Core Viewpoint - Glass is transitioning from a background consumable to a core component in semiconductor packaging, providing essential substrates and dielectric layers for advanced applications [2][5]. Group 1: Glass in Semiconductor Manufacturing - Glass has been utilized in modern wafer fabs, supporting silicon wafers during thinning processes and forming sealed MEMS caps [2]. - The low thermal expansion coefficient (CTE) glass is becoming integral in wafer-level fan-out processes [2]. - The demand for higher bandwidth and power density in AI and high-performance computing (HPC) is driving the need for advanced packaging solutions, where glass serves as a viable alternative to organic laminates and silicon interposers [4][5]. Group 2: Technological Advancements and Market Trends - Leading manufacturers like Intel and Samsung are exploring glass-based platforms for packaging, indicating a shift towards commercial viability for glass substrates [5]. - The introduction of glass core substrates and intermediary layers reflects a broader trend in the semiconductor industry, particularly in advanced packaging and integrated circuit (IC) substrates [5]. - Glass's low dielectric loss and optical transparency are emerging as significant growth drivers beyond computing packaging, particularly in photonic technologies [6]. Group 3: Supply Chain and Competitive Landscape - The transition from pilot lines to mass production for glass substrates hinges on advancements in laser drilling, copper filling, and panel processing technologies [8]. - Understanding the competitive dynamics with silicon and improved organic materials is crucial, as foundries are pushing for mixed wafer-level redistribution, which may diminish glass's advantages [8].

公众号记得加星标⭐️，第一时间看推送不会错过。 玻璃中介层支持嵌入基板的芯粒与直接堆叠于顶部的芯粒（chiplets）之间的3D堆叠，这是硅中 介层无法实现的。在本研究中，我们通过关键系统级指标（包括面积、线长、信号完整性、电源 完整性和热完整性）论证了玻璃中介层相较于硅中介层在这种堆叠方式下的优势。我们利用芯粒 和中介层的GDS版图设计以及签核仿真实现了这一目标。 实验表明，玻璃中介层相比硅中介层可实现2.6倍的面积优化、21倍的线长缩短、全芯片功耗降 低17.72%、信号完整性提升64.7%、电源完整性改善10倍，但温度会升高15%。 引言 如今及未来，提升高复杂度系统良率的一个可行方法是将系统划分为"芯粒"。这些芯粒需集成以构成 完整系统。根据物理结构，芯粒集成有两种类型：2.5D中介层集成和3D堆叠集成。2.5D集成因允许 在中介层上集成多个现成芯粒或复用不同技术节点的知识产权 (IP)（异构集成），成为颇具吸引力的 选择。在2.5D集成中，芯粒以倒装芯片方式并排置于中介层封装顶部，如图1 (a) 所示。此外，它们 通过再分布层 (RDL) 连接，RDL是无源中介层基板上的金属层，用于提供芯粒间的横向 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 玻璃中介层支持嵌入基板的芯粒与直接堆叠于顶部的芯粒（chiplets）之间的3D堆叠，这是硅中 介层无法实现的。在本研究中，我们通过关键系统级指标（包括面积、线长、信号完整性、电源 完整性和热完整性）论证了玻璃中介层相较于硅中介层在这种堆叠方式下的优势。我们利用芯粒 和中介层的GDS版图设计以及签核仿真实现了这一目标。 实验表明，玻璃中介层相比硅中介层可实现2.6倍的面积优化、21倍的线长缩短、全芯片功耗降 低17.72%、信号完整性提升64.7%、电源完整性改善10倍，但温度会升高15%。 引言 如今及未来，提升高复杂度系统良率的一个可行方法是将系统划分为"芯粒"。这些芯粒需集成以构成 完整系统。根据物理结构，芯粒集成有两种类型：2.5D中介层集成和3D堆叠集成。2.5D集成因允许 在中介层上集成多个现成芯粒或复用不同技术节点的知识产权 (IP)（异构集成），成为颇具吸引力的 选择。在2.5D集成中，芯粒以倒装芯片方式并排置于中介层封装顶部，如图1 (a) 所示。此外，它们 通过再分布层 (RDL) 连接，RDL是无源中介层基板上的金属层，用于提供芯粒间的横向 ...

