Core Viewpoint - The article presents a comprehensive analysis of the advantages of glass interposers over silicon interposers in 3D stacking configurations, highlighting significant improvements in area optimization, signal integrity, power integrity, and overall performance metrics [1][4][56]. Group 1: Advantages of Glass Interposers - Glass interposers enable 3D stacking of chiplets embedded within the substrate, a capability not achievable with silicon interposers [1][4]. - Experimental results show that glass interposers can achieve 2.6 times area optimization, 21 times reduction in wire length, a 17.72% decrease in total chip power consumption, a 64.7% improvement in signal integrity, and a 10 times enhancement in power integrity, although temperature increases by 15% [1][4][56]. Group 2: Design and Integration - The study explores the potential of glass interposers in a "5.5D" stacking architecture, which allows for both vertical and horizontal connections between chiplets [6][8]. - The integration of chiplets and interposers is designed to optimize performance, power, and area (PPA), with detailed analysis conducted on signal integrity (SI), power integrity (PI), and thermal integrity (TI) [8][14][56]. Group 3: Manufacturing and Cost Analysis - The manufacturing capabilities of glass interposers allow for large-size panel processing, which is advantageous for high-density wiring similar to silicon interposers [7][8]. - Cost quantification analysis indicates that the glass interposer design can lead to lower manufacturing costs due to its efficient layout and reduced material requirements [8][56]. Group 4: Performance Metrics - The performance comparison of chiplets using different interposer materials shows that glass interposers yield the smallest chip sizes and comparable power consumption across various configurations [24][27]. - Glass interposers demonstrate superior signal and power integrity, with the widest eye diagram and lowest PDN impedance, indicating better performance under operational conditions [46][48][56]. Group 5: Thermal Analysis - Thermal analysis reveals that glass interposers maintain reasonable operating temperatures, with memory chip temperatures slightly higher than other interposer types, but still within acceptable limits [52][56].

Core Viewpoint - The article discusses the advantages of glass interposers over silicon interposers in 3D stacking of chiplets, highlighting significant improvements in area optimization, signal integrity, and power consumption while noting a slight increase in temperature [1][4][49]. Group 1: Glass Interposer Advantages - Glass interposers enable 3D stacking of chiplets embedded within the substrate, which silicon interposers cannot achieve [1][4]. - Experimental results show that glass interposers can achieve 2.6 times area optimization, 21 times reduction in line length, 17.72% decrease in total chip power consumption, 64.7% improvement in signal integrity, and 10 times better power integrity, although temperature increases by 15% [1][4]. Group 2: Chiplet Integration Methods - The integration of chiplets can be categorized into 2.5D interposer integration and 3D stacking integration, with 2.5D integration allowing for heterogeneous integration of multiple chiplets [2][4]. - Glass interposers provide a low-cost solution for embedding chiplets directly into the substrate, facilitating 3D stacking configurations [4][5]. Group 3: Manufacturing and Design Process - The article outlines a collaborative design process for chiplets and interposers, focusing on performance, power, area (PPA), signal integrity (SI), power integrity (PI), and thermal integrity (TI) analysis [7][12]. - The design process includes hierarchical partitioning of chiplets and the use of specific process design kits (PDK) for layout generation [12][15]. Group 4: Performance and Power Analysis - The performance and power consumption of chiplets designed with glass interposers were analyzed, showing that most chiplets operate normally at 700MHz with minimal power differences across various interposer types [21][22]. - Glass interposers exhibited the smallest chiplet sizes due to their minimal bump pitch of 35 micrometers, leading to higher unit utilization compared to silicon and organic interposers [20][22]. Group 5: Signal and Power Integrity - Signal integrity analysis revealed that glass interposers have the widest eye diagram due to shorter wiring, while silicon interposers showed narrower eye diagrams due to longer wiring paths [42][44]. - Power distribution network (PDN) impedance analysis indicated that glass interposers have the lowest impedance, resulting in faster stabilization times and lower voltage drops [44][46]. Group 6: Thermal Reliability - Thermal analysis showed that glass interposers have slightly higher temperatures for memory chiplets compared to other interposers, but overall, they maintain reasonable operating temperatures [46][49]. - The article emphasizes the importance of proper chiplet partitioning design to ensure embedded chiplets operate within acceptable temperature ranges [49].