Company Overview - Tongfu Microelectronics is a provider of integrated circuit packaging and testing services, offering a one-stop service from design simulation to packaging and testing for global clients [2][4] - The company operates nine production bases globally, including locations in Jiangsu, Anhui, and Malaysia, employing over 20,000 staff [3] - Major shareholder is Nantong Huada Microelectronics Group, with stable ownership structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first three quarters of 2025 were CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 20.116 billion respectively [3] - Net profit attributable to shareholders for the same periods were CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.860 billion [3] - Projected net profit for 2025 is estimated between CNY 1.1 billion and CNY 1.35 billion, indicating a year-on-year growth of 62.34% to 99.24% [11] Investment and Growth Strategy - The company plans to invest CNY 1.0995580 billion to enhance packaging capacity in emerging automotive applications, aiming to add 50.4 million units annually [7][8] - Focus on high-value products and market trends, including advanced packaging technologies like Chiplet and 2D+ [4][5] - The investment projects are aligned with the strategic goal of building a resilient domestic semiconductor supply chain [5][6] Key Technology and Market Position - The company emphasizes the importance of wafer-level packaging as a critical technology for high-performance chips, enhancing signal integrity and reducing latency [9][10] - Plans to strengthen capabilities in advanced packaging to support high-end computing and automotive sectors [10] Investor Engagement - The company held an investor relations activity on January 21, 2026, with participation from various financial institutions [2] - The issuance of shares targets up to 35 specific investors, including asset management companies and qualified foreign institutional investors [7]