Core Viewpoint - The article discusses the urgent need for innovative cooling technologies in the face of increasing power demands from AI and HPC chips, highlighting a paradigm shift from external cooling methods to intrinsic solutions that integrate with chip materials and structures [1][11]. Group 1: Breakthroughs in Cooling Technologies - The article identifies three disruptive breakthroughs in cooling technologies: material-level innovations, packaging architecture competition, and structural integration [2]. - The first breakthrough involves the use of diamond and SiC materials to overcome the thermal resistance limitations of silicon, with diamond being a key material due to its superior thermal conductivity [3][4]. - The second breakthrough focuses on the competition between SiC interposers and glass substrates for packaging architecture, with SiC offering significantly better thermal efficiency [8][9]. - The third breakthrough is the concept of embedded microfluidics, where cooling fluids are integrated within the chip structure to manage extreme heat loads effectively [10]. Group 2: Future of Packaging Materials - For large-scale production of structural substrates by 2028, glass substrates are expected to dominate, while diamond will play a crucial role in addressing AI computing bottlenecks [12][16]. - Glass substrates are favored for their high interconnect density capabilities, which are essential as AI chips evolve [14][15]. - Diamond is positioned as a critical component for thermal management in high-performance AI chips, expected to be integrated into packaging solutions alongside glass substrates [16][17]. Group 3: Addressing Thermal Management Challenges - The article outlines three key strategies for improving thermal management in glass substrates: vertical thermal vias, lateral heat diffusion enhancements, and integrated microfluidic cooling systems [19][20][21]. - Vertical thermal vias involve creating high-density copper pillar arrays to facilitate heat dissipation [19]. - Lateral heat diffusion can be enhanced by thickening metal layers on the substrate to improve thermal conductivity [20]. - Integrated microfluidics leverage the chemical properties of glass to create internal cooling channels, significantly improving heat management [21]. Group 4: Multi-Physics Co-Design in Chip Manufacturing - The article emphasizes the importance of multi-physics co-design in semiconductor manufacturing, integrating electrical, thermal, mechanical, and magnetic fields to optimize performance and reliability [22][29]. - The approach advocates for eliminating interface issues through hybrid bonding techniques, which enhance electrical, thermal, and mechanical properties [23][26]. - Material selection is evolving from traditional methods to computational approaches that balance multiple physical fields, ensuring optimal performance under high thermal loads [28][29].

Core Viewpoint - The company, Daoshijishu, highlights the advancements of its investee company, Chip Pei Sen, in server core computing units, emphasizing significant performance improvements over traditional CPU architectures [1] Group 1: Technology Advancements - The server core computing unit developed by Chip Pei Sen utilizes APU and a non-Von Neumann architecture, enabling high-speed calculations for molecular dynamics (MD) and density functional theory (DFT) [1] - Compared to traditional CPU architectures, the computing speed is enhanced by three orders of magnitude for MD and two orders of magnitude for DFT, while also demonstrating lower power consumption than conventional servers [1] Group 2: Business Applications - Chip Pei Sen has a clear commercial application plan and is currently engaging with key enterprises and research institutions in the fields of humanoid robotics and new energy materials [1] - The company advises stakeholders to refer to Chip Pei Sen's external disclosures for specific progress updates [1]