Core Viewpoint - The interposer has transitioned from a supporting role to a focal point in the semiconductor industry, with major companies like Resonac and NVIDIA leading initiatives to develop advanced interposer technologies [1][28]. Group 1: Definition and Importance of Interposer - Interposer serves as a critical layer between chips and packaging substrates, enabling high-density interconnections and efficient integration of various chiplets into a system-in-package (SiP) [3][5]. - The interposer is essential for achieving higher bandwidth, lower latency, and increased computational density in advanced packaging [3][5]. Group 2: Types of Interposers - Two main types of interposers are currently in production: Silicon Interposer (inorganic) and Organic Interposer (Redistribution Layer) [5][6]. - Silicon Interposer has been established since the late 2000s, with TSMC pioneering its use in high-performance computing [6]. - Organic Interposer is gaining traction due to its lower production costs and flexibility, despite challenges in wiring precision and reliability [6][23]. Group 3: JOINT3 Alliance - The JOINT3 alliance, led by Resonac, consists of 27 global companies aiming to develop next-generation semiconductor packaging, focusing on panel-level organic interposers [8][11]. - The alliance plans to establish a dedicated center in Japan for advanced organic interposer development, targeting a significant increase in production efficiency and cost reduction [11][12]. - The shift to organic interposers is driven by the limitations of silicon interposers, particularly in terms of geometric losses and production costs [11][12]. Group 4: SiC Interposer as a New Direction - NVIDIA is exploring the use of Silicon Carbide (SiC) interposers for its next-generation GPUs, indicating a potential shift in materials used for interposers [17][19]. - SiC offers superior thermal conductivity and electrical insulation, making it suitable for high-performance AI and HPC applications, although manufacturing challenges remain [19][25]. Group 5: Competitive Landscape of Interposer Materials - The competition among silicon, organic, and SiC interposers is characterized by their respective advantages and disadvantages, influencing performance, cost, and scalability [20][22][23]. - Silicon interposers are currently dominant but face challenges as chip sizes increase, while organic interposers are expected to gain market share due to cost advantages [22][26]. - SiC interposers, if successfully developed, could become the standard for cutting-edge AI and HPC packaging in the long term [26]. Group 6: Future Trends - In the short term, silicon interposers will remain the market leader, while organic interposers are anticipated to see widespread adoption in the mid-term due to their cost and scalability benefits [26]. - Long-term projections suggest that SiC interposers may emerge as the preferred choice for advanced packaging once manufacturing hurdles are overcome [26].

Core Viewpoint - The article discusses the limitations and challenges of interposer line lengths in advanced packaging, highlighting the differences between electrical and optical interposers and the implications for signal integrity and transmission efficiency [1][11]. Group 1: Interposer Types and Challenges - There are two main types of interposers in production: organic interposers (RDL) and silicon interposers, with organic interposers being significantly cheaper to produce but having larger feature sizes [2]. - The use of silicon does not necessitate narrow lines, as wider signal lines require more signal layers, which is undesirable for manufacturers [2][3]. - The resistance of narrow lines in organic interposers leads to significant insertion loss, which is a major concern for clients [3][5]. Group 2: Signal Integrity and Grounding - Signal integrity is heavily reliant on good grounding, typically provided by ground layers, which can serve multiple functions including power delivery and impedance control [7]. - Controlled impedance is crucial for maintaining signal quality, and even short lines can suffer from interference or crosstalk [7][8]. - Designers strive to minimize loss and maintain grounding around high-speed lines, which can be challenging due to manufacturing constraints [8][10]. Group 3: Optical Interposers and Future Directions - Optical interposers face fewer limitations compared to electrical ones, as optical signals can transmit over longer distances [1][11]. - The integration of optical devices into packaging is a growing trend, with technologies like Lightmatter's Passage aiming to combine CMOS and silicon photonics within an interposer [11][12]. - While photonics offers a potential long-term solution to line length limitations, it is not yet ready for mass production [14].

