002436.SZ）12月19日在投资者互动平台表示，FCBGA封装基板业务的客户导入都需要进行 技术评级、体系认证和产品认证，不同客户的要求会有所差异，大客户的考核认证标准更为严格，一般 而言，工厂的技术评级和体系认证需要约6个月时间完成，产品认证的周期也需要6个月左右。2025年上 半年，公司PCB业务占比为71.45%，客户所涉行业较广，具体应用视终端客户产品应用而定。IC封装基 板业务占比为21.09%，存储业务占IC封装基板的比例约2/3。 ...

Core Viewpoint - The recent changes in the shareholder structure of Anjieli Mewei Electronics Co., Ltd. have attracted attention, with the exit of the original shareholder and the entry of new investors, indicating a strategic shift towards enhancing its technological capabilities in the semiconductor packaging sector [5][6]. Group 1: Company Overview - Anjieli Mewei was established in December 2019 with a registered capital of 4.5 billion RMB, focusing on manufacturing optoelectronic devices, printed circuit boards, electronic components, and integrated circuits [5]. - The company offers advanced HDI one-stop solutions, including products like FCBGA packaging substrates, high-level HDI, and battery module assemblies [5]. Group 2: Financial Performance - For 2024, Anjieli Mewei is projected to achieve a revenue of 7.917 billion RMB with a net profit of 414 million RMB, resulting in a net profit margin of 5.2% [5]. - In the first three quarters of 2025, the company reported a revenue of 6.316 billion RMB and a net profit of 106 million RMB, with a reduced net profit margin of 1.7% [5]. - The total assets of the company increased from 15.974 billion RMB in 2024 to 16.607 billion RMB in 2025 [5]. Group 3: Investment and Strategic Implications - The entry of the National Big Fund Phase III and local state-owned enterprises as new shareholders reflects a recognition of Anjieli Mewei's technological strength in the packaging substrate sector, which is characterized by high technical barriers and low domestic production rates [6]. - The National Big Fund Phase III aims to strengthen the semiconductor industry by focusing on advanced manufacturing and high-end chip design, emphasizing the importance of "strong chain and supplementary chain" and "industrial chain collaboration" [6]. - The investment is expected to accelerate Anjieli Mewei's capacity building and technological iteration in high-end substrates, potentially filling domestic gaps and promoting the development of the upstream and downstream supply chains in the semiconductor packaging sector [6].

每经AI快讯，有投资者在投资者互动平台提问：公司IC封装业务四季度产能利用率大概是多少， FCGBA产线四季度的大概产能利用率是多少？ 兴森科技（002436.SZ）12月18日在投资者互动平台表示，公司CSP封装基板整体产能规模5万平米/月， 原3.5万平/月产能已满产，新扩1.5万平/月产能爬坡进度较快。FCBGA封装基板项目市场拓展、客户认 证均按计划稳步推进中。公司经营情况请关注后续的定期报告。 （记者 王瀚黎） ...

Core Viewpoint - The company is making steady progress in the market expansion and customer certification of its FCBGA packaging substrate business, with no abnormalities found in the substrate based on feedback from testing [2]. Group 1: Market and Customer Progress - The company has confirmed that the market expansion and customer certification for its FCBGA packaging substrate business are proceeding as planned [2]. - Feedback from testing has indicated that no abnormalities were found in the substrates, which is a positive sign for product quality [2]. Group 2: Certification and Production Timeline - Product certification typically requires around six months to complete [2]. - The timeline for mass production largely depends on the recovery of industry demand, the customer's own production progress, and their supplier management strategies [2].

证券日报网讯 12月15日，兴森科技在互动平台回答投资者提问时表示，公司PCB、半导体测试板、IC 封装基板业务均正常经营。FCBGA封装基板业务公司已在产能规模和产品良率层面做好充分的量产准 备，大批量量产的进度主要取决于行业需求恢复状况、客户自身的量产进展及其供应商管理策略。 （文章来源：证券日报） ...

Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is focusing on digital transformation and high-end packaging substrate strategies, particularly in the FCBGA packaging substrate market [1] - The company identifies chip design firms and packaging manufacturers as target customers for its packaging substrate business, although specific customer collaborations cannot be disclosed due to confidentiality agreements [1] - The company is accelerating the market expansion of its FCBGA packaging substrate project to enhance its core competitiveness [1]

格隆汇12月5日丨兴森科技(002436.SZ)在投资者互动平台表示，ABF膜是FCBGA封装基板的核心原材 料。 ...

（文章来源：证券日报） 证券日报网讯 12月3日，兴森科技在互动平台回答投资者提问时表示，公司FCBGA封装基板项目样品 持续交付认证中，数量稳速增加，截至目前，FCBGA封装基板已反馈封测结果均为未发现基板异常。 ...