New Energy Vehicles - BYD's blade battery has passed the new national standard ahead of schedule [2] - As of May 26, Xiaomi's SU7 Ultra has achieved a lock order volume of 23,000 units [2] - Changan Automobile's chairman predicts that within two years, industry competition will return to a healthier environment [2] Integrated Circuits (Chips) - Samsung plans to launch a glass intermediary layer by 2028 [2] - Samsung is restructuring its HBM team to focus on customized HBM [2] - Samsung will stop accepting multi-layer NAND orders after June [2] - TSMC will produce MicroLED-based optical communication interconnect products [2] - TSMC is establishing a European chip design center in Munich, Germany [2] Artificial Intelligence - Shanghai has launched its first multimodal large model in the transportation sector, which is expected to improve intersection traffic efficiency by 15% [2] - Nvidia's supplier has resolved rack overheating issues and has begun shipping Blackwell chips [2] - Tencent Cloud has launched the data accelerator GooseFS 2.0, providing comprehensive support for all AI business scenarios [2] Other - Meituan clarifies that "at all costs" refers to combating internal competition [2] - Salesforce plans to acquire Informatica for $8 billion [2] - Canalys forecasts a moderate 3% growth in the African smartphone market by 2025 [2] - Douyin is trialing new regulations that may classify "unboxing" events as controversial [2] - Texas Governor signs a law requiring age verification for Apple and Google app stores [2] - Elon Musk's Neuralink has raised $600 million in a deal, valuing the brain-computer interface company at $9 billion [2] - Apple plans to release dedicated video game applications for its devices to enhance its influence in the gaming industry [2]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自etnews 。 三星电子将于2028年将玻璃基板引入半导体制造。玻璃基板是下一代组件，可实现人工智能（AI）芯片等高性能半导体。 基于此，三星电子开始为未来的半导体市场做准备。 据业内人士25日透露，三星电子已确定计划在2028年将玻璃基板引入先进半导体封装领域，其要点是用"玻璃中介层"取 代"硅中介层"，这也是三星电子玻璃基板路线图首次被确认。 一位知情人士表示："三星电子已经制定了一项计划，将在 2028 年将硅中介层转换为玻璃中介层，以满足客户需求。" 中 介 层 （ Interposer ） ， 又 称 中 间 基 板 ， 是 AI 芯 片 的 重 要 组 成 部 分 。 AI 半 导 体 采 用 2.5D 封 装 结 构 ， 将 图 形 处 理 单 元 （GPU）置于中心，高带宽内存（HBM）置于其周围，中介层作为连接GPU和HBM的通道。 目前，中介层由硅制成。其优点包括高速数据传输和高热导率。但由于材料昂贵、工艺成本高，导致制造成本较高。出现 的替代方案是玻璃中介层。易于实现超精细电路，可进一步提高半导体性能并降低生产成本。 今天是《半 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 自半导体工业诞生以来，集成电路就一直被封装在封装件中。最初的想法主要是保护内部脆 弱的硅片不受外部环境的影响，但在过去的十年中，封装的性质和作用发生了巨大的变化。 虽然芯片保护仍然重要，但它已成为封装中最不引人关注的作用。 本文探讨了封装领域最大的变化，即通常所说的先进封装。先进的含义并没有明确的定义。相反， 该术语广泛涵盖了多种可能的封装方案，所有这些方案都比传统的单芯片封装复杂得多。先进封装 通常封装了多个元件，但组装方式却千差万别。 在这种讨论中，经常会提到 2.5D 或 3D 封装，这些描述指的是内部元件的排列方式。 本文首先讨论了从外部观察到的封装类型，然后向内讨论了高级封装所集成的基本组件。之后，将 更详细地探讨每个组件。大部分讨论将涉及高级软件包的各种组装过程。文章最后探讨了任何技术 讨论都必须涉及的四个主题--工程师如何设计先进封装、如何对其进行测试、先进封装的总体可靠 性影响以及任何安全影响。 文章还简要讨论了两个相关的广泛话题。首先是键合。虽然这是封装的一个必要组成部分，但它本 身也是一个很大的话题，在此不作详细讨论。其次是不属于集成电路但可能包含 ...

Investment Rating - The report indicates a medium risk level for the investment product, suitable for conservative investors [1][12][18] Core Insights - The market showed a low open but high recovery, with major indices closing positively. The Shanghai Composite Index rose by 0.41%, the Shenzhen Component by 0.33%, and the ChiNext Index by 0.19% [7][10] - The total trading volume in the Shanghai and Shenzhen markets was 1.48 trillion yuan, a decrease of 238 billion yuan from the previous trading day [4][10] - Key sectors that performed well included military, small metals, pork, and state-owned cloud concepts, while sectors like photolithography machines, AI healthcare, software development, and CRO saw declines [6][10] Market Overview - The market experienced a mixed performance with over 2800 stocks rising, indicating a broad-based recovery despite the initial downturn influenced by overseas markets [4][10] - The financing balance on the Shanghai Stock Exchange reached 965.98 billion yuan, an increase of 4.296 billion yuan from the previous trading day, while the Shenzhen Stock Exchange's financing balance was 937.655 billion yuan, up by 5.208 billion yuan [9] Concept Highlights - Samsung Electronics is accelerating the development of next-generation packaging materials, specifically glass interlayers, to replace expensive silicon interlayers, which is expected to enhance chip performance [11] - The glass substrate industry is anticipated to grow rapidly due to advancements in AI computing chip technology, with TGV glass perforation and metal filling being key processes for production [11] Key News - ByteDance's model team announced an open-source optimization technology for MoE architecture, improving training efficiency by 1.7 times and reducing costs by 40%, which could significantly impact AI model training and deployment [13] - Delta Electronics unveiled a new 19-inch 72kW 800V HVDC power rack at the NVIDIA GPU Technology Conference, which is expected to accelerate the adoption of HVDC technology in data centers [13] Future Events Reminder - Upcoming events include an AI glasses industry seminar on March 12, NVIDIA's GTC AI conference on March 17, and the 2025 China Household Appliances and Consumer Electronics Expo on March 20 [16]