Core Viewpoint - The automotive industry is undergoing a significant transformation driven by new energy, intelligence, low-carbon transitions, and global supply chain restructuring, with a focus on "efficient, zero-carbon, and intelligent" systems [1] Group 1: Event Overview - The 17th International Automotive Power System Technology Conference (TMC 2025) was held in Nantong, attracting over 2,750 professionals and over 800,000 online viewers, indicating high industry interest in power technology integration and innovation [1] - Key figures from the China Society of Automotive Engineers and local government attended and spoke at the opening ceremony [1] Group 2: Technological Focus - Experts discussed various cutting-edge topics including electric drive systems, hybrid systems, drive motors, power semiconductors, and commercial vehicle power systems [2] - Power semiconductors emerged as a major focus, showcasing rapid advancements from traditional silicon-based devices to silicon carbide (SiC), gallium nitride (GaN), and the debut of gallium oxide [2] Group 3: Silicon Carbide (SiC) - SiC has seen a price drop of over 70% in the past three years, with an expected penetration rate of over 35% by 2030, reflecting the rapid maturation of the SiC supply chain [3] - The evolution of chip structures and manufacturing processes is driving down costs, with strategies like "mixed main drive" proposed to optimize efficiency and cost [3] Group 4: Gallium Nitride (GaN) - GaN technology was highlighted as a surprise at TMC, with innovations like the ultra-thin "Ice Blade" module addressing cost, energy consumption, and size challenges in hybrid systems [5] - The cost of carrying current with GaN devices is approximately 40% of that of silicon devices, potentially redefining industry standards for component selection [5] Group 5: Gallium Oxide (Ga2O3) - The introduction of gallium oxide technology showcased China's capabilities in emerging semiconductor materials, with over 90% of gallium oxide powder resources concentrated in China [6] - The compatibility of gallium oxide with existing silicon processing equipment lowers the barriers for industry adoption [6] Group 6: Packaging Technology - Packaging technology has gained prominence, shifting from a supporting role to a critical factor in device performance and reliability [7] - Innovations in embedded packaging and direct cooling technologies are providing opportunities for Chinese companies to excel in this area [8] Group 7: Industry Competition - The deep involvement of vehicle manufacturers in power semiconductor development is reshaping traditional supply chain dynamics, with companies like BYD leading in defining technology routes [9] - BYD's introduction of a 1500V system exemplifies a strategy of vertical integration, combining modules, battery cells, and charging networks [9] Group 8: Diverse Technological Paths - The conference highlighted a diversification in technological approaches, with multiple semiconductor technologies coexisting, including silicon, SiC, GaN, and Ga2O3 [10] - Application-specific device selection is becoming a new optimization strategy, reflecting the complexity of system-level enhancements [10] Group 9: Challenges and Opportunities - Chinese companies have demonstrated significant technical strength in power semiconductors, but challenges remain in high-end packaging, system integration, and establishing industry standards [11] - The rapid growth of the electric vehicle market presents a substantial opportunity for power semiconductors, with China positioned as a market leader [12] Group 10: Future Directions - The TMC conference underscored the importance of integrating technology innovation with ecosystem building and supply chain control as key factors for success in the semiconductor industry [13] - The future of China's power semiconductor industry hinges on leveraging market advantages to enhance technological capabilities and build a robust industrial ecosystem [12][14]