Core Insights - The increasing demand for AI computing power is pushing single data centers to their physical limits in terms of power, cooling, and space [2] - NVIDIA has introduced the Spectrum-XGS Ethernet technology, which integrates geographically dispersed data centers into a unified AI super factory to address these limitations [2][3] - The future of computing power competition is shifting from individual data centers to cross-regional computing networks, with NVIDIA aiming to create a global "AI factory" network [5] Technology Overview - The Scale-Across model is emerging as the third pillar of AI computing, alongside Scale-Up and Scale-Out methods, allowing for the integration of data centers across different geographical locations [3] - NVIDIA's Spectrum-XGS technology has improved data center integration efficiency by 40% for its client, Coreweave [3] - The technology addresses high latency and performance uncertainty in long-distance data center interconnects, significantly enhancing distributed AI training efficiency [2][3] Market Implications - The introduction of GW-level AI supercomputing centers is expected to drive upgrades in optical communication infrastructure, increasing demand for optical modules and hollow-core fibers [6] - High-end PCB manufacturers are likely to benefit from the need for advanced circuit boards to support high-speed signal transmission in these new data centers [6] - The trend towards "powering computing" through grid-like scheduling and delivery of computing resources is anticipated to accelerate with the establishment of these AI factories [6] Industry Trends - The data center industry is evolving from traditional Internet Data Centers (IDC) to AI Data Centers (AIDC) due to the exponential growth of AI technology and AIGC [5] - Hollow-core fiber technology is expected to see rapid growth in demand due to its advantages in low latency and high capacity, making it suitable for long-distance data transmission [7][8] - The application of hollow-core fibers is still in its early stages, with challenges in mass production and cost optimization needing to be addressed before widespread commercial use [8]

Core Insights - The future of computing power competition is shifting from individual data centers to cross-regional computing networks [2][5] - NVIDIA's new Spectrum-XGS Ethernet technology integrates geographically dispersed data centers into a unified AI super factory to address the physical limits of single data centers [2][3] - The Scale-Across model emerges as a third pillar of AI computing, allowing integration of data centers across different cities, countries, and even continents [3][5] Industry Trends - The demand for AI computing power is pushing traditional data centers to evolve into AI data centers (AIDC) due to the exponential growth of AI technology and AIGC [5] - The integration of global resources through Spectrum-XGS can significantly reduce training time and enhance research efficiency for large models [4][5] - The need for high-speed, low-latency optical communication infrastructure is expected to rise, particularly for 1.6T/3.2T optical modules and hollow-core fibers [6][7] Market Impact - Companies involved in optical fiber and optical module production are experiencing increased attention and stock performance, with notable gains in companies like Yangtze Optical Fibre and Cable [2] - The demand for hollow-core fibers is anticipated to grow rapidly due to their advantages in low latency and high capacity, making them suitable for long-distance data transmission [7] - The transition to GW-level AI supercomputing centers is likely to drive growth in high-end PCB manufacturing and liquid cooling technologies [6][7]