Core Viewpoint - The article discusses the urgent need for innovative cooling technologies in the face of increasing power demands from AI and HPC chips, highlighting a paradigm shift from external cooling methods to intrinsic solutions that integrate with chip materials and structures [1][11]. Group 1: Breakthroughs in Cooling Technologies - The article identifies three disruptive breakthroughs in cooling technologies: material-level innovations, packaging architecture competition, and structural integration [2]. - The first breakthrough involves the use of diamond and SiC materials to overcome the thermal resistance limitations of silicon, with diamond being a key material due to its superior thermal conductivity [3][4]. - The second breakthrough focuses on the competition between SiC interposers and glass substrates for packaging architecture, with SiC offering significantly better thermal efficiency [8][9]. - The third breakthrough is the concept of embedded microfluidics, where cooling fluids are integrated within the chip structure to manage extreme heat loads effectively [10]. Group 2: Future of Packaging Materials - For large-scale production of structural substrates by 2028, glass substrates are expected to dominate, while diamond will play a crucial role in addressing AI computing bottlenecks [12][16]. - Glass substrates are favored for their high interconnect density capabilities, which are essential as AI chips evolve [14][15]. - Diamond is positioned as a critical component for thermal management in high-performance AI chips, expected to be integrated into packaging solutions alongside glass substrates [16][17]. Group 3: Addressing Thermal Management Challenges - The article outlines three key strategies for improving thermal management in glass substrates: vertical thermal vias, lateral heat diffusion enhancements, and integrated microfluidic cooling systems [19][20][21]. - Vertical thermal vias involve creating high-density copper pillar arrays to facilitate heat dissipation [19]. - Lateral heat diffusion can be enhanced by thickening metal layers on the substrate to improve thermal conductivity [20]. - Integrated microfluidics leverage the chemical properties of glass to create internal cooling channels, significantly improving heat management [21]. Group 4: Multi-Physics Co-Design in Chip Manufacturing - The article emphasizes the importance of multi-physics co-design in semiconductor manufacturing, integrating electrical, thermal, mechanical, and magnetic fields to optimize performance and reliability [22][29]. - The approach advocates for eliminating interface issues through hybrid bonding techniques, which enhance electrical, thermal, and mechanical properties [23][26]. - Material selection is evolving from traditional methods to computational approaches that balance multiple physical fields, ensuring optimal performance under high thermal loads [28][29].