高熵合金
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我国科研人员实现温和条件下合成亚纳米级高熵合金
Ke Ji Ri Bao· 2025-10-20 09:22
Core Insights - The research team led by Professor Xiong Yujie from Anhui Normal University, in collaboration with the University of Science and Technology of China, has successfully created sub-nanometer high-entropy alloys using laser irradiation, which can incorporate up to ten different metal elements [1][2] - This innovative method overcomes traditional high-temperature synthesis limitations, allowing for the production of high-entropy alloys at milder conditions and achieving smaller particle sizes [1] Group 1: Research Methodology - The team utilized laser irradiation technology to achieve uniform mixing of multiple metals under mild conditions, resulting in the production of sub-nanometer high-entropy alloy particles [1] - The nanosecond pulsed laser rapidly increases the surface temperature of the particles to over 2000 degrees Celsius and then cools them at a rate exceeding one billion degrees per second, enabling precise control over particle size [1] Group 2: Applications and Performance - High-entropy alloys exhibit significant potential in the renewable energy sector, particularly as ideal catalyst materials due to their unique structure and properties [2] - The sub-nanometer high-entropy alloy composed of gold, platinum, ruthenium, rhodium, and iridium demonstrates exceptional catalytic activity and stability in hydrogen production through water electrolysis, outperforming current commercial platinum-carbon and ruthenium dioxide catalysts [2] - The new laser synthesis method greatly expands the material system and applicability of high-entropy alloys, potentially advancing their practical applications in energy and catalysis [2]
亚纳米级!我国团队成功创制这一关键材料
Ke Ji Ri Bao· 2025-10-20 00:40
Core Viewpoint - The research team led by Professor Xiong Yujie from Anhui Normal University, in collaboration with the University of Science and Technology of China, has successfully created sub-nanometer high-entropy alloys using laser irradiation, which has broad applicability and can incorporate up to ten metal elements [1]. Group 1: Research Methodology - The innovative use of laser irradiation technology allows for the uniform mixing of multiple metals under mild conditions, resulting in the production of sub-nanometer high-entropy alloy particles [1]. - The nanosecond pulsed laser rapidly increases the surface temperature of the particles to over 2000 degrees Celsius and then cools them at a rate exceeding one billion degrees per second, overcoming the limitations of traditional synthesis methods [1]. Group 2: Implications and Applications - This new laser synthesis method significantly expands the material system and applicability of high-entropy alloys, potentially advancing their practical applications in energy and catalysis [1]. - The research provides a novel approach for the development of new materials, indicating a promising direction for future research and applications in various fields [1].
中国科研团队合成一种新型合金 助力电解水产氢
Zhong Guo Xin Wen Wang· 2025-10-19 22:38
Core Insights - The research team at Anhui Normal University has successfully created sub-nanometer high-entropy alloys using laser irradiation, which allows for the mixing of up to ten different metal elements [1][2] - This innovative method overcomes traditional synthesis limitations by enabling uniform mixing of metals at mild conditions, resulting in smaller particle sizes [2] Group 1: Research Methodology - The team utilized nanosecond pulsed laser technology to rapidly heat particles to over 2000 degrees Celsius and then cool them at a rate exceeding one billion degrees per second, facilitating the creation of sub-nanometer high-entropy alloy particles [2] - This rapid heating and cooling process allows for the uniform dispersion and alloying of different metal elements, which was previously challenging due to the need for high temperatures and limited element combinations in traditional methods [2] Group 2: Applications and Implications - High-entropy alloys exhibit significant potential in various fields, particularly in renewable energy, serving as promising catalyst materials [2] - The newly developed laser synthesis method broadens the range of materials available for high-entropy alloys, potentially enhancing their application in critical areas [2] - The sub-nanometer high-entropy alloy composed of gold, platinum, ruthenium, rhodium, and iridium has demonstrated excellent hydrogen and oxygen production activity and stability as an electrolytic water catalyst [2]
这种大芯片,大有可为
半导体行业观察· 2025-07-02 01:50
