证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-003 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 中大君悦：陈修能、曲芳；东吴证券：刘玥娇；彤源：麦世学； | | 人员姓名 | 农银汇理基金：张璋；华宝信托：张卿隆；太平养老：张凯；华 | | | 源电子：熊宇翔；弘毅远方：陈祥辉；源乐晟：吴雨哲；博衍基 | | | 金：卢湛 | | 时间 2026 | 年 1 月 29 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 | | 5G | 等网络通讯、信息终端 ...

通富微电子股份有限公司投资者关系活动记录表 编号：2026-002 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 平安证券：陈福栋；弢盛资产：陶星辰；博时基金：赵宪成；工 | | 人员姓名 | 银瑞信：万力实；摩根基金：宋敬祎；国联民生：王晔；南方基 | | | 金：竺绍迪、吴春林；中信证券：王子源；富国基金：罗擎；长 | | | 城基金：余泽璇；长江资管：杨书权；中庚基金：徐润齐；平安 | | | 基金：江正清；长信基金：袁梦镜；银河基金：黄心叶；财通证 | | | 券：唐佳、詹小瑁；泉果基金：赵浩 | | 时间 | 2026 年 1 月 21 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、 ...

公司先后在江苏南通崇川、南通苏通科技产业园、安徽合肥、福建厦门、南通市北高新（600604）区建 厂布局；通过收购AMD苏州及AMD槟城各85%股权，在江苏苏州、马来西亚槟城拥有生产基地。2024 年，公司与相关方签订《股权买卖协议》，以自有资金收购京隆科技26%股权，京隆科技运营模式和财 务状况良好，其在高端集成电路专业测试领域具备差异化竞争优势。公司已于2025年2月13日完成交割 并支付了相关股权购买价款，公司收购京隆科技部分股权可提高公司投资收益，为公司带来稳定的财务 回报，为全体股东创造更多价值。 1月20日，通富微电（002156）公告，预计2025年度归母净利润为11亿元至13.5亿元，比上年同期增长 62.34%至99.24%。扣除非经常性损益后的净利润预计为7.7亿元至9.7亿元，增长幅度为23.98%至 56.18%。基本每股收益预计为0.72元至0.89元，较上年同期的0.45元有所提升。 公告称，业绩增长的主要原因是全球半导体行业的结构性增长，公司积极提高产能利用率，营业收入明 显上升，尤其是中高端产品的销售额显著增加。此外，公司通过加强经营管理和成本控制，整体效益得 到了显著提升，并 ...

Core Viewpoint - The company, Tongfu Microelectronics (002156), is a provider of integrated circuit packaging and testing services, offering a one-stop service from design simulation to packaging testing for global clients [1] Group 1: Company Overview - The company covers a wide range of products, technologies, and services across various fields including artificial intelligence, high-performance computing, big data storage, display drivers, 5G communications, information terminals, consumer terminals, the Internet of Things, automotive electronics, and industrial control, meeting diverse customer needs [1] Group 2: Market Strategy - The company is seizing market development opportunities by focusing on high value-added products and trending market directions, with a long-term vision [1] - The company is actively developing advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging while expanding its production capacity [1] - Additionally, the company is strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+, creating a differentiated competitive advantage [1]

证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-001 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 鹏扬基金：章宏帆；泰康资产：余思雨；申万菱信：徐巡；拾贝 | | 人员姓名 | 投资：王祥宇；鑫元基金：施欣彤；南方基金：葛树名、金岚枫； | | | 兴银基金：阮姝漫；道仁资产：李晓光；汇丰晋信：刘昱辰；汇 | | | 添富：钱晨润；长江证券：钟智铧；丹羿投资：朱亮 | | 时间 | 2026 年 1 月 16 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 ...

