Core Viewpoint - The relationship between SK Hynix and its long-term partner Hanmi Semiconductor is showing signs of strain due to supply issues related to the TC bonding machines essential for high bandwidth memory (HBM) production [1][2]. Group 1: Supply Chain Dynamics - Hanmi Semiconductor is actively expanding its supply scale of TC bonding machines, which have been improved based on SK Hynix's requirements, focusing on automation and user-friendly software [1][3]. - SK Hynix has placed orders for 12 TC bonding machines from Hanmi Semiconductor, totaling approximately 42 billion KRW, as it seeks to diversify its suppliers amid rising demand for HBM [2][4]. - The market demand for HBM has exceeded SK Hynix's current production capacity, necessitating additional orders for TC bonding machines before the completion of its M15X factory [2][4]. Group 2: Competitive Tensions - Hanmi Semiconductor's TC bonding machines are priced higher than those from Hanmi Semiconductor, leading to dissatisfaction from Hanmi Semiconductor, which has retaliated by changing customer service from free to paid and increasing equipment prices by 28% [2][4]. - SK Hynix maintains that the pricing of equipment is determined through negotiations with suppliers and denies any unjustified premium pricing for Hanmi Semiconductor's machines [3][4]. Group 3: Technological Advancements - The TC bonding machines supplied by Hanmi Semiconductor are designed to reduce manual operations and incorporate various digital solutions and automation systems, supporting up to 16-layer stacking [3][4]. - SK Hynix has praised Hanmi Semiconductor for its performance in automation systems and maintenance convenience, which aligns with the needs of its engineers [3].