Core Insights - The article discusses the exponential growth of AI models, reaching trillions of parameters, highlighting the limitations of traditional single-chip GPU architectures in scalability, energy efficiency, and computational throughput [1][7][8] - Wafer-scale computing has emerged as a transformative paradigm, integrating multiple small chips onto a single wafer to provide unprecedented performance and efficiency [1][8] - The Cerebras Wafer Scale Engine (WSE-3) and Tesla's Dojo represent significant advancements in wafer-scale AI accelerators, showcasing their potential to meet the demands of large-scale AI workloads [1][9][10] Wafer-Scale AI Accelerators vs. Single-Chip GPUs - A comprehensive comparison of wafer-scale AI accelerators and single-chip GPUs focuses on their relative performance, energy efficiency, and cost-effectiveness in high-performance AI applications [1][2] - The WSE-3 features 4 trillion transistors and 900,000 cores, while Tesla's Dojo chip has 1.25 trillion transistors and 8,850 cores, demonstrating the capabilities of wafer-scale systems [1][9][10] - Emerging technologies like TSMC's CoWoS packaging are expected to enhance computing density by up to 40 times, further advancing wafer-scale computing [1][12] Key Challenges and Emerging Trends - The article discusses critical challenges such as fault tolerance, software optimization, and economic feasibility in the context of wafer-scale computing [2] - Emerging trends include 3D integration, photonic chips, and advanced semiconductor materials, which are expected to shape the future of AI hardware [2] - The future outlook anticipates significant advancements in the next 5 to 10 years that will influence the development of next-generation AI hardware [2] Evolution of AI Hardware Platforms - The article outlines the chronological evolution of major AI hardware platforms, highlighting key releases from leading companies like Cerebras, NVIDIA, Google, and Tesla [3][5] - Notable milestones include the introduction of Cerebras' WSE-1, WSE-2, and WSE-3, as well as NVIDIA's GeForce and H100 GPUs, showcasing the rapid innovation in high-performance AI accelerators [3][5] Performance Metrics and Comparisons - The performance of AI training hardware is evaluated through key metrics such as FLOPS, memory bandwidth, latency, and power efficiency, which are crucial for handling large-scale AI workloads [23][24] - The WSE-3 achieves peak performance of 125 PFLOPS and supports training models with up to 24 trillion parameters, significantly outperforming traditional GPU systems in specific applications [25][29] - NVIDIA's H100 GPU, while powerful, introduces communication overhead due to its distributed architecture, which can slow down training speeds for large models [27][28] Conclusion - The article emphasizes the complementary nature of wafer-scale systems like WSE-3 and traditional GPU clusters, with each offering unique advantages for different AI applications [29][31] - The ongoing advancements in AI hardware are expected to drive further innovation and collaboration in the pursuit of scalable, energy-efficient, and high-performance computing solutions [13]
研判2025!中国高熵合金行业制备工艺、相关政策、市场规模及发展趋势分析:高熵合金加速从实验室迈向产业化[图]
Chan Ye Xin Xi Wang· 2025-05-06 01:20
Core Insights - The concept of high-entropy alloys (HEAs) was proposed in 2004, revealing that alloys formed by mixing multiple elements in near/equal atomic ratios do not create complex intermetallic compounds but rather simple solid solution structures [1][2] - HEAs exhibit four core effects: thermodynamic high-entropy effect, severe lattice distortion effect, kinetic diffusion lag effect, and cocktail effect, leading to superior comprehensive performance [1][2] - The emergence of HEAs breaks traditional alloy design principles, opening up a broad design space for new materials [1][2] Industry Overview - HEAs can be applied in critical fields such as defense, aviation, and aerospace, with China making some progress in HEA research, although most studies remain in the laboratory stage and industrial promotion is slow [1][14] - The market size for China's HEA industry is projected to be approximately 0.83 million yuan in 2024 [14] Composition and Structure - HEAs can be classified based on structural types (FCC, BCC, HCP, amorphous, and intermetallic compounds) and phase types (single-phase, dual-phase, eutectic, and multiphase) [4] - Typical FCC HEA examples include equiatomic FeCoCrNiMn alloys, while BCC HEAs are primarily composed of IV-VI group elements [4] Preparation Techniques - Various methods for preparing HEAs have emerged, including arc melting, mechanical alloying, laser cladding, magnetron sputtering, 3D printing, and vapor deposition, categorized into solid-phase, liquid-phase, and gas-phase forming [6][8] Policy Support - A series of policies have been introduced in China to support the HEA industry, including its inclusion in the "Key Development Directory for Frontier Materials" and encouragement for basic research and original innovation [9][10] - Local governments in Gansu, Chongqing, and Ningxia have also issued policies to promote the development of the HEA industry [9][10] Standards Development - The national standard for HEA powders used in additive manufacturing (GB/T 42787-2023) was released in August 2023 and will be implemented in March 2024, aiming to improve product quality and market application [11][12] Future Trends - Future advancements in HEAs are expected in preparation technologies, leading to large-scale production, and further research into their performance and cost reduction will enable broader applications [16]