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services from design simulation to packaging testing for global clients [2][3] - The company covers various fields including AI, high-performance computing, big data storage, 5G, IoT, automotive electronics, and industrial control [2][3] - Major shareholder is Nantong Huada Microelectronics Group, with stable equity structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first half of 2025: CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 13.038 billion respectively [3] - Net profit for the same periods: CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.412 billion [3] - 2024 revenue growth of 7.24% and net profit growth of 299.90% [6] - 2025 H1 revenue growth of 17.67% and net profit growth of 27.72% [6] Industry Situation - Global semiconductor market reached USD 346 billion in H1 2025, a year-on-year growth of 18.9% [4] - Forecast for 2025 global semiconductor market size is USD 728 billion, up 15.4% from 2024 [4] - Expected market size for 2026 is USD 800 billion, with a further growth of 9.9% [4] Key Trends in Semiconductor Market - AI-driven growth continues; Asia-Pacific IC design market expected to grow by 15% in 2025 [5] - TSMC maintains dominance in wafer foundry; strong demand for advanced processes [5] - 2025 is a critical year for 2nm wafer manufacturing technology [5] Business Performance in Specific Fields - In H1 2025, the company increased market share in mobile, home appliance, and automotive sectors [9] - Focus on AI and high-performance products, with successful integration of Suzhou and Penang factories [9] Technology Development - Significant progress in large-size FCBGA development, with mass production initiated [11] - Breakthroughs in optical-electrical hybrid packaging technology [11] - Over 1,700 patent applications, with nearly 70% being invention patents [8] Future Outlook - Continued growth expected in AI and new energy vehicle sectors in H2 2025 [10] - Chinese IC packaging and testing industry is anticipated to transition from "catching up" to "keeping pace" and potentially "leading" [10]

Financial Performance - Company reported a total revenue of 13.038 billion yuan for the first half of 2025, an increase of 17.67% year-on-year [1] - Net profit attributable to shareholders reached 412 million yuan, up 27.72% year-on-year [1] - In Q2 2025, total revenue was 6.946 billion yuan, reflecting a 19.8% increase year-on-year, while net profit was 311 million yuan, up 38.6% year-on-year [1] - Gross margin improved to 14.75%, a year-on-year increase of 4.21%, and net margin rose to 3.72%, up 12.85% year-on-year [1] Operational Metrics - Total operating expenses (sales, management, and financial expenses) amounted to 561 million yuan, accounting for 4.3% of revenue, a decrease of 1.9% year-on-year [1] - Earnings per share (EPS) increased to 0.27 yuan, a rise of 27.46% year-on-year [1] - Operating cash flow per share was 1.63 yuan, reflecting a significant increase of 34.47% year-on-year [1] Business Model and Market Position - Company operates as an integrated circuit packaging and testing service provider, focusing on high-value products in sectors such as AI, high-performance computing, and automotive electronics [5][6] - The company has established strong partnerships with leading research institutions and universities, enhancing its R&D capabilities [5] - In 2024, the company achieved significant growth in various sectors, including a 46% increase in mobile SOC and over 200% growth in automotive products [6][7] Strategic Initiatives - Company plans to invest a total of 6 billion yuan in capital expenditures for 2025, focusing on facility construction, production equipment, and technology R&D [9] - Major investments include 2.5 billion yuan for new factory construction and 3.5 billion yuan for upgrading existing products to meet market demands [9] Shareholder Insights - The largest fund holding in the company is from Chuangjin Hexin New Energy Vehicle Stock A, which has reduced its holdings [4] - Other funds have shown varied movements, with some increasing their positions in the company [4]

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services for design simulation and packaging testing across various fields including AI, high-performance computing, and 5G [2]. - The company has established production bases in multiple locations, including Nantong, Suzhou, Penang, Hefei, and Xiamen, enhancing its capacity to serve clients locally [2][3]. - In 2024, the company acquired a 26% stake in Jinglong Technology, which is expected to improve investment returns and create more value for shareholders [2]. Financial Performance - Revenue figures for the years 2021 to 2024 are as follows: - 2021: ¥158.12 billion - 2022: ¥214.29 billion - 2023: ¥222.69 billion - 2024: ¥238.82 billion [3]. - Net profit for the same years: - 2021: ¥9.57 billion - 2022: ¥5.02 billion - 2023: ¥1.69 billion - 2024: ¥6.78 billion [3]. - In Q1 2025, the company achieved revenue of ¥60.92 billion, a year-on-year increase of 15.34%, and a net profit of ¥1.01 billion, up 2.94% [4]. Industry Trends - The semiconductor industry is entering an upward cycle, with global sales expected to reach $627.6 billion in 2024, a 19.1% increase from $526.8 billion in 2023 [3]. - The global integrated circuit packaging and testing market is projected to grow to $82 billion in 2024, reflecting a 7.8% year-on-year increase [3]. - Key trends for 2025 include continued AI-driven growth, a 15% increase in the Asia-Pacific IC design market, and a focus on advanced packaging technologies [3]. Business Growth Areas - In 2024, the company saw significant growth in various sectors: - 46% increase in mid-to-high-end mobile SOCs - 20% growth in mobile terminal SOC partnerships - 70% increase in RF sector collaborations - Over 200% growth in automotive products [5][8]. - The company is expanding its capabilities in advanced packaging technologies, including Chiplet and 2D+ packaging [5][6]. Future Investments - The company plans to invest ¥6 billion in 2025 for facility construction, production equipment, IT, and R&D [8]. - Specific investments include: - ¥2.5 billion for new factory construction and product development in various sectors - ¥3.5 billion for upgrading existing products to meet the demand for large multi-chip servers and AI applications [8].