Core Viewpoint - The article presents a comprehensive analysis of the advantages of glass interposers over silicon interposers in 3D stacking configurations, highlighting significant improvements in area optimization, signal integrity, power integrity, and overall performance metrics [1][4][56]. Group 1: Advantages of Glass Interposers - Glass interposers enable 3D stacking of chiplets embedded within the substrate, a capability not achievable with silicon interposers [1][4]. - Experimental results show that glass interposers can achieve 2.6 times area optimization, 21 times reduction in wire length, a 17.72% decrease in total chip power consumption, a 64.7% improvement in signal integrity, and a 10 times enhancement in power integrity, although temperature increases by 15% [1][4][56]. Group 2: Design and Integration - The study explores the potential of glass interposers in a "5.5D" stacking architecture, which allows for both vertical and horizontal connections between chiplets [6][8]. - The integration of chiplets and interposers is designed to optimize performance, power, and area (PPA), with detailed analysis conducted on signal integrity (SI), power integrity (PI), and thermal integrity (TI) [8][14][56]. Group 3: Manufacturing and Cost Analysis - The manufacturing capabilities of glass interposers allow for large-size panel processing, which is advantageous for high-density wiring similar to silicon interposers [7][8]. - Cost quantification analysis indicates that the glass interposer design can lead to lower manufacturing costs due to its efficient layout and reduced material requirements [8][56]. Group 4: Performance Metrics - The performance comparison of chiplets using different interposer materials shows that glass interposers yield the smallest chip sizes and comparable power consumption across various configurations [24][27]. - Glass interposers demonstrate superior signal and power integrity, with the widest eye diagram and lowest PDN impedance, indicating better performance under operational conditions [46][48][56]. Group 5: Thermal Analysis - Thermal analysis reveals that glass interposers maintain reasonable operating temperatures, with memory chip temperatures slightly higher than other interposer types, but still within acceptable limits [52][56].

Core Viewpoint - The article discusses the advantages of glass interposers over silicon interposers in 3D stacking of chiplets, highlighting significant improvements in area optimization, signal integrity, and power consumption while noting a slight increase in temperature [1][4][49]. Group 1: Glass Interposer Advantages - Glass interposers enable 3D stacking of chiplets embedded within the substrate, which silicon interposers cannot achieve [1][4]. - Experimental results show that glass interposers can achieve 2.6 times area optimization, 21 times reduction in line length, 17.72% decrease in total chip power consumption, 64.7% improvement in signal integrity, and 10 times better power integrity, although temperature increases by 15% [1][4]. Group 2: Chiplet Integration Methods - The integration of chiplets can be categorized into 2.5D interposer integration and 3D stacking integration, with 2.5D integration allowing for heterogeneous integration of multiple chiplets [2][4]. - Glass interposers provide a low-cost solution for embedding chiplets directly into the substrate, facilitating 3D stacking configurations [4][5]. Group 3: Manufacturing and Design Process - The article outlines a collaborative design process for chiplets and interposers, focusing on performance, power, area (PPA), signal integrity (SI), power integrity (PI), and thermal integrity (TI) analysis [7][12]. - The design process includes hierarchical partitioning of chiplets and the use of specific process design kits (PDK) for layout generation [12][15]. Group 4: Performance and Power Analysis - The performance and power consumption of chiplets designed with glass interposers were analyzed, showing that most chiplets operate normally at 700MHz with minimal power differences across various interposer types [21][22]. - Glass interposers exhibited the smallest chiplet sizes due to their minimal bump pitch of 35 micrometers, leading to higher unit utilization compared to silicon and organic interposers [20][22]. Group 5: Signal and Power Integrity - Signal integrity analysis revealed that glass interposers have the widest eye diagram due to shorter wiring, while silicon interposers showed narrower eye diagrams due to longer wiring paths [42][44]. - Power distribution network (PDN) impedance analysis indicated that glass interposers have the lowest impedance, resulting in faster stabilization times and lower voltage drops [44][46]. Group 6: Thermal Reliability - Thermal analysis showed that glass interposers have slightly higher temperatures for memory chiplets compared to other interposers, but overall, they maintain reasonable operating temperatures [46][49]. - The article emphasizes the importance of proper chiplet partitioning design to ensure embedded chiplets operate within acceptable temperature ranges [49].

如果您希望可以时常见面，欢迎标星收藏哦~ 自半导体工业诞生以来，集成电路就一直被封装在封装件中。最初的想法主要是保护内部脆 弱的硅片不受外部环境的影响，但在过去的十年中，封装的性质和作用发生了巨大的变化。 虽然芯片保护仍然重要，但它已成为封装中最不引人关注的作用。 本文探讨了封装领域最大的变化，即通常所说的先进封装。先进的含义并没有明确的定义。相反， 该术语广泛涵盖了多种可能的封装方案，所有这些方案都比传统的单芯片封装复杂得多。先进封装 通常封装了多个元件，但组装方式却千差万别。 在这种讨论中，经常会提到 2.5D 或 3D 封装，这些描述指的是内部元件的排列方式。 本文首先讨论了从外部观察到的封装类型，然后向内讨论了高级封装所集成的基本组件。之后，将 更详细地探讨每个组件。大部分讨论将涉及高级软件包的各种组装过程。文章最后探讨了任何技术 讨论都必须涉及的四个主题--工程师如何设计先进封装、如何对其进行测试、先进封装的总体可靠 性影响以及任何安全影响。 文章还简要讨论了两个相关的广泛话题。首先是键合。虽然这是封装的一个必要组成部分，但它本 身也是一个很大的话题，在此不作详细讨论。其次是不属于集成电路但可能包含 ...