Core Viewpoint - The recent adjustment of shareholding ratios by major players in the domestic semiconductor packaging and testing industry, namely Changdian Technology, Tongfu Microelectronics, and Huada Semiconductor, aims to optimize the equity structure of Huajin Semiconductor, enhancing its technological research and development capabilities and driving high-quality industry growth [1][13]. Shareholding Changes - The shareholding ratio of Changdian Technology, Tongfu Microelectronics, and Huada Semiconductor in Huajin Semiconductor has been reduced from approximately 4.325% to 2.747% [1]. - Other notable shareholders include Beijing Zhongke Micro Investment Management Co., Ltd. and Wuxi Guochuang Chip Investment Management Partnership, which also experienced changes in their shareholding percentages [4][14]. Company Background - Huajin Semiconductor was established in 2012 as a collaborative effort among leading packaging and testing companies and research institutions, with a registered capital of 462.4682 million yuan [14]. - The company focuses on advanced packaging technologies such as TSV, 2.5D/3D, and Chiplet, and plays a crucial role in key technology breakthroughs and standard formulation within the industry [14][16]. Technological Capabilities - Huajin Semiconductor has built a leading semiconductor packaging and testing research center in China, with a team of nearly 100 researchers, over half of whom hold doctoral or master's degrees [16]. - The company has applied for over 1,300 patents, ranking among the top globally in the number of patents related to 2.5D/3D packaging and TSV technologies [16].