Core Insights - The article discusses the exponential growth of global data and the limitations of current silicon-based storage media, highlighting the need for new data storage technologies [1] - DNA is presented as a promising solution for data storage due to its high density, longevity, and low energy consumption, making it an ideal candidate for addressing the challenges of big data storage [1] - The introduction of "DNA movable type storage" inspired by ancient printing techniques offers a more efficient and cost-effective method for data storage compared to traditional DNA storage methods [2] Group 1 - Current silicon-based storage media face issues such as short lifespan, high energy consumption, and large space requirements, which cannot meet the growing data storage demands [1] - DNA storage technology has a density 107 times higher than existing storage media, can be preserved for millions of years at low temperatures, and has low energy requirements [1] - Traditional DNA storage methods are costly and time-consuming, as they rely on a one-time use of DNA for data encoding and storage [1] Group 2 - The "DNA movable type" concept allows for the reuse and flexible combination of pre-fabricated DNA segments, significantly improving storage efficiency [2] - The "Bisheng No. 1" printer automates the process of creating DNA storage files by selecting and assembling the necessary DNA segments based on computer instructions [2] - Each "DNA movable type" can be printed up to 10,000 times, leading to a substantial reduction in storage costs and providing a new solution for the massive storage needs of the big data era [2]

Investment Rating - The report maintains a "Buy" rating for several companies in the semiconductor sector, including 圣邦股份 (Sengbang), 纳芯微 (Naxinwei), and others [8][16]. Core Insights - The newly released semiconductor origin recognition rules indicate that the location of wafer fabrication will be considered the origin, potentially increasing costs for chips fabricated in the U.S. due to tariffs [4][14]. - The CITE 2025 exhibition showcased over 1,000 exhibitors and highlighted advancements in smart terminals, AI, and other cutting-edge technologies [5][15]. - The electronic industry experienced a decline of 3.31% from April 7 to April 11, ranking 14th among all sectors, with a current P/E ratio of 52.63 [21][24]. Summary by Sections Market Performance - The electronic sector's performance was down by 3.31% during the week of April 7-11, with semiconductor equipment and analog chip design showing slight increases [21][25]. - The report notes that the semiconductor materials and discrete devices sectors ranked fourth and fifth in terms of valuation [25]. Key Companies and Earnings Forecast - The report highlights several companies with their respective earnings per share (EPS) and price-to-earnings (P/E) ratios, recommending a "Buy" for companies like 圣邦股份 (Sengbang) and 纳芯微 (Naxinwei) [8][16]. - The earnings forecasts for 2023, 2024E, and 2025E are provided for each company, indicating growth potential [16][33]. Industry Dynamics - The report discusses the impact of U.S. tariffs on semiconductor products, particularly affecting analog chips fabricated in the U.S. [4][14]. - The CITE 2025 event emphasized the importance of innovation in the electronics sector, showcasing new products and technologies [5][15]. Overseas Leaders Overview - The report notes that overseas semiconductor leaders showed varied performance, with 博通 (Broadcom) leading with a 17.78% increase [17][18]. - The Philadelphia Semiconductor Index reflects a mixed trend, indicating fluctuations in the semiconductor market [19][20].